The XCZU7EV-3FFVF1517E is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC EV family. This advanced programmable device combines powerful ARM processors with cutting-edge FPGA fabric, delivering exceptional performance for demanding embedded applications. Built on 16nm FinFET+ technology, the XCZU7EV-3FFVF1517E offers the fastest speed grade (-3) and extended temperature operation, making it ideal for industrial, automotive, and video processing applications.
XCZU7EV-3FFVF1517E Key Features and Benefits
The XCZU7EV-3FFVF1517E stands out in the Xilinx FPGA market as a versatile multiprocessor system-on-chip. This device integrates heterogeneous processing capabilities with programmable logic, enabling system-level differentiation and design flexibility that traditional FPGAs or processors alone cannot achieve.
Why Choose the XCZU7EV-3FFVF1517E?
This Zynq UltraScale+ MPSoC EV device provides engineers with several competitive advantages. The integrated video codec unit (VCU) supports H.264/H.265 encoding and decoding at up to 4K60 resolution. Combined with the ARM Mali-400 MP2 GPU, this makes the XCZU7EV-3FFVF1517E particularly well-suited for embedded vision, multimedia streaming, and advanced driver assistance systems (ADAS).
XCZU7EV-3FFVF1517E Technical Specifications
Processing System Architecture
| Specification |
Details |
| Application Processor |
Quad-core ARM Cortex-A53 MPCore (up to 1.5 GHz) |
| Real-Time Processor |
Dual-core ARM Cortex-R5F (up to 533 MHz) |
| Graphics Processing Unit |
ARM Mali-400 MP2 |
| Video Codec Unit |
H.264/H.265 (4K60 encode/decode) |
| L1 Cache (A53) |
32KB Instruction / 32KB Data |
| L2 Cache |
1MB Shared |
| Floating Point |
Single & Double Precision (NEON) |
Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
504,000+ |
| CLB Flip-Flops |
460,800 |
| CLB LUTs |
230,400 |
| Distributed RAM |
6.2 Mb |
| Block RAM |
11 Mb (36Kb blocks) |
| UltraRAM |
27 Mb |
| DSP Slices |
1,728 |
High-Speed Connectivity
| Interface |
Specification |
| GTH Transceivers |
20 channels @ 16.3 Gb/s |
| PS-GTR Transceivers |
4 channels @ 6.0 Gb/s |
| PCIe Hard Block |
Gen1/Gen2/Gen3/Gen4 x4 |
| USB |
USB 2.0 (Host/Device/OTG) |
| Ethernet |
Gigabit Ethernet MAC |
| DisplayPort |
Integrated controller |
I/O Capabilities
| I/O Type |
Configuration |
| HP I/O Banks |
6 banks, 312 pins (1.0V – 1.8V) |
| HD I/O Banks |
2 banks, 48 pins (1.2V – 3.3V) |
| MIO Pins |
78 multiplexed I/O |
| PS I/O |
214 pins |
XCZU7EV-3FFVF1517E Package Information
Physical Specifications
| Parameter |
Value |
| Package Type |
1517-FCBGA (Fine-pitch Ball Grid Array) |
| Package Dimensions |
40mm x 40mm |
| Ball Pitch |
1.0mm |
| Ball Count |
1517 |
| Speed Grade |
-3 (Highest Performance) |
| Temperature Grade |
E (Extended: 0°C to +100°C) |
Part Number Breakdown
Understanding the XCZU7EV-3FFVF1517E part number helps identify key specifications:
- XC – Xilinx Commercial
- ZU7 – Zynq UltraScale+ device, size 7
- EV – EV variant (with Video Codec Unit)
- -3 – Speed grade 3 (fastest)
- FF – FF package type
- VF – Voltage/thermal characteristics
- 1517 – 1517-ball BGA
- E – Extended temperature range
XCZU7EV-3FFVF1517E Applications
The XCZU7EV-3FFVF1517E MPSoC excels in multiple demanding application areas:
Embedded Vision and Video Processing
The integrated VCU makes this device ideal for 4K video streaming, surveillance systems, medical imaging equipment, and broadcast applications. The H.264/H.265 codec delivers real-time encoding and decoding without consuming precious FPGA resources.
Automotive and ADAS
Automotive engineers leverage the XCZU7EV-3FFVF1517E for camera-based safety systems, sensor fusion, and in-vehicle infotainment. The extended temperature rating ensures reliable operation across harsh automotive environments.
Industrial Automation and Robotics
The combination of real-time ARM Cortex-R5F processors and programmable logic enables precise motor control, machine vision inspection, and industrial IoT gateway implementations.
