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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XCZU7EG-L1FFVF1517I: Xilinx Zynq UltraScale+ MPSoC FPGA | Complete Specifications & Buying Guide

Product Details

The XCZU7EG-L1FFVF1517I is a high-performance System-on-Chip (SoC) FPGA from Xilinx’s Zynq UltraScale+ MPSoC family. This industrial-grade device combines powerful ARM Cortex processors with programmable logic, making it ideal for demanding embedded applications. Whether you’re developing AI systems, 5G infrastructure, or industrial automation solutions, the XCZU7EG-L1FFVF1517I delivers exceptional processing power and flexibility.


What is the XCZU7EG-L1FFVF1517I?

The XCZU7EG-L1FFVF1517I belongs to Xilinx’s Zynq UltraScale+ MPSoC EG device family. This SoC integrates a multi-core ARM processing system with advanced FPGA fabric. The device features a 1517-pin FCBGA package and operates within industrial temperature ranges from -40°C to 100°C.

This Xilinx FPGA combines heterogeneous processing capabilities with high-speed connectivity options. As a result, engineers can implement complex algorithms while maintaining real-time system control.


XCZU7EG-L1FFVF1517I Key Features and Benefits

Powerful Multi-Core Processing Architecture

The XCZU7EG-L1FFVF1517I integrates multiple processing units for maximum performance:

  • Quad-core ARM Cortex-A53 MPCore running at 1.2GHz for application processing
  • Dual-core ARM Cortex-R5 operating at 600MHz for real-time control
  • ARM Mali-400 MP2 GPU for graphics acceleration
  • CoreSight debug technology for comprehensive system debugging

Advanced FPGA Fabric

The programmable logic section offers over 504,000 logic cells. This substantial logic capacity enables implementation of custom accelerators and interfaces. Moreover, the UltraScale+ architecture provides industry-leading performance-per-watt efficiency.

Industrial-Grade Reliability

With its -1 speed grade and industrial temperature rating, the XCZU7EG-L1FFVF1517I operates reliably in harsh environments. The device maintains stable performance across the full -40°C to 100°C junction temperature range.


XCZU7EG-L1FFVF1517I Technical Specifications

Specification Details
Part Number XCZU7EG-L1FFVF1517I
Manufacturer Xilinx (AMD)
Device Family Zynq UltraScale+ MPSoC
Device Type EG (with GPU)
Architecture MCU + FPGA SoC
Process Technology 16nm FinFET+
Logic Cells 504,000+
Speed Grade -1 (Standard)
Temperature Grade Industrial (I)

XCZU7EG-L1FFVF1517I Processor Specifications

Processor Core Clock Speed Description
ARM Cortex-A53 1.2 GHz Quad-core application processor
ARM Cortex-R5 600 MHz Dual-core real-time processor
Mali-400 MP2 500 MHz Graphics processing unit

Memory and Connectivity Features

On-Chip Memory

Memory Type Capacity
On-Chip RAM 256 KB
L1 Cache Integrated per core
L2 Cache Shared among A53 cores

Peripheral Connectivity Options

The XCZU7EG-L1FFVF1517I supports extensive connectivity interfaces:

Interface Description
Ethernet Gigabit Ethernet MAC
USB USB 2.0 and USB 3.0 OTG
PCIe Gen2 x4 lanes
SATA SATA 3.1 support
DisplayPort Video output capability
CAN Bus Automotive networking
SPI/I2C Serial peripheral interfaces
UART Serial communication
MMC/SD/SDIO Storage card interfaces

Package and Physical Specifications

Parameter Value
Package Type FCBGA (Flip Chip Ball Grid Array)
Pin Count 1517
Package Size 40mm × 40mm
Ball Pitch 1.0mm
Package Code FFVF1517
RoHS Compliance Yes

XCZU7EG-L1FFVF1517I Operating Conditions

Parameter Minimum Typical Maximum Unit
Junction Temperature -40 100 °C
Core Voltage (VCCINT) 0.825 0.85 0.876 V
Auxiliary Voltage 1.746 1.8 1.854 V

Application Areas for XCZU7EG-L1FFVF1517I

Artificial Intelligence and Machine Learning

The XCZU7EG-L1FFVF1517I excels in AI inference applications. Its combination of ARM processors and programmable logic enables efficient neural network acceleration. Additionally, the device supports Xilinx’s Vitis AI platform for streamlined AI development.

