The XCZU7EV-3FFVC1156E is a high-performance System on Chip (SoC) from the Xilinx Zynq UltraScale+ MPSoC family. This advanced embedded processor combines a powerful quad-core ARM Cortex-A53 with programmable logic, delivering exceptional performance for AI, 5G, and industrial applications. With over 504K logic cells and a -3 speed grade for maximum performance, this FPGA is engineered for demanding embedded computing workloads.
XCZU7EV-3FFVC1156E Key Features and Benefits
The Zynq UltraScale+ XCZU7EV-3FFVC1156E represents the pinnacle of heterogeneous computing technology. This EV-series device integrates a video codec engine alongside the processing system and programmable logic fabric.
Processing System Architecture
The XCZU7EV-3FFVC1156E features a sophisticated dual-architecture processing system:
- Quad ARM Cortex-A53 MPCore – 64-bit application processors running at up to 1.5GHz
- Dual ARM Cortex-R5 – Real-time processors operating at 600MHz
- ARM Mali-400 MP2 – Integrated GPU for graphics acceleration
- 256KB On-Chip RAM – High-speed embedded memory
Programmable Logic Resources
This Zynq UltraScale+ FPGA delivers substantial programmable logic capabilities:
- 504K+ Logic Cells – Extensive resources for complex designs
- 20nm FinFET Technology – Advanced process for optimal power efficiency
- High-Speed Transceivers – Support for multi-gigabit serial interfaces
XCZU7EV-3FFVC1156E Technical Specifications
| Specification |
Value |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Type |
EV (with Video Codec) |
| Architecture |
MCU + FPGA |
| Core Processor |
Quad ARM Cortex-A53, Dual ARM Cortex-R5 |
| Logic Cells |
504K+ |
| RAM Size |
256KB |
| Application Processor Speed |
1.5GHz |
| Real-Time Processor Speed |
600MHz |
| Process Technology |
20nm |
| Core Voltage (VCCINT) |
0.90V |
| Operating Temperature |
0°C to 100°C (TJ) |
| Package Type |
1156-FCBGA |
| Package Dimensions |
35mm x 35mm |
| RoHS Compliant |
Yes |
XCZU7EV-3FFVC1156E Speed Grade and Performance
The “-3” speed grade designation indicates highest performance within the XCZU7EV family. Understanding speed grade options helps engineers select the optimal device:
| Speed Grade |
VCCINT Voltage |
Performance Level |
Temperature Options |
| -3E |
0.90V |
Highest Performance |
Extended (E) |
| -2E / -2I |
0.85V |
Standard Performance |
Extended (E), Industrial (I) |
| -1E / -1I |
0.85V |
Standard Performance |
Extended (E), Industrial (I) |
| -2LE |
0.85V / 0.72V |
Low Power |
Extended (E) |
| -1LI |
0.85V / 0.72V |
Low Power |
Industrial (I) |
The “E” suffix indicates Extended temperature range operation, making the XCZU7EV-3FFVC1156E suitable for commercial and extended industrial environments.
Connectivity and Interface Options
The XCZU7EV-3FFVC1156E provides comprehensive connectivity for modern embedded systems:
Communication Interfaces
| Interface Type |
Description |
| Ethernet |
High-speed networking support |
| USB OTG |
USB On-The-Go functionality |
| CANbus |
Automotive and industrial communication |
| I2C |
Low-speed peripheral connectivity |
| SPI |
High-speed serial peripheral interface |
| UART/USART |
Serial communication |
| MMC/SD/SDIO |
Storage card interfaces |
| EBI/EMI |
External bus/memory interfaces |
Integrated Peripherals
- DMA Controller – Direct Memory Access for efficient data transfer
- WDT (Watchdog Timer) – System reliability and recovery
XCZU7EV-3FFVC1156E Application Areas
The versatility of the Zynq UltraScale+ XCZU7EV-3FFVC1156E makes it ideal for numerous industries:
Artificial Intelligence and Machine Learning
Leverage the programmable logic for neural network acceleration alongside ARM processors for system management.
5G Wireless Infrastructure
High-speed transceivers and processing capabilities support next-generation telecommunications equipment.
Industrial Automation and Control
Real-time ARM Cortex-R5 cores enable deterministic control loops critical for automation systems.
