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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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Xilinx XC7S75-2FGGA676I FPGA: Comprehensive Overview and Specifications

Product Details

Introduction to the Xilinx XC7S75-2FGGA676I

Are you seeking a high-performance, cost-effective programmable logic device for your next electronic assembly project? The Xilinx XC7S75-2FGGA676I is an outstanding choice for engineers and developers requiring robust logic capacity and exceptional I/O capabilities. Belonging to the renowned Spartan-7 FPGA family, this component is engineered on an advanced 28nm architecture, offering an ideal balance of power efficiency, system integration, and accelerated performance.

Why Choose the Spartan-7 Series?

The Spartan-7 FPGA family is specifically designed to provide essential connectivity and processing power while maintaining remarkably low power consumption. By incorporating a MicroBlaze™ soft processor that runs over 200 DMIPs with 800 Mb/s DDR3 support, devices like the XC7S75-2FGGA676I are uniquely positioned to bridge the gap between small form-factor, cost-sensitive designs and ultra-high-end signal processing applications.

Key Technical Specifications

To truly understand the capability of this component, it is essential to examine its core parameters. The following table provides a quick, scannable breakdown of the Xilinx XC7S75-2FGGA676I specifications:

Feature Specification
Manufacturer AMD / Xilinx
Series Spartan-7
Part Number XC7S75-2FGGA676I
Logic Elements/Cells 76,800
User I/O Pins 400
Embedded Block RAM 3,240 Kbit
Operating Voltage 0.95V – 1.05V
Operating Temperature -40°C to +100°C (Industrial Grade)
Package Type 676-FPBGA (27 x 27 mm)
Speed Grade -2

Optimized Performance for Complex Systems

With 76,800 logic cells and 400 user I/O pins, this FPGA delivers substantial logic density, giving hardware designers the precise flexibility needed to manage heavy processing workloads. Furthermore, this device seamlessly integrates discrete analog and monitoring circuitry, greatly reducing your overall Bill of Materials (BOM). When you utilize a high-quality Xilinx FPGA for your design, you unlock exceptional bandwidth, unmatched signal integrity, and streamlined scalability for advanced projects.

Benefits of Integrating the XC7S75-2FGGA676I

Implementing the XC7S75-2FGGA676I into your custom circuit board brings numerous operational advantages:

  • Industrial Temperature Tolerance: The “I” suffix indicates an industrial-grade operating range of -40°C to +100°C, making it highly reliable and stable in harsh thermal environments.

  • Abundant I/O Availability: A massive array of 400 configurable I/O pins provides vast interfacing capabilities, easily allowing you to connect a wide variety of sensors, external memory, and peripheral components.

  • Cost and Power Efficiency: The 28nm technology delivers up to a 50% lower total power consumption compared to the previous 45nm generation devices, entirely without compromising processing speed.

Perfect for Industrial and Edge Applications

Due to its unique combination of high speed and power efficiency, the XC7S75-2FGGA676I is frequently utilized in industrial automation, sensor fusion, embedded vision, and automotive control systems. In addition, its integrated security and monitoring capabilities make it highly effective for secure communications networks and precision machine control.

Summary

In conclusion, the Xilinx XC7S75-2FGGA676I stands as a highly versatile, reliable, and powerful programmable logic device. Whether you are scaling up complex industrial machinery or designing robust edge computing hardware, this Spartan-7 FPGA provides the essential digital infrastructure required to streamline your design process and significantly boost overall system performance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.