Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7EV-1FFVC1156E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA | Complete Technical Guide

Product Details

The XCZU7EV-1FFVC1156E is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) manufactured by AMD (formerly Xilinx). This advanced embedded processor combines powerful 64-bit ARM processing with programmable FPGA logic, making it ideal for demanding applications in industrial automation, video processing, 5G wireless, and automotive ADAS systems. As a premium Xilinx FPGA solution, the XCZU7EV-1FFVC1156E delivers exceptional performance with integrated video codec capabilities.


XCZU7EV-1FFVC1156E Key Features and Benefits

The XCZU7EV-1FFVC1156E belongs to the “EV” variant of the Zynq UltraScale+ family, specifically designed for applications requiring advanced video processing capabilities. This System-on-Chip integrates multiple processing engines that enable optimization across entire applications.

Processing System Architecture

The XCZU7EV-1FFVC1156E features a heterogeneous processing system that combines:

  • Quad-core ARM Cortex-A53 application processor operating at up to 1.5GHz
  • Dual-core ARM Cortex-R5 real-time processor for deterministic control
  • ARM Mali-400 MP2 graphics processing unit for display applications
  • Dedicated Video Codec Unit (VCU) supporting H.264/H.265 encoding and decoding

Programmable Logic Resources

The FPGA fabric in the XCZU7EV-1FFVC1156E provides extensive programmable logic resources built on advanced 20nm FinFET+ technology, offering the flexibility to implement custom hardware accelerators and interfaces.


XCZU7EV-1FFVC1156E Technical Specifications

Specification Value
Part Number XCZU7EV-1FFVC1156E
Manufacturer AMD (Xilinx)
Product Family Zynq UltraScale+ MPSoC
Variant EV (Video Codec)
System Logic Cells 504,000
Process Technology 20nm FinFET+
Speed Grade -1 (Standard)
Temperature Grade Extended (E)
Package Type FCBGA-1156
Package Dimensions 35mm × 35mm
Operating Voltage (VCCINT) 0.85V

XCZU7EV-1FFVC1156E Processor Specifications

Processor Core Specification
Application Processor Quad-core ARM Cortex-A53
APU Max Frequency 1.5 GHz
Real-Time Processor Dual-core ARM Cortex-R5
RPU Max Frequency 533 MHz
Graphics Processor ARM Mali-400 MP2
Video Codec H.264/H.265 (4K60 capable)
Architecture 64-bit ARMv8

Video Codec Capabilities of XCZU7EV-1FFVC1156E

The “EV” designation in XCZU7EV-1FFVC1156E indicates the inclusion of a dedicated Video Codec Unit (VCU). This hardware block provides:

Video Encoding and Decoding Performance

Feature Capability
Supported Codecs H.264 (AVC), H.265 (HEVC)
Maximum Resolution 4K (3840×2160)
Maximum Frame Rate 60 fps at 4K
Simultaneous Operations Encode + Decode
Latency Low-latency streaming support
Color Depth 8-bit and 10-bit support

XCZU7EV-1FFVC1156E Package Information

FFVC1156 Package Details

Parameter Value
Package Code FFVC1156
Package Type Fine-pitch Ball Grid Array (FCBGA)
Total Ball Count 1156 pins
Ball Pitch 1.0mm
Package Size 35mm × 35mm
Lead-Free Yes (RoHS Compliant)
Moisture Sensitivity Level MSL-3

XCZU7EV-1FFVC1156E Memory and I/O Resources

On-Chip Memory

Memory Type Capacity
Block RAM 11.0 Mb
UltraRAM 9.0 Mb
Distributed RAM (LUT RAM) Available
L1 Cache 32KB I-Cache + 32KB D-Cache per A53 core
L2 Cache 1MB shared

I/O Capabilities

I/O Type Quantity/Capability
Maximum User I/O Up to 347 HP I/O
High-Performance I/O Banks Multiple banks
GTH Transceivers 16× (12.5 Gbps)
PS-GTR Transceivers 4× (6.0 Gbps)
PCIe Support Gen2 x4 / Gen3 x4
DDR4 Support Up to 2400 Mbps

XCZU7EV-1FFVC1156E Applications

The XCZU7EV-1FFVC1156E is designed for high-performance embedded applications requiring video processing, real-time control, and custom hardware acceleration.

