Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7EV-1FFVF1517E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA with Video Codec

Product Details

The XCZU7EV-1FFVF1517E is a high-performance Zynq UltraScale+ MPSoC (Multi-Processor System-on-Chip) from AMD Xilinx, featuring an integrated H.264/H.265 video codec, quad-core ARM Cortex-A53 processor, and advanced 20nm programmable logic. This powerful embedded SoC is ideal for 4K video processing, AI/machine learning, 5G wireless, and next-generation ADAS applications.


XCZU7EV-1FFVF1517E Key Features and Benefits

The XCZU7EV-1FFVF1517E combines heterogeneous processing capabilities with high-density programmable logic, making it a versatile solution for demanding embedded applications. This Xilinx FPGA delivers exceptional performance-per-watt while supporting real-time video encoding and decoding.

Integrated Video Codec Unit (VCU)

One of the standout features of the XCZU7EV-1FFVF1517E is its hardened video codec unit supporting both H.264 (AVC) and H.265 (HEVC) standards. This enables simultaneous 4K@60fps video encoding and decoding with low latency, making it perfect for broadcast, surveillance, and video conferencing systems.

Heterogeneous Multi-Core Processing Architecture

The XCZU7EV-1FFVF1517E integrates multiple processing units optimized for different workloads, providing unmatched flexibility for complex system designs.


XCZU7EV-1FFVF1517E Technical Specifications

General Device Information

Parameter Specification
Manufacturer AMD Xilinx
Part Number XCZU7EV-1FFVF1517E
Family Zynq UltraScale+ MPSoC EV
Process Technology 20nm FinFET+
Package Type FCBGA-1517 (Flip Chip BGA)
Pin Count 1517 Pins
Speed Grade -1 (Standard Performance)
Temperature Grade E (Extended: 0°C to +100°C)
Core Voltage (VCCINT) 0.85V

Programmable Logic (PL) Resources

Resource Value
System Logic Cells 504,000
CLB Flip-Flops 460,800
CLB LUTs 230,400
Block RAM (36Kb) 312 Blocks
Block RAM Capacity 11.0 Mb
UltraRAM (288Kb) 96 Blocks
UltraRAM Capacity 27.0 Mb
DSP Slices 1,728

Processing System (PS) Specifications

Processing Unit Specification
Application Processing Unit (APU) Quad-core ARM Cortex-A53 MPCore @ 1.5GHz
Real-Time Processing Unit (RPU) Dual-core ARM Cortex-R5F @ 600MHz
Graphics Processing Unit (GPU) ARM Mali-400 MP2 @ 667MHz
L1 Cache (APU) 32KB I-Cache / 32KB D-Cache per core
L2 Cache (APU) 1MB Shared
On-Chip Memory 256KB
TCM (RPU) 128KB per core

Video Codec Unit (VCU) Specifications

Feature Capability
Supported Standards H.264 (AVC), H.265 (HEVC)
Maximum Resolution 4K (3840×2160)
Frame Rate Up to 60fps @ 4K
Simultaneous Encode/Decode Yes
Bit Depth 8-bit, 10-bit
Chroma Formats 4:0:0, 4:2:0, 4:2:2

High-Speed Serial Transceivers

Transceiver Type Quantity Maximum Data Rate
GTH Transceivers 16 16.3 Gb/s
PS-GTR Transceivers 4 6.0 Gb/s

Connectivity and Interfaces

Interface Specification
PCIe Gen1/Gen2 (PS-GTR based)
USB USB 2.0, USB 3.0
SATA SATA 3.1
DisplayPort DisplayPort 1.2a
Ethernet Gigabit Ethernet (SGMII)
Memory Interface DDR4, DDR3, LPDDR4, LPDDR3 with ECC
General Purpose I/O 32-bit GPIO
Serial Interfaces UART, SPI, I2C, CAN 2.0B

XCZU7EV-1FFVF1517E Applications

4K Video Processing and Broadcast

The integrated H.264/H.265 video codec makes the XCZU7EV-1FFVF1517E an excellent choice for professional broadcast equipment, video conferencing systems, and 4K streaming applications requiring low-latency encoding and decoding.

