The XCZU9EG-2FFVB1156I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This powerful embedded processor combines quad-core ARM Cortex-A53 application processing, dual-core ARM Cortex-R5 real-time processing, ARM Mali-400 MP2 graphics, and advanced 16nm FinFET+ programmable logic in a single 1156-pin FCBGA package. Designed for industrial-grade applications, the XCZU9EG-2FFVB1156I delivers exceptional computing power for AI, machine learning, 5G wireless, ADAS, and embedded vision systems.
XCZU9EG-2FFVB1156I Key Features and Benefits
The XCZU9EG-2FFVB1156I stands out as a versatile heterogeneous computing platform. It integrates processing system (PS) and programmable logic (PL) through high-speed AXI interconnects, enabling unprecedented flexibility for complex embedded designs.
Why Choose XCZU9EG-2FFVB1156I for Your Design?
- Heterogeneous Multi-Processing Architecture – Combines application, real-time, and graphics processing in one chip
- Industrial Temperature Range – Operates reliably from -40°C to +100°C
- 599K+ Logic Cells – Massive programmable logic resources for custom hardware acceleration
- 16nm FinFET+ Technology – Superior power efficiency and performance
- Rich Connectivity Options – Supports PCIe, USB 3.0, SATA, DisplayPort, Gigabit Ethernet
XCZU9EG-2FFVB1156I Technical Specifications
General Device Information
| Parameter |
Specification |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCZU9EG-2FFVB1156I |
| Product Family |
Zynq UltraScale+ MPSoC EG Series |
| Device Type |
System On Chip (SoC) with FPGA |
| Package Type |
1156-Pin FCBGA (35mm × 35mm) |
| Speed Grade |
-2 (Standard Performance) |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| Process Technology |
16nm FinFET+ |
| Core Voltage (VCCINT) |
0.85V |
XCZU9EG-2FFVB1156I Processing System Specifications
The processing system delivers powerful computing capabilities through multiple ARM processor cores working in harmony.
Application Processing Unit (APU)
| Feature |
Specification |
| Core Architecture |
Quad-core ARM Cortex-A53 MPCore |
| Maximum Frequency |
1.5 GHz |
| Instruction Set |
64-bit ARMv8-A |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| L2 Cache |
1MB Shared |
| Features |
NEON SIMD, Single/Double Precision FPU, CoreSight Debug |
Real-Time Processing Unit (RPU)
| Feature |
Specification |
| Core Architecture |
Dual-core ARM Cortex-R5F |
| Maximum Frequency |
533 MHz |
| Instruction Set |
32-bit ARMv7-R |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| TCM |
128KB per core |
| Features |
Single/Double Precision FPU, CoreSight Debug, Lock-step Mode |
Graphics Processing Unit (GPU)
| Feature |
Specification |
| Core Architecture |
ARM Mali-400 MP2 |
| Maximum Frequency |
600 MHz |
| API Support |
OpenGL ES 1.1/2.0, OpenVG 1.1 |
| Pixel Fill Rate |
Up to 1.2 Gpixel/s |
XCZU9EG-2FFVB1156I Programmable Logic Resources
The FPGA fabric provides extensive resources for custom hardware implementation and acceleration.
| Resource |
Quantity |
| System Logic Cells |
599,550 |
| CLB Flip-Flops |
548,160 |
| CLB LUTs |
274,080 |
| Distributed RAM (Mb) |
8.8 |
| Block RAM (Mb) |
32.1 |
| Block RAM (36Kb each) |
912 |
| UltraRAM (Mb) |
0 |
| DSP Slices |
2,520 |
| Global Clock Buffers |
4 |
| Maximum HP I/O |
96 |
| Maximum HD I/O |
66 |
Memory and Storage Interface Support
| Interface Type |
Specification |
| On-Chip Memory |
256KB with ECC |
| DDR4 Support |
Up to 2400 Mbps, 64-bit |
| DDR3/DDR3L Support |
Up to 1866 Mbps |
| LPDDR4 Support |
Up to 4266 Mbps |
| LPDDR3 Support |
Up to 2133 Mbps |
| Quad-SPI Flash |
Dual Quad-SPI x8 |
| NAND Flash |
8-bit ONFI 3.1 |
| eMMC |
4.51 Compliant |
High-Speed Connectivity Interfaces
| Interface |
Specification |
| PCIe |
Gen2 x4 (Root/Endpoint) |
| USB 3.0 |
2× SuperSpeed 5 Gbps |
| USB 2.0 |
2× High-Speed 480 Mbps |
| SATA |
3.1 (6 Gbps) |
| DisplayPort |
1.2a (4K @ 30fps) |
| Gigabit Ethernet |
4× Tri-mode (10/100/1000 Mbps) |
| CAN |
2× CAN 2.0B |
| UART |
2× Full-featured |
| I2C |
2× Master/Slave |
| SPI |
