Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7EV-3FBVB900E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA with H.264/H.265 Video Codec

Product Details

The XCZU7EV-3FBVB900E is a high-performance System-on-Chip (SoC) FPGA from AMD (formerly Xilinx), part of the Zynq UltraScale+ MPSoC EV family. This advanced multiprocessor system-on-chip combines a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5F real-time processor, Mali-400 MP2 GPU, and a 4K60-capable H.264/H.265 video codec in a single 900-pin FCBGA package. Designed for video processing, embedded vision, AI/ML, and ADAS applications, the XCZU7EV-3FBVB900E delivers the highest speed grade (-3) performance available in the Zynq UltraScale+ EV lineup.


XCZU7EV-3FBVB900E Key Features and Benefits

The XCZU7EV-3FBVB900E stands out as a premier choice for engineers requiring cutting-edge processing capabilities combined with programmable logic flexibility.

Heterogeneous Processing Architecture

Processing Element Specification
Application Processor Quad-core ARM Cortex-A53 (64-bit) up to 1.5 GHz
Real-Time Processor Dual-core ARM Cortex-R5F with CoreSight
Graphics Processing Unit ARM Mali-400 MP2
Video Codec Unit H.264/H.265 (HEVC) Hardware Encoder/Decoder
Video Resolution Support Up to 4K UHD @ 60fps

Programmable Logic Resources

Resource Quantity
System Logic Cells 504,000+
CLB Flip-Flops 460,800
CLB LUTs 230,400
Distributed RAM 6.2 Mb
Block RAM (36Kb) 312 Blocks
Block RAM Total 11 Mb
UltraRAM Available
DSP Slices (27×18 Multiplier) 1,728

High-Speed Connectivity

Interface Specification
GTH Transceivers 20 Channels
GTH Max Data Rate 16.3 Gb/s
PS-GTR Transceivers 4 Channels (6 Gb/s)
PCIe Support Gen3 x16 / Gen4 x8
DisplayPort 4K @ 60Hz
USB 3.0 Dual Controllers
Gigabit Ethernet Dual RGMII/SGMII
SATA 3.1 Support

XCZU7EV-3FBVB900E Technical Specifications

Device Identification and Package Information

Parameter Value
Manufacturer Part Number XCZU7EV-3FBVB900E
Manufacturer AMD (Xilinx)
Product Family Zynq UltraScale+ MPSoC EV
Device Type System-on-Chip (SoC) FPGA
Speed Grade -3 (Highest Performance)
Temperature Grade E (Extended: 0°C to +100°C)
Package Type FCBGA (Fine-pitch Ball Grid Array)
Pin Count 900 Pins
Package Dimensions 31mm x 31mm
Ball Pitch 0.8mm
Process Technology 16nm FinFET+

Electrical Characteristics

Parameter Condition Value
Core Voltage (VCCINT) Nominal 0.85V
Auxiliary Voltage (VCCAUX) Nominal 1.8V
I/O Voltage Range HP Banks 1.0V – 1.8V
I/O Voltage Range HD Banks 1.2V – 3.3V
Static Power Typical Device Dependent
Operating Temperature Extended Grade 0°C to +100°C

Memory Interface Support

Memory Type Maximum Speed
DDR4 SDRAM Up to 2666 Mb/s
DDR3/DDR3L Up to 2133 Mb/s
LPDDR4 Up to 4266 Mb/s
LPDDR3 Up to 2133 Mb/s

H.264/H.265 Video Codec Unit (VCU) Capabilities

The XCZU7EV-3FBVB900E features an integrated hardware Video Codec Unit (VCU) that provides real-time video encoding and decoding capabilities, making it ideal for professional broadcast, surveillance, and streaming applications.