5G Wireless and Communications
High-speed GTH transceivers and substantial DSP resources make the XCZU7EV-3FFVF1517E suitable for wireless infrastructure, software-defined radio, and network acceleration.
Artificial Intelligence and Machine Learning
The massive parallel processing capability of 1,728 DSP slices combined with 27 Mb of UltraRAM enables efficient neural network inference at the edge.
Memory Architecture of XCZU7EV-3FFVF1517E
On-Chip Memory Resources
The XCZU7EV-3FFVF1517E provides an extensive on-chip memory hierarchy designed for high-bandwidth, low-latency data access:
| Memory Type |
Capacity |
Features |
| Block RAM |
11 Mb |
36Kb dual-port blocks with ECC |
| UltraRAM |
27 Mb |
288Kb blocks, cascadable |
| Distributed RAM |
6.2 Mb |
LUT-based, fastest access |
| OCM (PS) |
256 KB |
On-chip memory in PS |
| TCM (R5F) |
256 KB |
Tightly-coupled memory |
External Memory Support
The processing system supports multiple external memory interfaces:
- DDR4/DDR3/DDR3L SDRAM (64-bit with ECC)
- LPDDR4/LPDDR3 (32-bit)
- QSPI Flash (dual quad-mode)
- NAND Flash
- SD/eMMC
XCZU7EV-3FFVF1517E Development Tools and Support
Software Development Environment
AMD Xilinx provides comprehensive development tools for the XCZU7EV-3FFVF1517E:
| Tool |
Purpose |
| Vivado Design Suite |
FPGA development and synthesis |
| Vitis Unified Platform |
Software and AI development |
| PetaLinux |
Embedded Linux distribution |
| Vitis AI |
Machine learning deployment |
Operating System Support
The quad-core Cortex-A53 processor enables robust OS support including Linux (kernel 5.x+), FreeRTOS for the R5F cores, and bare-metal development for performance-critical applications.
XCZU7EV-3FFVF1517E vs. Similar Devices
Comparison with Other Zynq UltraScale+ Variants
| Feature |
XCZU7EV |
XCZU7EG |
XCZU7CG |
| Logic Cells |
504K |
504K |
504K |
| Video Codec |
✓ |
✗ |
✗ |
| GPU |
✓ |
✓ |
✗ |
| DSP Slices |
1,728 |
1,728 |
1,728 |
| UltraRAM |
27 Mb |
27 Mb |
27 Mb |
The “EV” designation indicates inclusion of the video codec unit, making XCZU7EV devices optimal for multimedia applications.
Power Management Features
The XCZU7EV-3FFVF1517E incorporates sophisticated power management capabilities:
- Separate PS and PL power domains
- Dynamic power scaling
- Low-power sleep modes
- Power-on reset sequencing
- Voltage monitoring via System Monitor
These features enable designs that optimize performance-per-watt while meeting thermal constraints in compact enclosures.
Security Features
Enterprise and industrial applications require robust security. The XCZU7EV-3FFVF1517E includes:
| Security Feature |
Description |
| Secure Boot |
RSA-4096 authentication |
| Encryption |
256-bit AES-GCM |
| Key Storage |
eFUSE and BBRAM options |
| Anti-Tamper |
Physical unclonable function |
| TrustZone |
ARM TrustZone technology |
Ordering Information
Available Variants
| Part Number |
Speed |
Temperature |
Package |
| XCZU7EV-3FFVF1517E |
-3 |
Extended |
1517 FCBGA |
| XCZU7EV-2FFVF1517E |
-2 |
Extended |
1517 FCBGA |
| XCZU7EV-2FFVF1517I |
-2 |
Industrial |
1517 FCBGA |
| XCZU7EV-1FFVF1517I |
-1 |
Industrial |
1517 FCBGA |
Compliance and Certifications
- RoHS Compliant (2011/65/EU, 2015/863)
- REACH Compliant
- ECCN: 5A002.A.4
- HTS Code: 8542.39.0001
Summary
The XCZU7EV-3FFVF1517E represents the pinnacle of AMD Xilinx’s Zynq UltraScale+ MPSoC EV family. With 504K+ logic cells, 1,728 DSP slices, integrated H.264/H.265 video codec, quad-core ARM Cortex-A53, and 20 high-speed GTH transceivers, this device delivers unmatched capability for embedded vision, automotive ADAS, industrial automation, and AI inference applications. The -3 speed grade ensures maximum performance while the extended temperature rating guarantees reliability in demanding environments.
Engineers seeking a powerful SoC FPGA solution with integrated video processing will find the XCZU7EV-3FFVF1517E to be an exceptional choice that reduces system complexity, accelerates time-to-market, and enables next-generation embedded designs.
