Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7S100-1FGGA676C FPGA: Complete Specifications and Overview

Product Details

Introduction to the XC7S100-1FGGA676C

As electronic designs become increasingly sophisticated, engineers require components that offer both speed and flexibility. The XC7S100-1FGGA676C provides exactly that. With its extensive logic capacity and large number of user I/Os, it is perfectly suited for complex computing applications. Whether you are scaling an existing product line or building an entirely new embedded system, integrating a premium Xilinx FPGA ensures superior processing power and long-term hardware reliability.

High Logic Density and I/O Flexibility

One of the standout features of the Xilinx XC7S100-1FGGA676C is its massive logic density. It boasts over 102,400 logic cells, providing ample room for advanced digital signal processing and complex algorithms. Furthermore, with 400 programmable user I/O pins, this chip offers unparalleled flexibility for interfacing with multiple sensors, memory modules, and peripheral devices simultaneously.

Power Efficiency and Compact Packaging

Despite its high computational power, this FPGA remains incredibly power-efficient. Operating at a core voltage between 0.95V and 1.05V, it significantly reduces the overall thermal footprint of your system. Packaged in a 676-pin FPBGA (Fine-Pitch Ball Grid Array) measuring 27×27 mm, it allows board designers to maintain high-density layouts without compromising on performance or heat dissipation.

Technical Specifications

To help you evaluate whether the XC7S100-1FGGA676C is the right fit for your printed circuit board project, please refer to the detailed technical specifications in the table below.

Feature Specification
Manufacturer AMD / Xilinx
Series Spartan-7
Part Number XC7S100-1FGGA676C
Logic Elements/Cells 102,400
Number of User I/O Pins 400
Total Embedded RAM 4,423,680 bits (~4.32 Mbit)
Operating Core Voltage 0.95V – 1.05V
Operating Temperature 0°C to +85°C (Commercial Grade)
Speed Grade -1
Package / Case Type 676-FPBGA (27×27 mm)
Mounting Style Surface Mount (SMD/SMT)

Ideal Applications and Use Cases

Because of its unique blend of low power consumption and high-speed processing capabilities, the Xilinx XC7S100-1FGGA676C is incredibly versatile. It is widely utilized across various modern industries, including:

  • Industrial Automation: Ideal for precise motor control, machine vision systems, and real-time processing in smart factories.

  • Telecommunications: Perfect for handling high-bandwidth data routing, protocol bridging, and secure network communications.

  • Consumer Electronics: Frequently utilized in advanced displays, high-definition video processing, and sophisticated IoT edge devices.

Elevate Your Next Design

In summary, the Xilinx XC7S100-1FGGA676C is an exceptional choice for developers who refuse to compromise on logic density and I/O flexibility. By incorporating this Spartan-7 series FPGA into your hardware, you gain the processing power necessary to tackle modern technological challenges. Its combination of a 28nm low-power process, over 100K logic cells, and 400 I/O pins makes it an indispensable, scalable component for any high-performance electronic assembly.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.