The XCZU9EG-1FFVC900E is a high-performance System-on-Chip (SoC) from AMD (formerly Xilinx), belonging to the powerful Zynq UltraScale+ MPSoC EG family. This advanced programmable logic device combines a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processor, ARM Mali-400 MP2 GPU, and 599K+ FPGA logic cells in a single 900-pin FC-BGA package. Designed for demanding applications including 5G wireless infrastructure, embedded vision, machine learning, and industrial automation, this Xilinx FPGA delivers exceptional processing power and flexibility.
XCZU9EG-1FFVC900E Key Specifications Overview
| Parameter |
Specification |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCZU9EG-1FFVC900E |
| Family |
Zynq UltraScale+ MPSoC EG |
| Category |
System On Chip (SOC) IC |
| Process Technology |
20nm |
| Package |
900-FCBGA (31mm x 31mm) |
| Speed Grade |
-1 |
| Temperature Range |
Extended (0°C to +100°C TJ) |
| Core Voltage |
0.95V |
| RoHS Status |
Compliant |
XCZU9EG-1FFVC900E Processing System Architecture
The XCZU9EG-1FFVC900E features a sophisticated heterogeneous multiprocessing architecture that delivers exceptional computational performance for complex embedded applications.
Application Processing Unit (APU)
| Component |
Details |
| Processor Core |
Quad-core ARM Cortex-A53 MPCore with CoreSight |
| Architecture |
64-bit ARMv8 |
| Maximum Frequency |
Up to 1.2 GHz |
| L1 Cache |
32KB I-Cache + 32KB D-Cache per core |
| L2 Cache |
1MB shared |
| Features |
NEON SIMD, Cryptographic Extensions |
Real-Time Processing Unit (RPU)
| Component |
Details |
| Processor Core |
Dual-core ARM Cortex-R5F with CoreSight |
| Architecture |
32-bit ARMv7-R |
| Maximum Frequency |
Up to 600 MHz |
| Operating Modes |
Lock-step or Split mode |
| Features |
Floating-point unit, Tightly Coupled Memory |
Graphics Processing Unit (GPU)
| Component |
Details |
| GPU Core |
ARM Mali-400 MP2 |
| Maximum Frequency |
Up to 500 MHz |
| OpenGL Support |
OpenGL ES 1.1 and 2.0 |
| Pixel Throughput |
1.6 Gpixels/s |
XCZU9EG-1FFVC900E Programmable Logic Resources
The programmable logic (PL) section of the XCZU9EG-1FFVC900E provides extensive FPGA resources for implementing custom hardware accelerators and interfaces.
FPGA Logic and Memory Specifications
| Resource |
Quantity |
| System Logic Cells |
599,550 (599K+) |
| CLB Flip-Flops |
548,160 |
| CLB LUTs |
274,080 |
| DSP Slices |
2,520 |
| Block RAM |
32.1 Mb |
| Distributed RAM |
8.8 Mb (Max) |
| On-Chip Memory (OCM) |
256 KB |
DSP Slice Features
The 2,520 DSP48E2 slices in the XCZU9EG-1FFVC900E include:
- 27 × 18 bit signed multipliers
- 48-bit accumulator with 96-bit XOR function
- Pre-adder for symmetric filter optimization
- Pattern detector for convergent rounding
- Built-in cascade for efficient filter implementation
XCZU9EG-1FFVC900E Connectivity and I/O Features
High-Speed Serial Transceivers
| Interface Type |
Specification |
| PS-GTR Transceivers |
4 lanes (up to 6 Gb/s) |
| PL-GTH Transceivers |
Available (up to 16.3 Gb/s) |
| PCIe Support |
Gen2 x4 |
| USB Support |
USB 3.0 and USB 2.0 |
| SATA Support |
SATA 3.1 |
| DisplayPort |
1.2a compliant |
General Purpose I/O
| I/O Type |
Quantity |
| Total User I/Os |
204 |
| HP (High-Performance) I/O |
Voltage range 1.0V – 1.8V |
| HD (High-Density) I/O |
Voltage range 1.2V – 3.3V |
| I/O Standards |
LVCMOS, LVDS, HSTL, SSTL, MIPI |
XCZU9EG-1FFVC900E Package Information
Physical Specifications
| Parameter |
Value |
| Package Type |
900-FCBGA (Fine-Pitch BGA) |
