Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC2S200‑6FGG1415C FPGA Product Description

Product Details

Introduction to the XC2S200‑6FGG1415C FPGA

The Xilinx XC2S200‑6FGG1415C is a member of the Spartan‑II FPGA family, engineered for cost‑sensitive digital logic and embedded applications. These field‑programmable gate arrays provide designers with flexible reconfigurable logic, on‑chip RAM, and efficient I/O management—all in a compact package. Ideal for industrial automation, communications, and embedded systems, the XC2S200 series continues to deliver reliable performance in programmable hardware designs.

For a full portfolio of Xilinx FPGA products and additional resources, visit:
Xilinx FPGA LINK

Based on reference specifications from the official Spartan‑II product family page.
See the Spartan‑II FPGA family here: https://www.xilinx.com/products/silicon-devices/fpga/spartan-i.html


Key Specifications of XC2S200‑6FGG1415C

Technical Specifications Table

Specification Category Details
Device Family Spartan‑II FPGA
Model XC2S200‑6FGG1415C
Logic Capacity ~200,000 system gates
Configurable Logic Blocks (CLBs) Medium logic density
Total RAM Bits On‑chip distributed and block RAM
I/O Count High‑density I/O for flexible interfacing
Package Type Fine‑pitch BGA (FGG1415)
Speed Grade ‑6 (moderate performance)
Process Technology CMOS fabrication

Architecture and Design Features

Spartan‑II Core Architecture

The XC2S200 series is built around a versatile FPGA fabric that enables designers to implement custom logic, state machines, and data‑path functions. Key architectural features include:

Feature Description
Programmable Logic Blocks Reconfigurable logic cells for implementing digital circuits
Hierarchical Routing Efficient programmable interconnect for scalable designs
On‑Chip RAM Memory resources for buffering and data storage
Digital Clock Management DLL support for stable clock distribution

These features make the XC2S200‑6FGG1415C suitable for prototyping, real‑time signal processing, and control‑centric applications.


Electrical and Physical Characteristics

Power and I/O Specifications

Parameter Value
Core Voltage Standard Spartan‑II Vccint
I/O Voltage Range Supports multiple I/O standards
Operating Temperature Industrial and commercial ranges supported
Package Dimensions Compact 1415‑ball BGA for high‑density routing

The combination of robust I/O flexibility and industry‑standard power requirements ensures broad compatibility across system designs.


Target Applications

Typical Use Cases

The XC2S200‑6FGG1415C FPGA excels in applications where reconfigurability and cost efficiency are critical. Common application domains include:

  • Industrial Automation & Control Systems

  • Data Communications and Networking

  • Consumer Electronics Prototyping

  • Scientific and Measurement Instruments

  • Embedded System Acceleration

Its balance of logic resources and configurable I/O enables engineers to tailor hardware behavior to evolving product requirements.


Why Choose the XC2S200‑6FGG1415C FPGA?

Competitive Advantages

Benefit Description
Field Programmability Allows post‑deployment updates and feature additions
Cost‑Effective Logic Solution Lower cost than high‑end FPGAs for mid‑range designs
Versatile I/O Support Integrates with diverse peripheral standards
Proven Technology Base Established architecture with wide industry usage

These strengths make the XC2S200‑6FGG1415C FPGA a strong choice for embedded designers seeking a balance between performance and affordability.


Summary

The Xilinx XC2S200‑6FGG1415C is a flexible and reliable Spartan‑II FPGA designed for reconfigurable logic applications across industrial, communications, and embedded sectors. With a strong set of architectural features, adaptable electrical characteristics, and a cost‑effective profile, this FPGA supports both prototyping and production‑grade deployments. Its combination of logic capacity, on‑chip memory, and programmable I/O positions it as a valuable component in custom digital systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.