Target Application Areas

Industrial and Automation

  • Machine vision systems
  • Industrial IoT gateways
  • Motion control systems
  • Robotics and automation

Video and Broadcast

  • Professional video encoding/streaming
  • Video surveillance systems
  • Medical imaging equipment
  • Broadcast infrastructure

Communications

  • 5G wireless base stations
  • Network infrastructure
  • Software-defined radio
  • Edge computing nodes

Automotive

  • Advanced Driver Assistance Systems (ADAS)
  • In-vehicle infotainment
  • Autonomous driving platforms
  • Surround-view camera systems

XCZU7EV-1FFVC1156E Development Tools

Xilinx Vivado Design Suite

The XCZU7EV-1FFVC1156E is supported by AMD’s comprehensive development toolchain:

Tool Purpose
Vivado Design Suite FPGA development, synthesis, and implementation
Vitis Unified Platform Software development and AI acceleration
PetaLinux Embedded Linux development
Vitis AI Machine learning deployment

XCZU7EV-1FFVC1156E Part Number Decoder

Understanding the part number helps in selecting the correct device variant:

Segment Value Meaning
XC XC Xilinx Commercial
ZU7 ZU7 Zynq UltraScale+ Size 7
EV EV Video Codec variant
-1 -1 Speed Grade 1 (Standard)
FF FF Flip-chip Fine-pitch
VC VC Pb-free package
1156 1156 1156-ball count
E E Extended temperature range

XCZU7EV-1FFVC1156E Operating Conditions

Temperature Specifications

Parameter Commercial (C) Extended (E) Industrial (I)
Junction Temp (Tj) 0°C to +100°C -40°C to +100°C -40°C to +100°C
Ambient Temp (Ta) Application dependent Application dependent Application dependent

Power Supply Requirements

Supply Rail Nominal Voltage Tolerance
VCCINT 0.85V ±3%
VCCAUX 1.8V ±5%
VCCO Bank dependent 1.2V to 3.3V
VCCBRAM 0.85V ±3%

Why Choose XCZU7EV-1FFVC1156E for Your Design

Performance Advantages

The XCZU7EV-1FFVC1156E delivers significant advantages for system designers:

  1. Integrated Video Processing: Hardware video codec eliminates the need for external video processing chips, reducing BOM cost and PCB complexity.
  2. Heterogeneous Computing: Combine ARM processing power with FPGA flexibility in a single device for optimal performance-per-watt.
  3. Real-Time Capabilities: Dual Cortex-R5 cores provide deterministic real-time processing for safety-critical applications.
  4. Scalable Platform: Part of a pin-compatible family allowing design migration across different performance and feature levels.
  5. Long-Term Availability: AMD has committed to supporting UltraScale+ devices through 2045, ensuring long product lifecycles.

XCZU7EV-1FFVC1156E Related Part Numbers

Part Number Speed Grade Temperature Package
XCZU7EV-1FFVC1156E -1 Extended FFVC1156
XCZU7EV-1FFVC1156I -1 Industrial FFVC1156
XCZU7EV-2FFVC1156E -2 Extended FFVC1156
XCZU7EV-2FFVC1156I -2 Industrial FFVC1156
XCZU7EV-L1FFVC1156I -1L (Low Power) Industrial FFVC1156
XCZU7EV-L2FFVC1156E -2L (Low Power) Extended FFVC1156

Ordering Information for XCZU7EV-1FFVC1156E

When ordering the XCZU7EV-1FFVC1156E, ensure you verify:

  • Correct speed grade for your timing requirements
  • Temperature grade matching your operating environment
  • Package compatibility with your PCB footprint
  • Lead-time and availability with authorized distributors

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.