Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7EG-L1FBVB900I: Xilinx Zynq UltraScale+ MPSoC FPGA SoC

Product Details

The XCZU7EG-L1FBVB900I is an advanced System-on-Chip (SoC) from the AMD/Xilinx Zynq UltraScale+ MPSoC EG family. This high-performance device combines powerful ARM processing cores with programmable FPGA logic, making it an ideal solution for demanding applications in industrial automation, automotive ADAS, wireless communication, and embedded vision systems.

Built on 20nm technology, the XCZU7EG-L1FBVB900I delivers exceptional processing power with low power consumption in a compact 900-pin FCBGA package. Engineers and system designers choose this Xilinx FPGA for applications requiring real-time processing, hardware acceleration, and flexible I/O configurations.


XCZU7EG-L1FBVB900I Key Features and Benefits

The XCZU7EG-L1FBVB900I integrates multiple processing elements that work together seamlessly to deliver outstanding performance for complex workloads.

Processing System Architecture

The heterogeneous processing architecture of the XCZU7EG-L1FBVB900I includes multiple ARM processor cores designed for different computational tasks:

Processing Unit Specification Maximum Frequency
Application Processor Quad-core ARM Cortex-A53 MPCore with CoreSight 1.2 GHz
Real-Time Processor Dual-core ARM Cortex-R5 with CoreSight 600 MHz
Graphics Processing Unit ARM Mali-400 MP2 500 MHz

Programmable Logic Resources

The XCZU7EG-L1FBVB900I provides extensive programmable logic resources based on the UltraScale architecture:

Resource Type Quantity
System Logic Cells 504,000+
DSP Slices 3,660
UltraRAM 24.5 Mb
Block RAM Available
Configurable Logic Blocks Extensive

XCZU7EG-L1FBVB900I Technical Specifications

General Specifications

Parameter Value
Manufacturer AMD / Xilinx
Part Number XCZU7EG-L1FBVB900I
Series Zynq UltraScale+ MPSoC EG
Product Category System On Chip (SoC) / Embedded FPGA
Process Technology 20nm
Core Voltage 0.85V

Package Information

Parameter Specification
Package Type FCBGA (Flip Chip Ball Grid Array)
Pin Count 900 Pins
Package Dimensions 31mm × 31mm
Packaging Tray

Operating Conditions

Parameter Value
Speed Grade -1L
Temperature Grade Industrial (I)
Operating Temperature Range -40°C to +100°C

XCZU7EG-L1FBVB900I Connectivity and Interfaces

The XCZU7EG-L1FBVB900I supports a comprehensive range of high-speed interfaces for seamless system integration.

High-Speed Interfaces

Interface Type Capability
PCIe Gen2/Gen3 Support
USB USB 3.0
Ethernet Multiple Gigabit Ethernet Ports
Memory Controller DDR4
Display Interfaces DisplayPort, HDMI Support

Security Features

Security Feature Description
Encryption Engine AES (Advanced Encryption Standard)
Authentication SHA Engine
Secure Boot Supported
Anti-Tamper Hardware Security Module

XCZU7EG-L1FBVB900I Applications

The versatile architecture of the XCZU7EG-L1FBVB900I makes it suitable for numerous high-performance applications:

Industrial Applications

  • Industrial automation and control systems
  • Machine vision and inspection systems
  • Motor control and robotics
  • Programmable Logic Controllers (PLCs)
  • Industrial IoT gateways

Automotive Applications

  • Advanced Driver Assistance Systems (ADAS)
  • Infotainment systems
  • Instrument clusters
  • Vehicle-to-Everything (V2X) communication

Communication Applications

  • 5G wireless infrastructure
  • Software-defined radio (SDR)
  • Network processing and acceleration
  • Base station equipment

Aerospace and Defense

  • Radar signal processing
  • Electronic warfare systems
  • Secure communications
  • Mission-critical computing

XCZU7EG-L1FBVB900I Development Tools and Resources

Software Development Environment

Tool Purpose
Vivado Design Suite FPGA synthesis, implementation, and programming
Vitis Unified Software Platform Application acceleration and embedded software development
PetaLinux Tools Embedded Linux development
SDK Software development kit for ARM processors

Documentation Resources

  • Complete technical datasheet (PDF)
  • UltraScale+ architecture reference manual
  • Hardware user guides
  • Application notes and design examples
  • PCB design guidelines

XCZU7EG-L1FBVB900I Compliance and Certifications

Compliance Status
RoHS Status ROHS3 Compliant (2011/65/EU, 2015/863)
Product Status Active
ECCN 5A002.A.4
Moisture Sensitivity Level MSL-3

XCZU7EG-L1FBVB900I Ordering Information

Part Number Description Package
XCZU7EG-L1FBVB900I Zynq UltraScale+ MPSoC EG, -1L Speed, Industrial Temp 900-FCBGA
XCZU7EG-1FBVB900I Zynq UltraScale+ MPSoC EG, -1 Speed, Industrial Temp 900-FCBGA
XCZU7EG-1FBVB1156I Zynq UltraScale+ MPSoC EG, -1 Speed, Industrial Temp 1156-FCBGA

Related Part Numbers

Part Number Variant
XCZU7EV-1FBVB900I EV variant with video codec
XCZU7EV-L1FBVB900I EV variant, -1L speed grade
XCZU4EG-L1SFVC784I Lower density EG variant

Why Choose XCZU7EG-L1FBVB900I for Your Design

The XCZU7EG-L1FBVB900I offers several compelling advantages for embedded system designers:

  1. Integrated Solution – Combines ARM processors, FPGA fabric, and peripherals in a single device, reducing BOM cost and PCB complexity.
  2. Scalable Performance – The combination of quad-core Cortex-A53 and dual-core Cortex-R5 processors provides flexibility for both application processing and real-time control.
  3. Hardware Acceleration – Over 504,000 logic cells and 3,660 DSP slices enable custom hardware acceleration for compute-intensive algorithms.
  4. Industrial Reliability – Industrial temperature grade operation ensures reliable performance in harsh environments.
  5. Extensive Connectivity – Built-in support for PCIe Gen3, USB 3.0, Gigabit Ethernet, and DDR4 memory simplifies system design.
  6. Security Features – Hardware-based encryption and secure boot capabilities protect intellectual property and sensitive data.

Frequently Asked Questions About XCZU7EG-L1FBVB900I

What is the difference between XCZU7EG and XCZU7EV?

The XCZU7EG belongs to the EG (Embedded Graphics) subfamily, while the XCZU7EV is part of the EV (Embedded Vision) subfamily. The EV variant includes additional video codec capabilities such as H.264/H.265 encoding and decoding, making it better suited for video processing applications.

What does the “-L1” in the part number indicate?

The “-L1” designation indicates the -1L speed grade, which is optimized for lower power consumption while maintaining reliable performance. The -1L speed grade is ideal for power-sensitive applications.

What temperature range does the “I” suffix indicate?

The “I” suffix indicates Industrial temperature grade, which specifies an operating temperature range of -40°C to +100°C (junction temperature). This makes the device suitable for industrial and automotive environments.

What development board supports the XCZU7EG?

The Zynq UltraScale+ MPSoC ZCU104 Evaluation Kit and similar development boards support the XCZU7EG device family, providing a platform for prototyping and development.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.