5G Wireless Infrastructure

Telecommunications equipment manufacturers choose this SoC for 5G base stations and radio units. The high-speed interfaces and processing capability handle demanding signal processing requirements. Furthermore, the industrial temperature rating ensures reliable outdoor deployment.

Industrial Automation and Control

Factory automation systems benefit from the real-time processing capabilities. The ARM Cortex-R5 cores provide deterministic response times for motion control. Meanwhile, the FPGA fabric implements custom sensor interfaces and protocols.

Medical Imaging Equipment

Medical device manufacturers utilize the XCZU7EG-L1FFVF1517I for imaging systems. The GPU handles display rendering while FPGA logic accelerates image processing algorithms. The industrial-grade reliability meets stringent medical equipment requirements.

Automotive ADAS Systems

Advanced driver assistance systems leverage this SoC’s processing power. Camera and radar data fusion algorithms run efficiently on the heterogeneous architecture. The wide temperature range suits automotive environmental requirements.

Aerospace and Defense

Defense applications require the combination of processing flexibility and reliability. The XCZU7EG-L1FFVF1517I supports secure boot and encryption features. Consequently, it meets security requirements for sensitive applications.


XCZU7EG-L1FFVF1517I Development Resources

Software Development Tools

Xilinx provides comprehensive development tools for the XCZU7EG-L1FFVF1517I:

Tool Purpose
Vivado Design Suite FPGA design and implementation
Vitis Unified Platform Software application development
PetaLinux Tools Embedded Linux development
Vitis AI AI/ML model deployment

Documentation and Support

Engineers can access technical documentation including:

  • Device datasheet (DS925)
  • Technical reference manual
  • PCB design guidelines
  • Package pinout diagrams
  • Reference designs and tutorials

XCZU7EG Speed Grade Comparison

Speed Grade Performance Power Consumption Application Focus
-3 Highest Higher Maximum performance
-2 High Moderate Balanced applications
-1 Standard Lower Power-sensitive designs

The XCZU7EG-L1FFVF1517I uses the -1 speed grade, optimizing for power efficiency while maintaining excellent performance for most applications.


Why Choose the XCZU7EG-L1FFVF1517I?

Heterogeneous Computing Advantage

The combination of ARM processors and FPGA fabric provides unmatched flexibility. Software tasks run on the CPUs while hardware accelerators handle compute-intensive functions. This architecture delivers both programmability and performance.

Reduced System Complexity

Integrating MCU and FPGA functionality into one device simplifies board design. Engineers eliminate the need for separate processor and FPGA chips. As a result, system cost and board space requirements decrease significantly.

Future-Proof Design

The programmable FPGA fabric allows algorithm updates throughout the product lifecycle. New features and optimizations can be deployed without hardware changes. This flexibility extends product relevance and reduces development risk.

Proven Reliability

Xilinx’s UltraScale+ technology has been deployed in millions of systems worldwide. The mature manufacturing process ensures consistent device quality. Industrial temperature rating guarantees operation in challenging environments.


XCZU7EG-L1FFVF1517I Ordering Information

Order Code Description
XCZU7EG-L1FFVF1517I Industrial temp, -1 speed, 1517-FCBGA
XCZU7EG-L2FFVF1517I Industrial temp, -2 speed, 1517-FCBGA
XCZU7EG-L2FFVF1517E Extended temp, -2 speed, 1517-FCBGA

Related XCZU7EG Package Options

Part Number Package Pin Count
XCZU7EG-L1FFVC1156I FFVC1156 1156
XCZU7EG-L1FBVB900I FBVB900 900
XCZU7EG-L1FFVF1517I FFVF1517 1517

The 1517-pin package provides maximum I/O connectivity for complex system designs.


Conclusion

The XCZU7EG-L1FFVF1517I represents an excellent choice for embedded system designers requiring high-performance heterogeneous computing. Its combination of quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, Mali GPU, and 504K+ logic cells delivers exceptional capability. The industrial temperature rating and proven reliability make it suitable for demanding applications across multiple industries.

From AI inference to 5G infrastructure, this Zynq UltraScale+ MPSoC enables innovative solutions. Engineers benefit from comprehensive development tools and extensive documentation. Whether you’re prototyping new concepts or deploying production systems, the XCZU7EG-L1FFVF1517I provides the performance and flexibility modern applications demand.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.