The XCZU7EG-3FFVF1517E is a high-performance System on Chip (SoC) from the AMD Xilinx Zynq UltraScale+ MPSoC EG family. This advanced FPGA device combines a powerful quad-core ARM Cortex-A53 processor with programmable logic, making it ideal for embedded vision, industrial IoT, and advanced computing applications. As a leading Xilinx FPGA solution, this device delivers exceptional processing power, flexibility, and energy efficiency for demanding applications.
XCZU7EG-3FFVF1517E Key Features and Benefits
The XCZU7EG-3FFVF1517E stands out as a premium choice for engineers requiring both software programmability and hardware acceleration. This Zynq UltraScale+ MPSoC device integrates a complete processing system with UltraScale programmable logic architecture, enabling unprecedented design flexibility.
Why Choose the XCZU7EG-3FFVF1517E for Your Design?
This device offers the highest speed grade (-3E) in the XCZU7EG lineup, delivering maximum performance for time-critical applications. The extended temperature range ensures reliable operation across diverse environmental conditions, making it suitable for industrial and outdoor deployments.
XCZU7EG-3FFVF1517E Technical Specifications
General Specifications
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCZU7EG-3FFVF1517E |
| Family |
Zynq UltraScale+ MPSoC |
| Device Type |
EG (Embedded Graphics) |
| Speed Grade |
-3 (Highest Performance) |
| Temperature Range |
Extended (0°C to +100°C) |
| Process Technology |
16nm FinFET+ |
| Core Voltage (VCCINT) |
0.90V |
| Package |
1517-FCBGA |
| Package Dimensions |
40mm × 40mm |
| Ball Pitch |
1.0mm |
Programmable Logic (PL) Resources
| Resource |
Quantity |
| System Logic Cells |
504,000 |
| CLB Flip-Flops |
460,800 |
| CLB LUTs |
230,400 |
| Configurable Logic Blocks (CLBs) |
28,800 |
| DSP Slices |
1,728 |
| Block RAM (36Kb) |
312 |
| Total Block RAM |
11 Mb |
| UltraRAM Blocks |
96 |
| Total UltraRAM |
27 Mb |
| Distributed RAM |
7.1 Mb |
Processing System (PS) Specifications
| Component |
Specification |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53 MPCore with CoreSight |
| APU Maximum Frequency |
Up to 1.5 GHz |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F with CoreSight |
| RPU Maximum Frequency |
Up to 600 MHz |
| Graphics Processing Unit (GPU) |
ARM Mali-400 MP2 |
| GPU Maximum Frequency |
Up to 667 MHz |
| L1 Cache |
32KB I-Cache + 32KB D-Cache per core |
| L2 Cache |
1MB shared |
| On-Chip Memory |
256KB OCM |
| ECC Support |
Yes |
I/O and Connectivity Features
| Feature |
Specification |
| Maximum User I/O |
464 |
| High-Performance (HP) I/O |
416 |
| High-Density (HD) I/O |
48 |
| HP I/O Voltage Range |
1.0V to 1.8V |
| HD I/O Voltage Range |
1.2V to 3.3V |
| GTH Transceivers |
24 |
| GTH Maximum Data Rate |
Up to 16.3 Gb/s |
| Integrated PCIe Blocks |
2 × PCIe Gen4 |
| DisplayPort |
Yes |
| USB 2.0 Controllers |
2 (Host/Device/OTG) |
| Gigabit Ethernet MACs |
4 |
| UART Controllers |
2 |
| I2C Controllers |
2 |
| SPI Controllers |
2 |
| CAN 2.0B Controllers |
2 |
| GPIO |
174 (78 MIO + 96 EMIO) |
Memory Interface Support
| Memory Type |
Support |
| DDR4 |
Up to 2400 Mb/s |
| DDR3/DDR3L |
Up to 1866 Mb/s |
| LPDDR4 |
Up to 2133 Mb/s |
| LPDDR3 |
Up to 1866 Mb/s |
| QDRII+ SRAM |
Yes |
| RLDRAM3 |
Yes |
| Quad SPI Flash |
Yes |
| NAND Flash |
Yes |
| SD/eMMC |
Yes |
XCZU7EG-3FFVF1517E Applications and Use Cases
Industrial Automation and Control
The XCZU7EG-3FFVF1517E excels in industrial automation systems requiring real-time processing and deterministic response. The dual-core ARM Cortex-R5F ensures precise timing for motor control, robotics, and PLC applications.
