The XCZU9EG-3FFVB1156E is a high-performance System-on-Chip (SoC) from the AMD Xilinx Zynq UltraScale+ MPSoC family. This advanced programmable device combines a powerful 64-bit quad-core ARM Cortex-A53 processor with industry-leading FPGA programmable logic, making it ideal for AI, machine learning, 5G wireless, and embedded vision applications. With the highest -3 speed grade and extended temperature range, this IC delivers exceptional performance for demanding industrial and commercial designs.
XCZU9EG-3FFVB1156E Key Features and Benefits
The XCZU9EG-3FFVB1156E Zynq UltraScale+ MPSoC offers an unmatched combination of processing power and programmable flexibility. Engineers choose this device for applications requiring heterogeneous computing, real-time control, and hardware acceleration in a single integrated solution.
Heterogeneous Processing System Architecture
This MPSoC integrates multiple processing elements to handle diverse workloads efficiently:
- Quad-core ARM Cortex-A53 application processor running up to 1.5GHz
- Dual-core ARM Cortex-R5F real-time processor at up to 600MHz
- Mali-400 MP2 graphics processing unit for display applications
- Advanced cache coherency and memory management unit support
High-Performance Programmable Logic Resources
The XCZU9EG delivers substantial FPGA resources for custom hardware acceleration:
- 599K+ System Logic Cells for complex digital designs
- 2,520 DSP Slices for signal processing and AI inference
- 32.1 Mb Block RAM and 8.8 Mb Distributed RAM
- Up to 24 GTH Transceivers supporting 16.3 Gb/s data rates
XCZU9EG-3FFVB1156E Technical Specifications
| Parameter |
Specification |
| Manufacturer Part Number |
XCZU9EG-3FFVB1156E |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Zynq UltraScale+ MPSoC EG |
| Device Type |
System-on-Chip (SoC) IC |
| Process Technology |
16nm FinFET+ |
| Speed Grade |
-3 (Highest Performance) |
| Temperature Grade |
E (Extended: -40°C to +100°C) |
| Package Type |
1156-FCBGA |
| Package Dimensions |
35mm × 35mm |
| Ball Pitch |
1.0mm |
| RoHS Status |
Compliant |
XCZU9EG-3FFVB1156E Programmable Logic Specifications
| Resource |
Quantity |
| System Logic Cells |
599,550 |
| CLB Flip-Flops |
548,160 |
| CLB Look-Up Tables (LUTs) |
274,080 |
| DSP48E2 Slices |
2,520 |
| Block RAM (36Kb each) |
912 Blocks |
| Total Block RAM |
32.1 Mb |
| Distributed RAM |
8.8 Mb |
| Clock Management Tiles (CMT) |
4 |
| Maximum HP I/O Pins |
208 |
| Maximum HD I/O Pins |
120 |
Processing System Specifications
| Feature |
Description |
| Application Processor |
Quad-core ARM Cortex-A53 (64-bit) |
| APU Clock Speed |
Up to 1.5 GHz |
| Real-Time Processor |
Dual-core ARM Cortex-R5F (32-bit) |
| RPU Clock Speed |
Up to 600 MHz |
| GPU |
ARM Mali-400 MP2 |
| On-Chip Memory |
256 KB OCM |
| L1 Cache (per A53 core) |
32 KB I-Cache + 32 KB D-Cache |
| L2 Cache (shared) |
1 MB |
| External Memory Interface |
DDR4, DDR3, DDR3L, LPDDR4 |
High-Speed Connectivity and I/O Interfaces
The XCZU9EG-3FFVB1156E provides comprehensive connectivity options for modern system designs:
Integrated High-Speed Interfaces
| Interface |
Specification |
| PS-GTR Transceivers |
4× supporting up to 6.0 Gb/s |
| PL GTH Transceivers |
Up to 24× at 16.3 Gb/s |
| PCIe |
Gen2 ×4 |
| USB 3.0 |
2× SuperSpeed ports |
| USB 2.0 |
2× High-Speed ports |
| SATA |
3.1 compliant |
| DisplayPort |
1.2a, 4K support |
| Gigabit Ethernet |
4× Tri-mode MACs |
General-Purpose Peripherals
- 2× UART, 2× CAN 2.0B, 2× I2C, 2× SPI
- SD/SDIO 3.0 controller
- NAND Flash controller
