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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

xilinx Spartan‑I FPGA XC2S200‑6FGG1429C – High‑Performance, Cost‑Effective Logic Solution for Embedded and Custom Hardware Designs

Product Details

The XC2S200‑6FGG1429C is a member of the Xilinx Spartan‑I family — designed to offer optimized cost/performance and rapid time‑to‑market. Spartan‑I devices provide robust FPGA resources suitable for a range of applications, from consumer electronics to industrial automation.


📌 Key Features and Technical Highlights

💡 Core Logic and Architecture

Specification Details
FPGA Family Spartan‑I
Logic Cells 18,752
Configurable Logic Blocks (CLBs) 3,200
Maximum Speed Grade ‑6
Package FGG1429C (Fine Pitch Ball Grid Array)
Core Voltage 3.3 V

🔌 I/O and Performance

Parameter Value
Total I/O Pins 209
Maximum I/O Voltage 3.3 V
I/O Standards Supported TTL, LVCMOS
Peak System Frequency Up to 100 MHz (depending on design)

🧠 Why Choose the XC2S200‑6FGG1429C?

⭐ Balanced Logic and Power Efficiency

The XC2S200‑6FGG1429C delivers a solid logic density that supports a wide range of designs without the cost premium of higher‑end FPGAs. Its architecture emphasizes power‑efficient performance — particularly important in battery‑sensitive or low‑power environments.

🧩 Flexible I/O for Diverse Interfaces

With over 200 I/O pins supporting multiple voltage standards, this FPGA can interface with peripherals, memory devices, and custom protocols with ease. This flexibility helps designers avoid external translators or buffers in many cases.


⚙️ Typical Use Cases

  • Embedded system design – Real‑time control logic for industrial and consumer products

  • Communication interfaces – Custom protocol implementation and bridging

  • Hardware acceleration – Offloading compute tasks from microcontrollers or DSP engines

  • Prototyping and proof‑of‑concept designs – Rapid development before ASIC migration


📐 Package and Physical Characteristics

Feature Details
Package Type Fine Pitch BGA
Pins 1429
Mounting Style Surface Mount
Operating Temperature Range Industrial (–40 °C to +85 °C)

The fine‑pitch BGA package facilitates high‑density designs and reliable signal integrity, especially in high‑speed digital systems.


🛠 Design Support and Development

Xilinx offers a comprehensive development ecosystem — including ISE Design Suite for synthesis, simulation, and implementation — making it easier to integrate this FPGA into your workflow.

Designers also benefit from:

  • Reference designs

  • IP cores for common functions (e.g., memory controllers, UARTs, SPI)

  • Community support and documentation


📦 Summary — XC2S200‑6FGG1429C FPGA in a Nutshell

The Xilinx Spartan‑I XC2S200‑6FGG1429C FPGA is a versatile, cost‑effective logic device offering:

✅ Ample logic for mid‑range applications
✅ Flexible I/O and voltage support
✅ A robust development ecosystem
✅ Industrial temperature support
✅ Proven reliability from Xilinx

Whether you’re prototyping or building production hardware, this FPGA delivers a compelling mix of performance and efficiency.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.