The XCZU7EG-L2FBVB900E is a high-performance System on Chip (SoC) FPGA from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This advanced embedded processor combines powerful ARM Cortex processing cores with programmable logic in a single 900-pin FCBGA package. Designed for demanding industrial, automotive, and communications applications, the XCZU7EG-L2FBVB900E delivers exceptional performance with optimized power consumption.
XCZU7EG-L2FBVB900E Product Overview
The XCZU7EG-L2FBVB900E belongs to AMD Xilinx’s industry-leading Xilinx FPGA portfolio. Built on advanced 20nm process technology, this MPSoC integrates a feature-rich processing system with UltraScale architecture programmable logic. The “EG” designation indicates it includes a Mali-400 MP2 graphics processing unit, making it ideal for embedded vision and display applications.
Key Features of XCZU7EG-L2FBVB900E
The XCZU7EG-L2FBVB900E offers a comprehensive feature set for system designers requiring high integration and performance.
- Quad-core ARM Cortex-A53 application processor (up to 1.2 GHz)
- Dual-core ARM Cortex-R5 real-time processor (up to 600 MHz)
- ARM Mali-400 MP2 graphics processing unit
- 504K+ programmable logic cells
- 24.5 Mb of on-chip UltraRAM
- 3,660 DSP slices for signal processing applications
- Extended temperature range operation (-40°C to +100°C)
XCZU7EG-L2FBVB900E Technical Specifications
Complete Specifications Table
| Parameter |
Specification |
| Manufacturer |
AMD / Xilinx |
| Part Number |
XCZU7EG-L2FBVB900E |
| Family |
Zynq UltraScale+ MPSoC |
| Device Type |
EG (with GPU) |
| Process Technology |
20nm |
| Logic Cells |
504,000+ |
| System Logic Cells |
527,040 |
| CLB Flip-Flops |
460,800 |
| CLB LUTs |
230,400 |
| Block RAM |
11.0 Mb |
| UltraRAM |
24.5 Mb |
| DSP Slices |
3,660 |
Processing System Specifications
| Component |
Details |
| Application Processor |
Quad-core ARM Cortex-A53 MPCore with CoreSight |
| APU Max Frequency |
1.2 GHz |
| Real-Time Processor |
Dual-core ARM Cortex-R5 with CoreSight |
| RPU Max Frequency |
600 MHz |
| GPU |
ARM Mali-400 MP2 |
| GPU Max Frequency |
500 MHz |
| L2 Cache |
1 MB (shared by Cortex-A53 cores) |
| On-Chip Memory |
256 KB |
Package and Operating Specifications
| Parameter |
Value |
| Package Type |
FCBGA (Flip Chip Ball Grid Array) |
| Package Designation |
FBVB900 |
| Pin Count |
900 pins |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
31 mm × 31 mm |
| Speed Grade |
-2L (Low Power) |
| Temperature Grade |
E (Extended: -40°C to +100°C) |
| Core Voltage (VCCINT) |
0.85V (or 0.72V for reduced power) |
| Packaging |
Tray |
XCZU7EG-L2FBVB900E Part Number Breakdown
Understanding the XCZU7EG-L2FBVB900E part number helps identify exact device specifications:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU |
Zynq UltraScale+ |
| 7 |
Device size (mid-range) |
| EG |
With GPU (Mali-400 MP2) |
| L2 |
Low-power -2 speed grade |
| F |
Flip-chip package |
| BVB |
Package variant |
| 900 |
900 ball count |
| E |
Extended temperature range |
XCZU7EG-L2FBVB900E I/O and Connectivity Features
High-Speed I/O Capabilities
| I/O Type |
Quantity/Speed |
| Max HP I/O Banks |
4 |
| Max HD I/O Banks |
2 |
| GTH Transceivers |
16 |
| Max Transceiver Speed |
16.3 Gb/s |
| DDR4 Memory Interface |
Supported |
| PCIe Gen2/Gen3 |
Supported |
Integrated Peripheral Interfaces
The XCZU7EG-L2FBVB900E processing system includes extensive peripheral connectivity:
- USB: USB 2.0 and USB 3.0 interfaces
- Ethernet: Dual Gigabit Ethernet MAC
- SD/SDIO: SD 3.0/SDIO 3.0 controller
- SPI: Multiple SPI interfaces
- I2C: Multiple I2C controllers
- UART: Dual UART interfaces
- CAN: Dual CAN 2.0B controllers
- GPIO: Up to 78 MIO pins
XCZU7EG-L2FBVB900E Applications
The XCZU7EG-L2FBVB900E is designed for high-performance embedded applications requiring integrated processing and programmable logic.
Industrial Automation
This SoC FPGA enables advanced industrial control systems with real-time processing, motor control, machine vision, and industrial networking capabilities. The dual Cortex-R5 cores provide deterministic real-time response for safety-critical applications.