- Quad SPI Flash controller
- 78 Multiplexed I/O (MIO) pins
- 96 Extended MIO (EMIO) through PL
XCZU9EG-3FFVB1156E Part Number Decoder
Understanding the AMD Xilinx part number helps engineers select the right device variant:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU |
Zynq UltraScale+ |
| 9 |
Device Size (Logic Density) |
| EG |
Device Variant (EG = with GPU) |
| -3 |
Speed Grade (Fastest) |
| FF |
Flip-Chip, Fine-pitch Package |
| VB |
Package Body Size Code |
| 1156 |
Ball Count |
| E |
Extended Temperature Range |
Target Applications for XCZU9EG-3FFVB1156E
The XCZU9EG-3FFVB1156E excels in applications demanding high computational throughput, real-time processing, and system integration:
Industrial and Embedded Systems
- 5G Wireless Infrastructure – Baseband processing and beamforming
- Next-Gen ADAS – Sensor fusion and object detection
- Industrial Automation – Motor control and machine vision
- Medical Imaging – Ultrasound and CT/MRI processing
Data Center and Networking
- Network Acceleration – Packet processing at 100G+
- Video Transcoding – Real-time 4K/8K encoding
- Storage Controllers – NVMe and RAID acceleration
AI and Machine Learning
- Edge AI Inference – CNN and DNN acceleration
- Computer Vision – Object recognition and tracking
- Embedded Vision – Smart camera systems
Development Tools and Software Support
AMD provides comprehensive development resources for the XCZU9EG:
- Vivado Design Suite – FPGA synthesis, implementation, and debug
- Vitis Unified Platform – Application development and AI tools
- PetaLinux – Embedded Linux distribution
- Xilinx Runtime (XRT) – Standardized runtime for acceleration
Why Choose XCZU9EG-3FFVB1156E for Your Design
The XCZU9EG-3FFVB1156E stands out as a premier choice for system architects requiring:
- Maximum Performance – The -3 speed grade delivers the fastest timing specifications
- Extended Temperature Operation – Reliable from -40°C to +100°C
- Integrated Processing – ARM processors + FPGA fabric reduce BOM and board space
- Future-Proof Architecture – 16nm FinFET+ technology with long-term availability
- Scalability – Pin-compatible with other Zynq UltraScale+ devices
Related Zynq UltraScale+ MPSoC Devices
| Part Number |
Logic Cells |
DSP Slices |
Block RAM |
| XCZU7EG-FFVB1156 |
504K |
1,728 |
28.3 Mb |
| XCZU9EG-3FFVB1156E |
599K |
2,520 |
32.1 Mb |
| XCZU11EG-FFVC1156 |
649K |
2,928 |
33.4 Mb |
| XCZU15EG-FFVB1156 |
747K |
3,528 |
41.4 Mb |
Order XCZU9EG-3FFVB1156E Today
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Frequently Asked Questions About XCZU9EG-3FFVB1156E
What is the difference between XCZU9EG and XCZU9CG?
The XCZU9EG includes the ARM Mali-400 MP2 GPU for graphics and display applications, while the XCZU9CG variant excludes the GPU. Both devices share identical programmable logic resources.
What does the -3 speed grade mean?
The -3 speed grade represents the fastest timing specifications available for the XCZU9EG family. It offers approximately 15-20% better performance compared to the -1 speed grade, ideal for maximum clock frequency designs.
Is the XCZU9EG-3FFVB1156E suitable for automotive applications?
The “E” suffix indicates Extended temperature range (-40°C to +100°C). For automotive-grade requirements, consider the XCZU9EG variants with “I” (Industrial) or “Q” (Automotive AEC-Q100) qualifications.
What memory types does the XCZU9EG support?
The Processing System supports DDR4 (up to 2400 MT/s), DDR3/DDR3L, and LPDDR4. The Programmable Logic can interface with additional memory through HP and HD I/O banks.