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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7S100-2FGGA484C FPGA: Specs, Features & Applications

Product Details

Overview of the Spartan-7 XC7S100-2FGGA484C

The Xilinx XC7S100-2FGGA484C addresses the demanding requirements of modern electronic system design. As the highest density offering in the cost-optimized Spartan-7 lineup, the XC7S100 variant provides massive logic capacity while maintaining a highly manageable physical footprint.

Superior Performance-Per-Watt

The “-2” speed grade designates this chip as a high-performance model within its series. It effectively bridges the gap between low-power operation and high-speed data processing. When you integrate a reliable Xilinx FPGA into your hardware architecture, you unlock advanced capabilities for industrial connectivity and embedded processing without exceeding your system’s thermal or power budgets. The “C” designation indicates a commercial operating temperature range, ensuring stable performance from 0°C up to +85°C.

Key Technical Specifications

To truly understand the full capability of this component, it is essential to review its core metrics. The following table provides a clear, comprehensive breakdown of the Xilinx XC7S100-2FGGA484C specifications.

Feature Specification
Manufacturer AMD / Xilinx
Series Spartan-7
Part Number XC7S100-2FGGA484C
Logic Elements (LEs) 102,400
User I/O Pins 338
Total Embedded RAM 4.3 Mbit
Operating Voltage 0.95V – 1.05V
Operating Temperature 0°C to +85°C (Commercial Grade)
Package Type 484-pin FBGA (23×23 mm)
Speed Grade -2 (High Performance)

Core Advantages and Architecture

Implementing this specific programmable logic IC brings several notable architectural advantages to your PCB assembly and overall product design.

Seamless Connectivity and Processing

Equipped with 338 user I/O pins, this FPGA offers immense flexibility for routing complex signals. It natively supports the MicroBlaze™ soft processor, capable of running over 200 DMIPs with robust 800Mb/s DDR3 memory support. This makes it incredibly efficient for handling intensive memory-bandwidth tasks.

Additionally, it features dedicated built-in security elements, including 256-bit AES encryption with HMAC/SHA-256 authentication, ensuring your proprietary IP and data remain fully protected. The integrated dual 12-bit Analog-to-Digital Converters (XADC) also allow for seamless on-chip thermal and supply sensing.

Target Applications

Because it offers an impressive 102,400 logic cells in a compact 23×23 mm footprint, the XC7S100-2FGGA484C is incredibly versatile. It is widely utilized across multiple fast-growing electronic sectors:

  • Industrial Automation: Ideal for complex motor control, machine vision, and precise sensor fusion applications.

  • Communications: Serves as an excellent bridge for any-to-any connectivity, high-speed data routing, and customized protocol bridging.

  • Medical & Diagnostic Equipment: The built-in XADC and high logic density make it perfect for precision monitoring and signal processing equipment.

By utilizing the Xilinx XC7S100-2FGGA484C, you guarantee that your next major engineering project will benefit from industry-leading logic capacity, flexible connectivity, and long-term component reliability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.