Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU9EG-1FFVB1156I: AMD Xilinx Zynq UltraScale+ MPSoC FPGA System-on-Chip

Product Details

The XCZU9EG-1FFVB1156I is a high-performance System-on-Chip (SoC) from the AMD Xilinx Zynq UltraScale+ MPSoC family. This industrial-grade FPGA integrates powerful ARM processors with advanced programmable logic, making it an ideal solution for demanding applications in artificial intelligence, 5G wireless, automotive ADAS, and industrial automation.

Built on 16nm FinFET+ technology, the XCZU9EG-1FFVB1156I delivers exceptional processing power while maintaining energy efficiency. Engineers and designers choose this component for applications requiring real-time processing, hardware acceleration, and flexible I/O configurations.


XCZU9EG-1FFVB1156I Key Features and Benefits

The XCZU9EG-1FFVB1156I stands out among Xilinx FPGA devices for its comprehensive feature set that combines processing system (PS) and programmable logic (PL) capabilities.

Heterogeneous Processing Architecture

This MPSoC features a heterogeneous multi-processing architecture that includes:

  • Quad-core ARM Cortex-A53 Application Processing Unit running at up to 1.5 GHz
  • Dual-core ARM Cortex-R5F Real-time Processing Unit operating at 600 MHz
  • ARM Mali-400 MP2 Graphics Processing Unit for display and graphics workloads
  • Platform Management Unit for system control and monitoring

Advanced Programmable Logic Resources

The programmable logic section of the XCZU9EG-1FFVB1156I offers substantial resources for implementing custom hardware accelerators and digital logic.


XCZU9EG-1FFVB1156I Technical Specifications

Processor System Specifications

Parameter Specification
Application Processing Unit Quad-core ARM Cortex-A53 MPCore with CoreSight
APU Clock Speed Up to 1.5 GHz
Real-time Processing Unit Dual-core ARM Cortex-R5F with CoreSight
RPU Clock Speed Up to 600 MHz
Graphics Processing Unit ARM Mali-400 MP2
GPU Clock Speed Up to 667 MHz
L1 Cache (per A53 core) 32 KB I-Cache + 32 KB D-Cache
L2 Cache (shared APU) 1 MB
Floating Point Single & Double Precision
NEON SIMD Engine Yes

Programmable Logic Specifications

Resource Quantity
System Logic Cells 599,550
CLB Look-Up Tables (LUTs) 274,080
CLB Flip-Flops 548,160
DSP Slices 2,520
Block RAM Blocks 912
Block RAM (Mb) 32.1
UltraRAM Blocks 0
Maximum Distributed RAM (Mb) 8.8

Memory Interface Specifications

Feature Specification
DDR Memory Controller DDR3, DDR3L, DDR4, LPDDR3, LPDDR4
DDR Width Up to 64-bit with ECC
Maximum DDR Speed 2400 Mb/s
PS DDR Interface 64-bit
PL DDR Interface Configurable

XCZU9EG-1FFVB1156I Package and Electrical Characteristics

Package Information

Parameter Specification
Package Type 1156-FCBGA (Flip Chip Ball Grid Array)
Package Dimensions 35mm x 35mm
Ball Pitch 1.0 mm
Total Balls 1156
Package Code FFVB1156

Electrical Characteristics

Parameter Value
Core Voltage (VCCINT) 0.85V typical
Process Technology 16nm FinFET+
Speed Grade -1 (Standard)
Temperature Grade Industrial (-40°C to +100°C)
Operating Temperature -40°C to +100°C

XCZU9EG-1FFVB1156I I/O and Connectivity Features

High-Speed Serial Transceivers

Transceiver Type Quantity Maximum Data Rate
GTH Transceivers 24 16.3 Gb/s
GTR Transceivers 4 6.0 Gb/s

I/O Bank Configuration

I/O Type Maximum Available
HP (High Performance) I/O 208
HD (High Density) I/O 120
PS MIO Pins 78
PS DDR I/O 64
Total User I/O 312

Integrated Hard IP Blocks

Interface Quantity Specification
PCIe Gen2 2 x4 lanes each
USB 3.0 2 5 Gb/s
USB 2.0 2 480 Mb/s
Gigabit Ethernet 4 RGMII/SGMII
SATA 3.1 2 6 Gb/s
DisplayPort 1.2a 1 2 lanes, up to 5.4 Gb/s
SPI 2 Quad SPI Flash support
I2C 2 Master/Slave
UART 2 Up to 1 Mb/s
CAN 2.0B 2 1 Mb/s
GPIO 78 Via MIO

