Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7S50-1FTGB196C Spartan-7 FPGA: Technical Specs & Design Guide

Product Details

XC7S50-1FTGB196C: High-Performance Spartan-7 FPGA Overview

The Xilinx XC7S50-1FTGB196C is a standout member of the Spartan-7 family, specifically engineered to provide the optimal balance of performance, power efficiency, and cost-effectiveness for space-constrained applications. Built on the 28nm high-performance, low-power process technology, this Field-Programmable Gate Array (FPGA) is designed to meet the rigorous demands of modern industrial, automotive, and consumer electronics.

For engineers and designers looking to leverage programmable logic for specialized tasks, the XC7S50 offers a high logic-to-I/O ratio. It serves as an ideal solution for bridging interfaces, processing sensor data, or implementing custom control logic where power consumption and physical footprint are critical constraints.

Why Choose the XC7S50-1FTGB196C?

The Spartan-7 series is renowned for its reliability and long-term availability. The XC7S50-1FTGB196C specifically provides high-speed connectivity and robust processing capabilities in a compact FTGB196 package. Its architecture allows designers to maximize performance per watt, making it perfect for battery-powered or fanless industrial equipment.

Whether you are looking to accelerate signal processing or need a flexible platform to future-proof your hardware, integrating a Xilinx FPGA into your design ensures you have the reconfigurable power necessary to adapt to evolving standards and project requirements.

Technical Specifications

The table below outlines the core technical parameters for the XC7S50-1FTGB196C to help you determine if it fits your project architecture.

Feature Specification
Product Series Spartan-7
Part Number XC7S50-1FTGB196C
Logic Cells 52,160
CLB Flip-Flops 65,200
Total Block RAM 2,700 Kb
DSP Slices 120
I/O Pins 100
Operating Temperature 0°C to 85°C (Commercial)
Package Type FTGB196 (196-ball BGA)
Voltage (Core) 0.95V to 1.05V

Key Design Benefits

  • Small Form Factor: The 196-ball BGA package is optimized for designs where PCB real estate is at a premium.

  • High Logic Density: With over 52,000 logic cells, this device handles complex algorithms and multitasking with ease.

  • Power Efficiency: Optimized for 28nm, it significantly reduces static and dynamic power compared to previous-generation devices.

  • Ease of Integration: Supported by Xilinx’s industry-standard Vivado Design Suite, streamlining the development, simulation, and implementation cycle.

By choosing the XC7S50-1FTGB196C, you are selecting a proven, scalable, and versatile component that delivers high-end FPGA performance in a package designed for modern, compact electronic systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.