Video Codec Specifications

Feature Specification
Supported Standards H.264 (AVC), H.265 (HEVC)
Maximum Resolution 4K UHD (3840 x 2160) @ 60fps
Encoder Streams Up to 8 simultaneous 1080p30
Decoder Streams Up to 8 simultaneous 1080p30
Color Formats YUV 4:2:0, YUV 4:2:2
Bit Depth 8-bit and 10-bit
Rate Control CBR, VBR, CQP
Latency Mode Low-latency encoding supported

XCZU7EV-3FBVB900E Applications

The XCZU7EV-3FBVB900E is engineered for demanding applications across multiple industries:

Automotive and ADAS

  • Advanced Driver Assistance Systems (ADAS)
  • Surround-view camera systems
  • Driver monitoring systems
  • In-vehicle infotainment (IVI)

Video and Broadcast

  • Professional video conferencing
  • Live streaming encoders
  • Surveillance systems with 4K recording
  • Medical imaging equipment

Industrial and AI

  • Machine vision systems
  • Industrial automation
  • Edge AI and machine learning inference
  • 5G wireless infrastructure

Aerospace and Defense

  • Radar signal processing
  • Electronic warfare systems
  • Secure communications

Why Choose XCZU7EV-3FBVB900E?

Highest Performance Speed Grade

The -3 speed grade designation indicates this is the highest-performing variant in the XCZU7EV family. Compared to -1 and -2 speed grades, the XCZU7EV-3FBVB900E offers faster clock frequencies, reduced timing margins, and superior throughput for performance-critical applications.

Integrated Video Codec Advantage

Unlike CG (Compute-focused) and EG (Graphics-focused) variants, the EV series includes a dedicated hardware H.264/H.265 video codec. This eliminates the need for external video processing chips, reducing BOM cost, board complexity, and power consumption while enabling real-time 4K60 video processing.

Comprehensive Development Ecosystem

The XCZU7EV-3FBVB900E is fully supported by AMD’s Vivado Design Suite and Vitis unified software platform, providing:

  • High-level synthesis (HLS) for accelerated development
  • Pre-verified IP cores for common interfaces
  • PetaLinux operating system support
  • Extensive documentation and reference designs

XCZU7EV-3FBVB900E Ordering Information

Part Number Speed Grade Temperature Package
XCZU7EV-1FBVB900E -1 (Standard) Extended 900 FCBGA
XCZU7EV-2FBVB900E -2 (Mid) Extended 900 FCBGA
XCZU7EV-3FBVB900E -3 (Highest) Extended 900 FCBGA
XCZU7EV-1FBVB900I -1 (Standard) Industrial 900 FCBGA
XCZU7EV-2FBVB900I -2 (Mid) Industrial 900 FCBGA

Related Products and Development Kits

Engineers working with the XCZU7EV-3FBVB900E may also consider:

  • ZCU104 Evaluation Kit – Entry-level EV development platform featuring XCZU7EV
  • ZCU106 Evaluation Kit – Full-featured development board with comprehensive I/O

For a complete selection of AMD Zynq UltraScale+ devices and other programmable logic solutions, explore our Xilinx FPGA catalog.


Compliance and Certifications

Standard Status
RoHS EU RoHS Compliant (2011/65/EU, 2015/863)
REACH Compliant
Halogen-Free Available
ECCN 5A002.A.4
USHTS 8542310070
TARIC 8542399000

Frequently Asked Questions (FAQ)

What is the difference between XCZU7EV and XCZU7EG?

The XCZU7EV includes an integrated H.264/H.265 video codec unit (VCU) and UltraRAM, while the XCZU7EG provides only the Mali-400 GPU without the video codec. Choose the EV variant for applications requiring hardware video encoding/decoding.

What development tools are required for XCZU7EV-3FBVB900E?

AMD Vivado Design Suite (2018.3 or later recommended) is required for FPGA development. For software development, the Vitis unified platform and PetaLinux provide comprehensive ARM processor support.

Can XCZU7EV-3FBVB900E handle multiple 4K video streams?

Yes, the VCU can process multiple video streams simultaneously. While single-stream 4K60 is the maximum, you can alternatively process up to eight 1080p30 streams concurrently.

What is the package compatibility for design migration?

The 900-FCBGA package is footprint-compatible with other XCZU7EV variants in the same package, enabling straightforward speed grade migration without PCB redesign.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.