Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7VX330T-1FFG1157C FPGA | High-Performance Virtex-7 Series Device

Product Details

Product Description:

The Xilinx XC7VX330T-1FFG1157C is a cutting-edge FPGA (Field Programmable Gate Array) from the renowned Virtex-7 family, designed for demanding applications that require high processing power, exceptional speed, and extensive logic resources. This device is preferred by engineers and developers working on advanced digital systems, including telecommunications, data centers, aerospace, and video processing.

Built on a 28nm process technology, the XC7VX330T delivers an optimal balance between performance and power efficiency. It features a large number of logic cells, integrated memory blocks, and configurable I/O capabilities—making it ideal for complex designs such as high-speed interfaces, digital signal processing (DSP), and hardware acceleration.

One of the key advantages of the XC7VX330T is its robust architecture that supports high bandwidth and low latency, which is essential for modern applications demanding real-time performance. The device operates in the -1 speed grade, ensuring fast timing closure and reliable operation in challenging environments.

This FPGA’s package type — FFG1157 (Flip-Chip Fine-Pitch Ball Grid Array) — provides excellent thermal dissipation and signal integrity, crucial for high-frequency operations. Whether you are developing next-gen networking equipment, video transmission systems, or high-performance computing platforms, this Xilinx FPGA offers unmatched flexibility and scalability.

Explore the detailed technical specifications below to discover how the XC7VX330T can cater to your project’s needs.

For further information on a wide range of Xilinx FPGAs, visit the Xilinx FPGA page.


Technical Specifications of Xilinx XC7VX330T-1FFG1157C

Feature Specification
FPGA Family Virtex-7
Device Part Number XC7VX330T-1FFG1157C
Process Technology 28nm Xilinx UltraScale
Logic Cells (LUTs) 326,080
Flip-Flops 652,160
Block RAM (Kb) 52,920
DSP Slices 1,020
I/O Pins 600
Package Type FFG1157 (Flip-Chip Fine-Pitch BGA)
Speed Grade -1 (Fastest)
Core Voltage 1.0V
Supported I/O Standards LVDS, LVCMOS, HSTL, SSTL
Max Core Clock Frequency Up to 500 MHz
Temperature Range Commercial (0°C to 85°C)
Applications High-speed signal processing, telecom, aerospace, video, data center acceleration

Why Choose Xilinx XC7VX330T-1FFG1157C?

  • High Performance: Ultra-fast logic and DSP slices for data-intensive workloads.

  • Large Memory Capacity: Ample embedded block RAM supports complex buffering and memory management.

  • Flexible I/O Support: Excellent compatibility with various signaling standards for system integration.

  • Robust Packaging: FFG1157 package offers superior thermal and electrical performance.

  • Proven Reliability: Xilinx’s Virtex-7 silicon guarantees stability for mission-critical applications.

This FPGA empowers engineers to develop sophisticated hardware solutions that push the boundaries of speed and efficiency. Whether you are implementing complex algorithms or designing next-generation network processors, the XC7VX330T offers the scalability and performance to meet your demands.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.