High-Performance Embedded Design with Xilinx XC7S75-1FGGA484Q
The Xilinx XC7S75-1FGGA484Q is a premier Field Programmable Gate Array (FPGA) within the AMD Xilinx Spartan-7 family. Engineered on a highly efficient 28nm high-k metal gate (HKMG) process, this programmable logic device offers a superb balance of high I/O performance, dense logic cell availability, and low power consumption. Designed explicitly for cost-sensitive, high-volume applications that refuse to compromise on signal processing capability, the XC7S75 series delivers exceptional density inside a space-saving footprint.
The automotive-grade “Q-grade” qualification ensures this IC reliably operates across an expanded temperature window from $-40^\circ\text{C}$ to $+125^\circ\text{C}$. This makes the microchip perfectly suited for harsh environments, edge computing, sensor fusion, and high-frequency communication modules.
Technical Specifications: Xilinx XC7S75-1FGGA484Q
To simplify your system architecture planning, the primary hardware parameters, memory structures, and environmental ratings for this specific Spartan-7 IC are outlined below.
Hardware Core Parameters
| Attribute |
Specification Details |
| Manufacturer |
AMD Xilinx |
| Series Component Family |
Spartan-7 |
| Base Part Number |
XC7S75 |
| Number of Logic Elements / Cells |
76,800 |
| Number of LABs / CLBs |
6,000 |
| Total Interleaved User I/O Count |
338 |
Memory & Voltage Ratings
| Attribute |
Specification Details |
| Total Embedded Block RAM Bits |
4,331,520 Bits (3,240 kbit) |
| Distributed RAM Capacity |
832 kbit |
| Operating Core Voltage Supply |
0.95V ~ 1.05V (1.0V Nominal) |
| I/O Operating Voltage Range |
1.2V to 3.3V |
Packaging & Temperature Thresholds
| Attribute |
Specification Details |
| Package / Case Profile |
484-FBGA (Fine-Pitch Ball Grid Array) |
| Supplier Device Dimensions |
484-FPBGA ($23 \times 23 \text{ mm}$, 1.0mm Ball Pitch) |
| Operating Temperature Range ($T_J$) |
$-40^\circ\text{C} \text{ to } +125^\circ\text{C}$ (Automotive Q-Grade) |
| Moisture Sensitivity Level (MSL) |
Level 3 (168 Hours Factory Floor Life) |
| Environmental Safety Standards |
ROHS3 Compliant |
Key Applications and Engineering Features
Optimized Embedded Processing with MicroBlaze
Deploying high-speed processing clusters is made simple via the MicroBlaze soft processor core. Developers can seamlessly scale multi-core configurations executing above 200 DMIPs with integrated 800 Mb/s DDR3 memory interfaces, speeding up system timing optimization.
Flexible Clocking & Advanced Security
Equipped with powerful Clock Management Tiles (CMT), the architecture pairs Mixed-Mode Clock Managers (MMCM) and Phase-Locked Loops (PLL) for ultra-low jitter signal distribution. Data privacy is preserved through 256-bit AES encryption alongside HMAC/SHA-256 bitstream authentication protocols.
Professional Turnkey SMT Assembly
Deploying a fine-pitch 484-BGA array with 338 I/Os requires exact substrate routing and advanced thermal profiling. For comprehensive engineering production layouts using this advanced chip, check out customized turnkey solutions through a certified Xilinx FPGA processing provider to ensure flawless, defect-free Surface Mount Technology (SMT) production.
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