| Package Dimensions |
31mm × 31mm |
| Ball Pitch |
1.0mm |
| Ball Count |
900 |
| Mounting Type |
Surface Mount |
| Moisture Sensitivity Level |
MSL-3 |
XCZU9EG-1FFVC900E Ordering Information
Part Number Breakdown
| Segment |
Meaning |
| XC |
Xilinx Commercial |
| ZU9 |
Zynq UltraScale+ Device Size |
| EG |
EG Variant (with GPU) |
| -1 |
Speed Grade (-1 Standard) |
| FF |
Flat/Flip-chip Package |
| VC |
Package Code |
| 900 |
Pin Count |
| E |
Extended Temperature Range |
Available Speed Grades
| Speed Grade |
Performance Level |
| -3E |
Highest Performance |
| -2 |
High Performance |
| -1 |
Standard Performance |
XCZU9EG-1FFVC900E Target Applications
The XCZU9EG-1FFVC900E is optimized for demanding applications requiring heterogeneous processing capabilities:
Industrial and Automation
- Industrial motor control systems
- Programmable logic controllers (PLC)
- Sensor fusion and real-time processing
- Factory automation equipment
Communications and Networking
- 5G wireless infrastructure
- Software-defined radio (SDR)
- Network packet processing
- High-speed data exchange
Embedded Vision and AI
- Machine learning inference acceleration
- Computer vision and image processing
- Advanced driver assistance systems (ADAS)
- Video analytics and surveillance
Aerospace and Defense
- Radar and signal processing
- Electronic warfare systems
- Secure communications
- Avionics computing
XCZU9EG-1FFVC900E Development Tools and Support
Software and Design Tools
| Tool |
Purpose |
| Vivado Design Suite |
FPGA synthesis, implementation, and programming |
| Vitis Unified Software |
Application development and acceleration |
| PetaLinux |
Embedded Linux development |
| Xilinx SDK |
Software development for ARM processors |
Documentation Resources
- Zynq UltraScale+ MPSoC Data Sheet (DS891)
- UltraScale Architecture Overview (DS890)
- Technical Reference Manual (UG1085)
- PCB Design Guide (UG583)
Why Choose XCZU9EG-1FFVC900E for Your Design?
The XCZU9EG-1FFVC900E delivers an exceptional combination of processing power, programmable logic resources, and connectivity options that make it ideal for next-generation embedded systems:
- Heterogeneous Computing: Combines ARM application processors, real-time processors, GPU, and FPGA fabric in a single device
- High Performance: 599K+ logic cells and 2,520 DSP slices enable complex algorithm implementation
- Power Efficiency: 20nm FinFET process technology delivers optimal performance-per-watt
- Extensive Connectivity: Built-in support for PCIe, USB 3.0, SATA, DisplayPort, and Gigabit Ethernet
- Security Features: Integrated secure boot, encryption, and authentication capabilities
- Industrial-Ready: Extended temperature range operation for harsh environments
XCZU9EG-1FFVC900E Technical Summary
The XCZU9EG-1FFVC900E represents the pinnacle of AMD’s Zynq UltraScale+ MPSoC technology, offering engineers a versatile platform for implementing sophisticated embedded systems. With its quad-core ARM Cortex-A53 application processor operating at up to 1.2GHz, dual ARM Cortex-R5 real-time processors, integrated Mali-400 MP2 GPU, and 599K+ programmable logic cells, this device delivers the processing power and flexibility required for modern industrial, communications, and embedded vision applications.
The 900-FCBGA package with extended temperature range certification ensures reliable operation in demanding environments, while comprehensive development tools and documentation support rapid product development cycles.