XCZU9EG-1FFVB1156I Part Number Breakdown

Understanding the part number structure helps identify the exact device variant:

Segment Value Description
XC XC Xilinx Commercial
ZU ZU Zynq UltraScale+
9 9 Device Size (9th tier)
EG EG EG Variant (APU + RPU + GPU)
-1 -1 Speed Grade (-1 Standard)
FF FF Flip-Chip Package
VB VB Lid Style/Variation
1156 1156 Pin Count
I I Industrial Temperature Range

XCZU9EG-1FFVB1156I Target Applications

The XCZU9EG-1FFVB1156I is engineered for high-performance embedded applications across multiple industries:

Industrial and Automation Applications

  • Industrial Internet of Things (IIoT) gateways
  • Motor control and servo drives
  • Machine vision and inspection systems
  • Programmable Logic Controller (PLC) platforms
  • Robotics and motion control

Communications and Networking

  • 5G wireless infrastructure (baseband, radio units)
  • Software-defined radio (SDR)
  • Network packet processing
  • Video encoding and streaming
  • Data center acceleration

Automotive and Transportation

  • Advanced Driver Assistance Systems (ADAS)
  • Surround view camera systems
  • LiDAR and radar processing
  • In-vehicle infotainment (IVI)
  • Autonomous driving platforms

Aerospace and Defense

  • Electronic warfare systems
  • Radar signal processing
  • Secure communications
  • Avionics computing
  • SIGINT applications

Medical and Healthcare

  • Medical imaging systems (CT, MRI, ultrasound)
  • Patient monitoring equipment
  • Surgical robotics
  • Diagnostic instrumentation

AI and Machine Learning

  • Edge inference acceleration
  • Neural network implementation
  • Real-time object detection
  • Natural language processing acceleration

XCZU9EG-1FFVB1156I Development Support

Recommended Development Tools

Tool Purpose
AMD Vivado Design Suite FPGA design, synthesis, implementation
AMD Vitis Unified Software Platform Software development, AI acceleration
PetaLinux Tools Embedded Linux development
Vitis AI Deep learning inference optimization

Compatible Evaluation Kits

The ZCU102 Evaluation Kit featuring the XCZU9EG-2FFVB1156 is the recommended development platform for prototyping designs targeting the XCZU9EG-1FFVB1156I.


XCZU9EG-1FFVB1156I Ordering Information

Attribute Value
Manufacturer AMD (formerly Xilinx)
Manufacturer Part Number XCZU9EG-1FFVB1156I
Product Family Zynq UltraScale+ MPSoC
Device Variant EG (with GPU)
Lifecycle Status Active
RoHS Compliance RoHS Compliant
Moisture Sensitivity Level MSL-3
Lead-Free Soldering Compatible
Packaging Tray

Why Choose the XCZU9EG-1FFVB1156I Zynq UltraScale+ MPSoC?

The XCZU9EG-1FFVB1156I offers several compelling advantages for system designers:

Integrated Solution: Combining quad-core ARM Cortex-A53 processors, dual-core real-time processors, GPU, and extensive programmable logic eliminates the need for multiple discrete components, reducing board complexity and BOM cost.

Industrial Temperature Range: The -I suffix indicates industrial temperature rating (-40°C to +100°C), ensuring reliable operation in harsh environments.

Scalable Architecture: The Zynq UltraScale+ architecture allows software and hardware workloads to be partitioned optimally, with critical functions implemented in programmable logic for deterministic timing.

Security Features: Built-in encryption engines (AES-GCM 256), secure boot, and anti-tamper features protect intellectual property and ensure system integrity.

Long-term Availability: AMD commits UltraScale+ devices through 2045, providing long product lifecycle support for embedded designs.


XCZU9EG-1FFVB1156I Summary Specifications Table

Category Specification
Part Number XCZU9EG-1FFVB1156I
Manufacturer AMD (Xilinx)
Product Family Zynq UltraScale+ MPSoC
Core Type Quad ARM Cortex-A53 + Dual ARM Cortex-R5F
GPU ARM Mali-400 MP2
Logic Cells 599,550
LUTs 274,080
DSP Slices 2,520
Block RAM 32.1 Mb (912 blocks)
Transceivers 24x GTH (16.3 Gb/s) + 4x GTR (6 Gb/s)
Package 1156-FCBGA (35x35mm)
Process 16nm FinFET+
Temperature Range Industrial (-40°C to +100°C)
Speed Grade -1 (Standard)
Voltage 0.85V VCCINT

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.