2× Master/Slave |
| GPIO |
4× 32-bit banks |
XCZU9EG-2FFVB1156I Target Applications
The XCZU9EG-2FFVB1156I excels in demanding applications requiring heterogeneous computing, real-time processing, and hardware acceleration:
Industrial and Automotive
- Advanced Driver Assistance Systems (ADAS) – Sensor fusion, object detection, lane departure warning
- Industrial IoT Gateways – Edge computing, protocol conversion, predictive maintenance
- Motor Control Systems – High-performance servo drives, robotics controllers
- Machine Vision – Real-time image processing, quality inspection
Communications and Networking
- 5G Wireless Infrastructure – Baseband processing, beamforming, MIMO
- Software-Defined Radio (SDR) – Wideband signal processing, spectrum analysis
- Packet Processing – Network security appliances, load balancers, firewalls
- Test and Measurement Equipment – High-speed data acquisition, protocol analyzers
AI and Machine Learning
- Edge AI Inference – CNN acceleration, object recognition, natural language processing
- Embedded Vision – Autonomous vehicles, drones, surveillance systems
- Medical Imaging – Ultrasound processing, CT/MRI reconstruction
XCZU9EG-2FFVB1156I Development Tools and Ecosystem
AMD Xilinx provides comprehensive development support for the XCZU9EG-2FFVB1156I:
Software Development Tools
| Tool |
Purpose |
| Vivado Design Suite |
FPGA synthesis, implementation, timing analysis |
| Vitis Unified Platform |
Software development, AI/ML acceleration |
| PetaLinux |
Embedded Linux development |
| Vitis AI |
Deep learning inference optimization |
Evaluation and Development Boards
- ZCU102 Evaluation Kit – Full-featured development platform
- ZCU104 Evaluation Kit – Embedded vision and AI applications
- Third-party boards – ALINX AXU9EG, various industrial carriers
XCZU9EG-2FFVB1156I Ordering Information
| Order Code |
Description |
| XCZU9EG-2FFVB1156I |
Industrial temp, -2 speed grade, 1156 FCBGA |
| XCZU9EG-2FFVB1156E |
Extended temp, -2 speed grade, 1156 FCBGA |
| XCZU9EG-1FFVB1156I |
Industrial temp, -1 speed grade, 1156 FCBGA |
| XCZU9EG-3FFVB1156E |
Extended temp, -3 speed grade (highest performance) |
Related Xilinx FPGA Products
Looking for other Zynq UltraScale+ MPSoC devices or Xilinx FPGA solutions? Explore our complete selection of Xilinx FPGA products to find the perfect component for your embedded system design.
Frequently Asked Questions About XCZU9EG-2FFVB1156I
What is the difference between XCZU9EG-2FFVB1156I and XCZU9EG-2FFVB1156E?
The “I” suffix indicates Industrial temperature grade (-40°C to +100°C), while “E” indicates Extended temperature grade (-40°C to +100°C) with additional screening. Both share identical electrical specifications.
What speed grade is the XCZU9EG-2FFVB1156I?
The “-2” in the part number indicates a standard speed grade. Speed grades range from -1 (lowest) to -3E (highest performance). The -2 grade provides an optimal balance between performance and power consumption.
Does XCZU9EG-2FFVB1156I include a GPU?
Yes, the EG variant includes an ARM Mali-400 MP2 GPU supporting OpenGL ES 1.1/2.0 and OpenVG 1.1, making it ideal for applications requiring graphics processing or display output.
What is the maximum DDR4 speed supported?
The XCZU9EG-2FFVB1156I supports DDR4 memory at speeds up to 2400 Mbps with 64-bit interface, providing ample bandwidth for demanding applications.
Which development board supports XCZU9EG?
The AMD Xilinx ZCU102 Evaluation Kit is the primary development platform. Third-party options include ALINX AXU9EG and various industrial-grade carrier boards.
Conclusion
The XCZU9EG-2FFVB1156I represents the pinnacle of heterogeneous embedded computing, seamlessly integrating powerful ARM processors, flexible FPGA fabric, and comprehensive I/O in a single device. Whether you’re developing 5G infrastructure, autonomous systems, AI-enabled edge devices, or industrial automation solutions, this Zynq UltraScale+ MPSoC delivers the performance, flexibility, and reliability your application demands.