Medical Imaging Equipment
Video codec engine and high-bandwidth interfaces support advanced imaging applications.
Automotive ADAS Systems
Temperature-rated operation and reliable performance for advanced driver assistance systems.
Cloud Computing and Data Centers
Accelerate workloads with hardware-level customization and parallel processing.
Consumer Electronics
Integrated GPU and video codec enable multimedia applications.
Internet of Things (IoT)
Flexible connectivity options support IoT gateway and edge computing designs.
XCZU7EV-3FFVC1156E Package Information
| Package Parameter |
Specification |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Ball Count |
1156 Balls |
| Package Dimensions |
35mm x 35mm |
| Ball Pitch |
1.0mm |
| Package Code |
FFVC1156 |
| Mounting Type |
Surface Mount |
PCB Design Considerations
When designing with the XCZU7EV-3FFVC1156E, engineers should follow Xilinx recommended PCB design rules for BGA packages, including proper via placement, power plane design, and thermal management strategies.
Development Tools for XCZU7EV-3FFVC1156E
Xilinx provides comprehensive development support through:
Vivado Design Suite
The primary FPGA/SoC development environment offering synthesis, implementation, and debugging capabilities for the Zynq UltraScale+ platform.
PetaLinux Tools
Linux-based software development framework optimized for Zynq devices.
Vitis Unified Software Platform
Accelerated application development using C/C++ for heterogeneous computing.
Why Choose XCZU7EV-3FFVC1156E for Your Design?
The XCZU7EV-3FFVC1156E offers several compelling advantages:
- Highest Speed Grade – The -3E designation ensures maximum performance
- Integrated Video Codec – EV-series includes H.264/H.265 encode/decode
- Heterogeneous Computing – ARM processors plus FPGA fabric in single device
- Power Efficiency – 20nm FinFET technology balances performance and power
- Comprehensive I/O – Wide range of standard interfaces
- Scalable Platform – Pin-compatible options within Zynq UltraScale+ family
XCZU7EV-3FFVC1156E Ordering Information
| Parameter |
Detail |
| Part Number |
XCZU7EV-3FFVC1156E |
| Manufacturer |
Xilinx (AMD) |
| Product Category |
Embedded – System On Chip (SoC) |
| Lifecycle Status |
Active |
| Lead Time |
Contact distributor |
| Minimum Order Quantity |
1 piece |
Related Xilinx Zynq UltraScale+ MPSoC Devices
Engineers evaluating the XCZU7EV-3FFVC1156E may also consider these related devices:
| Part Number |
Package |
Key Difference |
| XCZU7EV-2FFVC1156I |
1156-FCBGA |
-2 Speed Grade, Industrial Temp |
| XCZU7EV-1FFVC1156I |
1156-FCBGA |
-1 Speed Grade, Industrial Temp |
| XCZU7EV-3FBVB900E |
900-FCBGA |
Smaller Package Option |
| XCZU7EV-3FFVF1517E |
1517-FCBGA |
Larger Package, More I/O |
| XCZU7EG-3FFVC1156E |
1156-FCBGA |
EG-Series (No Video Codec) |
Get Your XCZU7EV-3FFVC1156E Today
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Frequently Asked Questions About XCZU7EV-3FFVC1156E
What is the difference between XCZU7EV and XCZU7EG?
The XCZU7EV (EV-series) includes an integrated video codec engine for H.264/H.265 encoding and decoding, while the XCZU7EG (EG-series) does not include this feature but offers the same processing system and programmable logic resources.
What development board supports XCZU7EV?
The Xilinx ZCU106 evaluation board features the XCZU7EV device and provides a complete development platform for prototyping and evaluation.
What software tools are required for XCZU7EV-3FFVC1156E development?
Xilinx Vivado Design Suite is the primary development tool for FPGA logic design, while Vitis and PetaLinux support software development on the ARM processing system.
Is the XCZU7EV-3FFVC1156E suitable for automotive applications?
While the -3E suffix indicates extended temperature range, engineers requiring automotive qualification should consider devices with the “Q” (automotive) temperature grade designation.
What is the typical power consumption?
Power consumption varies based on design utilization and operating conditions. Xilinx provides the Power Estimator tool within Vivado for accurate power analysis.