Embedded Vision and Machine Learning
With 504,000 logic cells and 1,728 DSP slices, this device provides substantial computational resources for image processing, object detection, and AI inference at the edge. The ARM Mali-400 MP2 GPU accelerates graphics-intensive applications.
Telecommunications and 5G Infrastructure
The 24 GTH transceivers supporting up to 16.3 Gb/s enable high-bandwidth communication links essential for 5G base stations, network switches, and data aggregation units.
Medical Imaging Equipment
The combination of high-speed signal processing capability and reliable extended temperature operation makes the XCZU7EG-3FFVF1517E suitable for portable medical devices, ultrasound systems, and patient monitoring equipment.
Aerospace and Defense Systems
Extended temperature range operation and comprehensive security features including 256-bit AES-GCM encryption support mission-critical aerospace and defense applications.
XCZU7EG-3FFVF1517E Package Information
1517-FCBGA Package Details
| Specification |
Value |
| Package Type |
Fine-pitch Ball Grid Array (FCBGA) |
| Total Balls |
1517 |
| Body Size |
40mm × 40mm |
| Ball Pitch |
1.0mm |
| Ball Arrangement |
39 × 39 array |
| Package Height |
2.55mm (typical) |
| Moisture Sensitivity Level |
MSL-3 |
XCZU7EG-3FFVF1517E Ordering Information
Part Number Breakdown
- XC: Xilinx Commercial Grade
- ZU7: Zynq UltraScale+ 7 Series
- EG: Embedded Graphics (with Mali GPU)
- -3: Speed Grade 3 (Highest Performance)
- FF: 1.0mm Ball Pitch Package
- V: Pb-free (RoHS Compliant)
- F1517: 1517-Ball FCBGA Package
- E: Extended Temperature Range
Related Part Numbers
| Part Number |
Speed Grade |
Temperature Range |
| XCZU7EG-3FFVF1517E |
-3 |
Extended (0°C to +100°C) |
| XCZU7EG-2FFVF1517E |
-2 |
Extended (0°C to +100°C) |
| XCZU7EG-2FFVF1517I |
-2 |
Industrial (-40°C to +100°C) |
| XCZU7EG-1FFVF1517E |
-1 |
Extended (0°C to +100°C) |
| XCZU7EG-1FFVF1517I |
-1 |
Industrial (-40°C to +100°C) |
Development Tools and Software Support
AMD Vivado Design Suite
The XCZU7EG-3FFVF1517E is fully supported by AMD Vivado Design Suite, providing comprehensive tools for FPGA development including synthesis, implementation, and debug capabilities.
Vitis Unified Software Platform
AMD Vitis enables software developers to accelerate applications on Zynq UltraScale+ devices using familiar programming languages including C, C++, and Python.
PetaLinux Tools
PetaLinux provides a complete Linux distribution and development environment optimized for Zynq UltraScale+ MPSoC devices.
XCZU7EG-3FFVF1517E vs Alternative Devices
Comparison with Other Zynq UltraScale+ MPSoC Devices
| Feature |
XCZU7EG |
XCZU9EG |
XCZU11EG |
XCZU15EG |
| Logic Cells |
504K |
600K |
659K |
747K |
| DSP Slices |
1,728 |
2,520 |
2,928 |
3,528 |
| Block RAM |
11 Mb |
32.1 Mb |
34.6 Mb |
31.3 Mb |
| GTH Transceivers |
24 |
24 |
32 |
24 |
| GTY Transceivers |
– |
– |
16 |
– |
| Mali GPU |
Yes |
Yes |
Yes |
Yes |
Conclusion: XCZU7EG-3FFVF1517E Summary
The XCZU7EG-3FFVF1517E represents a powerful, versatile solution for engineers developing next-generation embedded systems. With its combination of high-performance ARM processors, extensive programmable logic resources, and comprehensive connectivity options, this Zynq UltraScale+ MPSoC device addresses the demanding requirements of industrial, communications, medical, and aerospace applications. The -3 speed grade ensures maximum performance, while the extended temperature range provides reliability across challenging operating environments.