Automotive Systems
Ideal for ADAS (Advanced Driver Assistance Systems), infotainment systems, and automotive networking. Extended temperature operation ensures reliable performance across harsh automotive environments.
Wireless Communications
The XCZU7EG-L2FBVB900E supports 5G infrastructure equipment, software-defined radio, and wireless base station applications. High DSP slice count enables advanced signal processing algorithms.
Embedded Vision and Video Processing
With the integrated Mali-400 GPU and extensive programmable logic, this device excels in video analytics, surveillance systems, medical imaging, and broadcast equipment applications.
Aerospace and Defense
Extended temperature range and high reliability make this device suitable for avionics, radar systems, and electronic warfare applications requiring robust processing capabilities.
XCZU7EG-L2FBVB900E Speed Grade and Temperature Options
Available Speed Grades
| Speed Grade |
Performance Level |
VCCINT Voltage |
| -3E |
Highest performance |
0.90V |
| -2E / -2I |
High performance |
0.85V |
| -2L (This Device) |
Low power -2 speed |
0.85V or 0.72V |
| -1E / -1I |
Standard performance |
0.85V |
Temperature Range Options
| Grade |
Temperature Range |
Suffix |
| Extended |
-40°C to +100°C |
E |
| Industrial |
-40°C to +100°C |
I |
| Automotive |
-40°C to +100°C |
Q |
| Military |
-55°C to +125°C |
M |
XCZU7EG-L2FBVB900E Development Tools and Software
Vivado Design Suite
AMD Xilinx’s Vivado Design Suite provides comprehensive development support for the XCZU7EG-L2FBVB900E. Key features include:
- Hardware design and synthesis
- Simulation and verification
- Implementation and timing analysis
- Board-level design and debugging
- IP Integrator for rapid system design
PetaLinux Tools
PetaLinux provides embedded Linux development tools optimized for Zynq UltraScale+ MPSoC devices, enabling rapid software development and deployment.
Vitis Unified Platform
The Vitis platform enables software developers to leverage FPGA acceleration without requiring deep hardware expertise, bridging the gap between software and hardware development.
XCZU7EG-L2FBVB900E vs. Similar Devices
Comparison with Related Part Numbers
| Part Number |
Speed |
Temp |
Package |
Logic Cells |
| XCZU7EG-L2FBVB900E |
-2L |
Extended |
FBVB900 |
504K+ |
| XCZU7EG-1FBVB900E |
-1 |
Extended |
FBVB900 |
504K+ |
| XCZU7EG-1FBVB900I |
-1 |
Industrial |
FBVB900 |
504K+ |
| XCZU7EG-2FFVC1156E |
-2 |
Extended |
FFVC1156 |
504K+ |
| XCZU7EV-1FBVB900E |
-1 |
Extended |
FBVB900 |
504K+ (with VCU) |
XCZU7EG-L2FBVB900E Compliance and Certifications
Environmental Compliance
| Standard |
Status |
| RoHS |
Compliant (EU 2011/65/EU, 2015/863) |
| REACH |
Compliant |
| Halogen-Free |
Available |
Export Control
| Classification |
Details |
| ECCN |
5A002.A.4 |
| HTS Code |
8542.39.0001 |
XCZU7EG-L2FBVB900E Ordering Information
When ordering the XCZU7EG-L2FBVB900E, verify these specifications match your requirements:
| Attribute |
This Device |
| Full Part Number |
XCZU7EG-L2FBVB900E |
| Speed Grade |
-2L (Low Power) |
| Temperature |
Extended (-40°C to +100°C) |
| Package |
900-ball FCBGA |
| Packaging Type |
Tray |
| Lead-Free |
Yes |
Frequently Asked Questions About XCZU7EG-L2FBVB900E
What is the difference between EG and EV variants?
The XCZU7EG includes an ARM Mali-400 GPU for graphics processing, while the XCZU7EV variant includes a Video Codec Unit (VCU) for H.264/H.265 encoding and decoding. Choose EG for general embedded graphics and EV for video streaming applications.
What does the L2 speed grade mean?
The L2 designation indicates a low-power variant of the -2 speed grade. When operated at 0.85V, it provides equivalent timing to standard -2 devices. At 0.72V, it offers reduced performance with significantly lower power consumption.
Is the XCZU7EG-L2FBVB900E suitable for automotive applications?
While the E (Extended) temperature variant supports automotive temperature ranges, for full automotive qualification, consider the Q-grade automotive variants which include additional screening and qualification per AEC-Q100 standards.
What memory interfaces are supported?
The XCZU7EG-L2FBVB900E supports DDR4, DDR3, DDR3L, LPDDR4, and LPDDR3 memory interfaces through its dedicated memory controller in the processing system.
