Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU9EG-1FFVC900I: AMD Xilinx Zynq UltraScale+ MPSoC System on Chip

Product Details

The XCZU9EG-1FFVC900I is a high-performance System on Chip (SoC) from the AMD Xilinx Zynq UltraScale+ MPSoC family. This advanced embedded processor combines powerful quad-core ARM Cortex-A53 application processing with real-time ARM Cortex-R5 capabilities and over 599K programmable logic cells. Designed for industrial-grade applications, this Xilinx FPGA delivers exceptional performance for demanding embedded systems, edge computing, and high-speed data processing applications.


XCZU9EG-1FFVC900I Key Features and Benefits

The XCZU9EG-1FFVC900I MPSoC represents a breakthrough in heterogeneous computing architecture. This device seamlessly integrates multiple processing units with programmable logic fabric, enabling designers to implement custom hardware accelerators alongside software-based processing.

Heterogeneous Multi-Processing Architecture

The Zynq UltraScale+ architecture in the XCZU9EG-1FFVC900I provides:

  • 64-bit processor scalability with virtualization support
  • Combination of soft and hard engines for graphics, video, waveform, and packet processing
  • Software-centric boot approach similar to ASSPs
  • Separate power domains for PS and PL enabling advanced power management

Advanced Security Features

Built-in security processing capabilities include trusted boot, secure boot, and cryptographic acceleration functions essential for modern embedded applications.


XCZU9EG-1FFVC900I Technical Specifications

Processing System Specifications

Parameter Specification
Part Number XCZU9EG-1FFVC900I
Manufacturer AMD (Xilinx)
Family Zynq UltraScale+ MPSoC EG Series
Application Processor (APU) Quad-core ARM Cortex-A53 MPCore with CoreSight
Real-Time Processor (RPU) Dual-core ARM Cortex-R5 with CoreSight
Graphics Processing Unit ARM Mali-400 MP2
Max APU Frequency 1.2 GHz
Max RPU Frequency 600 MHz
Architecture 64-bit ARM v8

Programmable Logic Resources

Resource Specification
System Logic Cells 599,550+
Technology Node 20nm
CLB Flip-Flops Available
CLB LUTs Available
DSP Slices Integrated for signal processing acceleration
Block RAM High-capacity on-chip memory
UltraRAM High-density dual-port synchronous memory
Distributed RAM Configurable memory resources

Package and Electrical Specifications

Parameter Value
Package Type 900-FCBGA
Package Dimensions 31mm x 31mm
Ball Pitch 1.0mm
Speed Grade -1 (Industrial)
Core Voltage (VCCINT) 0.85V
Temperature Range -40°C to +100°C (TJ)
Temperature Grade Industrial (I)
Mounting Type Surface Mount
RoHS Status Compliant

XCZU9EG-1FFVC900I Interface and Connectivity

High-Speed Serial Transceivers

The XCZU9EG-1FFVC900I integrates GTH transceivers supporting high-speed serial communication protocols with data rates optimized for demanding applications.

Peripheral Interfaces

Interface Type Description
USB USB 2.0/3.0 OTG Controllers
Ethernet Gigabit Ethernet MAC
PCIe PCI Express Integration
SATA AHCI ver. 1.3 Compliant
CAN CAN 2.0B (ISO11898-1)
I2C Inter-Integrated Circuit Interface
SPI Serial Peripheral Interface
UART/USART Universal Asynchronous Receiver/Transmitter
MMC/SD/SDIO Memory Card Interfaces
GPIO Up to 78 MIO + 96 EMIO pins

Memory Interface Support

Memory Type Support
DDR4 High-speed DDR4 controller
LPDDR4 Low-power DDR4 support
NAND Flash NAND controller included
eMMC SD/eMMC controller
Quad SPI Configuration and storage

XCZU9EG-1FFVC900I Applications

Industrial Automation and Control

The XCZU9EG-1FFVC900I excels in industrial automation applications requiring:

  • Real-time motor control and sensor fusion
  • Machine vision and image processing
  • Industrial networking and protocol conversion
  • Predictable low-latency response times

Automotive Systems

Designed for automotive-grade reliability, this MPSoC supports:

  • Advanced Driver Assistance Systems (ADAS)
  • In-vehicle infotainment systems
  • Vehicle networking gateways
  • Sensor data processing

Aerospace and Defense

Critical defense applications benefit from:

  • Software-defined radio implementations
  • Radar and signal processing
  • Secure communications
  • Electronic warfare systems

Data Center and High-Performance Computing

Enterprise applications include:

  • Network acceleration and packet processing
  • Video transcoding and streaming
  • AI/ML inference acceleration
  • Storage acceleration

5G Wireless and Telecommunications

Telecommunications infrastructure applications:

  • 5G baseband processing
  • Wireless backhaul systems
  • Network function virtualization
  • Edge computing nodes

XCZU9EG-1FFVC900I Development Tools

AMD Vivado Design Suite

The primary development environment for the XCZU9EG-1FFVC900I includes:

  • Vivado HLS for high-level synthesis
  • IP Integrator for system design
  • Device configuration and programming
  • Timing analysis and implementation tools

Software Development

Tool Purpose
Vitis Unified software platform
PetaLinux Embedded Linux development
SDK Bare-metal application development
FSBL First Stage Boot Loader

XCZU9EG-1FFVC900I Part Number Decoder

Understanding the XCZU9EG-1FFVC900I part number structure:

Code Meaning
XC Xilinx Commercial
ZU Zynq UltraScale+
9 Device density identifier
EG With Graphics (Mali GPU included)
-1 Speed Grade (-1 standard)
FF Flip-chip fine-pitch BGA
V Lead-free package
C900 900-ball package
I Industrial temperature range

XCZU9EG-1FFVC900I Ordering Information

Attribute Details
Manufacturer Part Number XCZU9EG-1FFVC900I
Manufacturer AMD (formerly Xilinx)
Product Category Embedded – System On Chip (SoC)
Series Zynq UltraScale+ MPSoC
Packaging Tray
Product Status Active

Why Choose XCZU9EG-1FFVC900I for Your Design?

Scalable Performance

The XCZU9EG-1FFVC900I offers exceptional scalability from simple control applications to complex heterogeneous computing workloads. The combination of 64-bit ARM processors with extensive programmable logic enables optimization for specific application requirements.

Power Efficiency

With 20nm process technology and separate power domains, designers can implement sophisticated power management strategies, including complete PL power-down while maintaining PS operation.

Future-Proof Investment

The Zynq UltraScale+ platform provides footprint compatibility across the device family, enabling seamless migration to higher or lower density devices as requirements evolve.

Comprehensive Ecosystem

Industry-leading development tools, extensive documentation, reference designs, and a large user community support rapid product development and time-to-market optimization.


Related Zynq UltraScale+ MPSoC Devices

Part Number Logic Cells GPU Package Options
XCZU7EG ~500K Mali-400 MP2 FFVC1156, FFVF1517
XCZU9EG 599K+ Mali-400 MP2 FFVC900, FFVB1156
XCZU11EG ~600K+ Mali-400 MP2 FFVB1156, FFVC1760
XCZU15EG ~700K+ Mali-400 MP2 FFVB1156

Conclusion

The XCZU9EG-1FFVC900I represents AMD Xilinx’s commitment to delivering powerful, flexible, and reliable embedded processing solutions. With its combination of quad-core ARM Cortex-A53 processors, real-time ARM Cortex-R5 cores, Mali-400 GPU, and over 599,000 logic cells, this Zynq UltraScale+ MPSoC provides the foundation for next-generation embedded systems across industrial, automotive, aerospace, telecommunications, and data center applications.

For engineers seeking a balance of processing power, programmable logic resources, and industrial-grade reliability, the XCZU9EG-1FFVC900I delivers exceptional value and performance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.