The XCZU9EG-3FFVC900E is a premium System-on-Chip (SoC) from the AMD-Xilinx Zynq UltraScale+ MPSoC family. This advanced FPGA device combines powerful ARM processing cores with high-performance programmable logic, making it ideal for demanding applications in 5G wireless, automotive ADAS, industrial automation, and AI/machine learning.
XCZU9EG-3FFVC900E Overview and Key Features
The XCZU9EG-3FFVC900E belongs to the EG (Embedded Graphics) variant of the Zynq UltraScale+ MPSoC lineup. Built on cutting-edge 16nm FinFET+ process technology, this device delivers exceptional performance-per-watt for compute-intensive embedded applications.
Why Choose the XCZU9EG-3FFVC900E?
This SoC FPGA offers a unique combination of heterogeneous processing capabilities:
- Quad-core ARM Cortex-A53 application processor running at up to 1.3GHz
- Dual-core ARM Cortex-R5 real-time processor operating at up to 533MHz
- ARM Mali-400 MP2 graphics processing unit for embedded graphics applications
- 599,550 programmable logic cells for custom hardware acceleration
- Speed Grade -3 (highest performance tier available)
XCZU9EG-3FFVC900E Technical Specifications
Programmable Logic Resources
| Parameter |
Specification |
| Logic Cells |
599,550 |
| CLB Look-Up Tables (LUTs) |
274,080 |
| CLB Flip-Flops |
548,160 |
| DSP48E2 Slices |
2,520 |
| Block RAM (36Kb Blocks) |
912 |
| Block RAM Capacity |
32.1 Mb |
| UltraRAM Blocks |
80 |
| UltraRAM Capacity |
22.5 Mb |
| Maximum Distributed RAM |
8.4 Mb |
Processing System Specifications
| Component |
Details |
| Application Processor (APU) |
Quad-core ARM Cortex-A53 MPCore with CoreSight |
| APU Clock Speed |
Up to 1.3 GHz |
| Real-Time Processor (RPU) |
Dual-core ARM Cortex-R5 with CoreSight |
| RPU Clock Speed |
Up to 533 MHz |
| Graphics Processing Unit |
ARM Mali-400 MP2 |
| L1 Cache |
32KB I-Cache + 32KB D-Cache per A53 core |
| L2 Cache |
1MB shared |
High-Speed Connectivity
| Interface |
Specification |
| GTH Transceivers |
Up to 24 channels |
| GTH Data Rate |
Up to 16.3 Gb/s |
| PS-GTR Transceivers |
4 channels |
| PCIe Support |
Gen2 x4 / Gen3 x4 |
| USB 3.0 |
Dual controllers |
| DisplayPort |
1.2a compliant |
| SATA 3.1 |
Dual ports |
Package and Electrical Characteristics
| Parameter |
Value |
| Part Number |
XCZU9EG-3FFVC900E |
| Package Type |
FFVC900 (Flip-Chip Fine-Pitch BGA) |
| Pin Count |
900 pins |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Core Voltage (VCCINT) |
0.90V |
| Speed Grade |
-3 (Highest Performance) |
| Temperature Grade |
Extended (E): 0°C to 100°C |
| Process Technology |
16nm FinFET+ |
| RoHS Compliance |
Yes |
XCZU9EG-3FFVC900E Applications and Use Cases
5G Wireless Infrastructure
The XCZU9EG-3FFVC900E excels in 5G base station implementations. Its high-speed GTH transceivers and DSP resources enable efficient beamforming, MIMO processing, and baseband acceleration.
Advanced Driver Assistance Systems (ADAS)
Automotive engineers leverage this MPSoC for sensor fusion, object detection, and real-time decision-making in autonomous vehicle platforms. The combination of ARM processing and FPGA fabric enables parallel processing of camera, radar, and LiDAR data.
Industrial Internet of Things (IIoT)
For industrial automation and smart factory applications, the XCZU9EG-3FFVC900E provides deterministic real-time control through its Cortex-R5 processors while the A53 cores handle high-level communication and analytics.
Artificial Intelligence and Machine Learning
The extensive DSP slice array (2,520 slices) and programmable logic make this device ideal for neural network inference acceleration, enabling edge AI applications with low latency and high throughput.
Video and Image Processing
With the integrated Mali-400 MP2 GPU and substantial Block RAM resources, this SoC supports 4K video processing, machine vision systems, and professional broadcast equipment.