Advanced Driver Assistance Systems (ADAS)

Automotive applications benefit from the device’s real-time processing capabilities, combining sensor fusion, object detection, and video analytics in a single chip solution.

5G Wireless Infrastructure

The high-speed GTH transceivers and extensive programmable logic enable implementation of complex 5G baseband processing and fronthaul/backhaul applications.

AI and Machine Learning at the Edge

With Xilinx’s DPU (Deep Learning Processing Unit) support and extensive on-chip memory resources, the XCZU7EV-1FFVF1517E accelerates neural network inference for embedded vision and AI applications.

Industrial IoT and Machine Vision

The combination of real-time ARM Cortex-R5F processors and programmable logic enables deterministic control systems with integrated high-resolution image processing capabilities.


XCZU7EV-1FFVF1517E Package Information

FFVF1517 Package Details

Parameter Value
Package Type Flip Chip Fine-pitch BGA
Ball Pitch 1.0 mm
Package Dimensions 40mm × 40mm
Ball Count 1517
Maximum User I/O (HP) 312
Maximum User I/O (HD) 48
Lead-Free Yes (RoHS Compliant)

XCZU7EV-1FFVF1517E Development Tools and Support

Vivado Design Suite

AMD Xilinx provides comprehensive development support through the Vivado Design Suite, enabling efficient FPGA design implementation, synthesis, and timing closure.

Vitis Unified Software Platform

The Vitis platform supports embedded software development, AI/ML acceleration, and heterogeneous computing workflows for the XCZU7EV-1FFVF1517E.

PetaLinux

For Linux-based embedded applications, PetaLinux provides a complete embedded Linux development environment optimized for Zynq UltraScale+ devices.


Why Choose XCZU7EV-1FFVF1517E for Your Design?

The XCZU7EV-1FFVF1517E offers several compelling advantages for system designers:

  • Integrated Video Processing: Hardened H.264/H.265 codec eliminates the need for external video processing chips
  • Heterogeneous Computing: Combine ARM processors, GPU, and FPGA fabric for optimal task allocation
  • High-Speed Connectivity: 16 GTH transceivers at 16.3 Gb/s support demanding data throughput requirements
  • Power Efficiency: 20nm FinFET+ process delivers excellent performance-per-watt
  • Scalability: Pin-compatible with other Zynq UltraScale+ MPSoC devices for design migration
  • Long-Term Availability: AMD extends UltraScale+ product availability through 2045

XCZU7EV-1FFVF1517E Ordering Information

Order Code Description
XCZU7EV-1FFVF1517E Extended temp, -1 speed grade, FFVF1517 package
XCZU7EV-1FFVF1517I Industrial temp, -1 speed grade, FFVF1517 package
XCZU7EV-2FFVF1517E Extended temp, -2 speed grade, FFVF1517 package
XCZU7EV-2FFVF1517I Industrial temp, -2 speed grade, FFVF1517 package

Related Zynq UltraScale+ MPSoC Devices

Device Logic Cells Video Codec GTH Transceivers
XCZU4EV 192,150 Yes 4
XCZU5EV 256,200 Yes 4
XCZU7EV 504,000 Yes 16
XCZU11EG 653,100 No 16
XCZU15EG 747,000 No 16

Conclusion

The XCZU7EV-1FFVF1517E represents a powerful solution for designers requiring high-performance video processing, heterogeneous computing, and extensive programmable logic in a single device. With its integrated H.264/H.265 video codec, quad-core ARM Cortex-A53 processor, and 504,000 system logic cells, this Zynq UltraScale+ MPSoC is well-suited for demanding applications in broadcast, automotive, industrial, and AI/ML domains.

For availability, pricing, and technical support for the XCZU7EV-1FFVF1517E and other AMD Xilinx components, contact your authorized distributor today.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.