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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7A100T-3FGG676E Artix-7 FPGA – Specs, Datasheet & Buy Online

Product Details

Overview of the XC7A100T-3FGG676E

The XC7A100T-3FGG676E packs 101,440 logic cells, 240 DSP48E1 slices, and 4,860 Kb of block RAM into a compact 27 mm × 27 mm package. With 300 user I/Os and 8 integrated GTP transceivers running up to 6.6 Gb/s, it supports PCIe Gen2, DDR3, and other high-speed standards out of the box. The “-3” speed grade pushes internal fabric performance close to 628 MHz, while the “E” extended temperature grade ensures stable operation from 0 °C to 100 °C junction temperature.

Engineers building software-defined radios, machine vision systems, industrial controllers, and medical imaging boards rely on the XC7A100T-3FGG676E for its strong balance of capacity, speed, and power efficiency.

Key Features and Benefits

  • 28 nm HKMG fabric — up to 50% lower power than older 7-series predecessors.
  • Real 6-input LUT technology, configurable as distributed RAM or shift registers.
  • High-speed SelectIO with DDR3 support up to 1,066 Mb/s.
  • 8 GTP transceivers for PCIe Gen2 x4, SATA, JESD204B, and Aurora links.
  • 240 DSP48E1 slices with 25 × 18 multiplier, pre-adder, and 48-bit accumulator.
  • Integrated XADC with dual 12-bit 1 MSPS ADCs and on-chip thermal sensors.
  • Full Vivado Design Suite support, including the free WebPACK edition.

Technical Specifications

Logic and Memory Resources

Parameter Value
Manufacturer AMD / Xilinx
Family Artix-7
Logic Cells 101,440
Slices (CLBs) 15,850
LUTs / Flip-Flops 63,400 / 126,800
Block RAM 4,860 Kb (135 × 36 Kb)
Distributed RAM 1,188 Kb
DSP Slices (DSP48E1) 240
CMTs (MMCM + PLL) 6
Process Technology 28 nm HKMG
Core Voltage (V<sub>CCINT</sub>) 1.0 V

Package, I/O, and Connectivity

Parameter Value
Package FGG676 (FBGA, 27 × 27 mm, 1.0 mm pitch)
User I/O 300
GTP Transceivers 8 (up to 6.6 Gb/s)
PCIe Hard Block 1 × Gen2 (x1 / x2 / x4)
Memory Interface DDR3 / DDR3L up to 1,066 Mb/s
XADC 1 × dual 12-bit, 1 MSPS ADC
Speed Grade -3 (fastest commercial)
Temperature Grade E – Extended, T<sub>j</sub> 0 °C to 100 °C
Configuration Modes JTAG, SPI, BPI, Master/Slave SelectMAP
Security 256-bit AES + HMAC/SHA-256, SEU correction

Typical Applications of the XC7A100T-3FGG676E

This device suits a wide range of mid-to-high performance designs:

  • Software-defined radio and baseband processing
  • Machine vision cameras and industrial imaging
  • PLCs, motor control, and factory automation
  • Broadcast video and 4K processing
  • Medical ultrasound and diagnostic imaging
  • Test, measurement, and PCIe data acquisition cards

Why Source the XC7A100T-3FGG676E From PCBSync

We supply genuine, traceable Xilinx FPGA components with transparent date codes and short lead times. Whether you need a few units for prototyping or volume quantities for production, our team also provides PCB design, assembly, and Vivado-based programming support to accelerate your project from schematic to shipment.

Request a quote today for the XC7A100T-3FGG676E and get a response from a real FPGA engineer within one business day.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.