XCZU9EG-3FFVC900E Memory Architecture
On-Chip Memory Hierarchy
The Zynq UltraScale+ architecture features a sophisticated memory subsystem:
| Memory Type |
Capacity |
Key Features |
| Block RAM |
32.1 Mb |
Dual-port, 36Kb blocks with ECC support |
| UltraRAM |
22.5 Mb |
High-density 288Kb blocks, cascadable |
| Distributed RAM |
8.4 Mb |
Integrated within CLB SliceM elements |
| OCM (On-Chip Memory) |
256 KB |
Low-latency processor-accessible memory |
External Memory Support
| Interface |
Supported Standards |
| DDR4 |
Up to 2,400 Mb/s |
| LPDDR4 |
Up to 2,133 Mb/s |
| DDR3/DDR3L |
Up to 1,866 Mb/s |
| QSPI Flash |
Quad-SPI configuration |
| eMMC |
Version 4.51 |
| SD/SDIO |
Version 3.0 |
XCZU9EG-3FFVC900E Security Features
The XCZU9EG-3FFVC900E incorporates comprehensive security mechanisms for protecting intellectual property and sensitive data:
- AES-256/GCM encryption for bitstream protection
- SHA-384 authentication
- RSA-4096 public key authentication
- eFUSE key storage
- Secure Boot with TrustZone technology
- Device DNA unique identifier
Development Tools and Software Support
AMD Vivado Design Suite
The XCZU9EG-3FFVC900E is fully supported by the Vivado Design Suite, providing:
- RTL synthesis and implementation
- IP Integrator for system-level design
- High-Level Synthesis (HLS) for C/C++ to RTL conversion
- Integrated Logic Analyzer for debugging
Vitis Unified Software Platform
For software development, the Vitis platform offers:
- Embedded software development for ARM cores
- AI inference optimization with Vitis AI
- Hardware acceleration libraries
- OpenCL and C/C++ kernel development
XCZU9EG-3FFVC900E Ordering Information
| Order Code |
Speed Grade |
Temperature Range |
Package |
| XCZU9EG-3FFVC900E |
-3 (Fastest) |
Extended (0°C to 100°C) |
900-pin FCBGA |
| XCZU9EG-2FFVC900E |
-2 |
Extended |
900-pin FCBGA |
| XCZU9EG-1FFVC900E |
-1 |
Extended |
900-pin FCBGA |
| XCZU9EG-2FFVC900I |
-2 |
Industrial (-40°C to 100°C) |
900-pin FCBGA |
Related Zynq UltraScale+ MPSoC Devices
For projects requiring different resource levels, consider these alternatives in the FFVC900 package:
| Part Number |
Logic Cells |
DSP Slices |
Block RAM |
| XCZU6EG-3FFVC900E |
340,000 |
1,728 |
25.3 Mb |
| XCZU9EG-3FFVC900E |
599,550 |
2,520 |
32.1 Mb |
| XCZU15EG-3FFVC900E |
747,000 |
3,528 |
50.6 Mb |
Buy XCZU9EG-3FFVC900E and Xilinx FPGA Components
Looking for reliable Xilinx FPGA components? Our extensive inventory includes the XCZU9EG-3FFVC900E and the complete Zynq UltraScale+ MPSoC family. We offer competitive pricing, technical support, and fast worldwide shipping for all your FPGA procurement needs.
Frequently Asked Questions
What is the difference between XCZU9EG and XCZU9CG?
The XCZU9EG (EG variant) includes the ARM Mali-400 MP2 GPU, while the XCZU9CG (CG variant) omits the GPU. Choose the EG variant for applications requiring embedded graphics processing.
What does the -3 speed grade mean?
The -3 speed grade indicates the highest performance tier. These devices operate at 0.90V core voltage and offer the fastest clock frequencies and lowest propagation delays within the XCZU9EG family.
Is the XCZU9EG-3FFVC900E suitable for automotive applications?
While the extended temperature grade (-3E) covers 0°C to 100°C, automotive applications typically require the industrial (-I) or automotive (-Q) temperature grades. Consider the XCZU9EG-2FFVC900I for automotive deployments.
What programming interface does this device use?
The XCZU9EG-3FFVC900E supports JTAG programming, Quad-SPI boot, SD card boot, and USB boot modes. The Configuration Security Unit (CSU) manages secure boot operations.
