The XCZU7EG-3FBVB900E is a premium System-on-Chip (SoC) FPGA from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This advanced programmable device combines powerful 64-bit processing capabilities with high-performance programmable logic, delivering exceptional performance for demanding embedded applications. With its -3E speed grade rating—the highest performance tier available—the XCZU7EG-3FBVB900E is engineered for applications requiring maximum computational throughput and real-time processing power.
XCZU7EG-3FBVB900E Key Features and Benefits
The XCZU7EG-3FBVB900E stands out as a versatile solution for engineers seeking to integrate heterogeneous processing capabilities into a single chip. This Xilinx FPGA device eliminates the need for multiple discrete components, reducing board complexity and power consumption while enhancing system reliability.
Why Choose the XCZU7EG-3FBVB900E?
The XCZU7EG-3FBVB900E delivers several compelling advantages for system designers. Its integrated architecture combines ARM processors with programmable logic fabric, enabling hardware-software co-design optimization. The -3E speed grade ensures maximum clock frequencies and fastest signal propagation, critical for latency-sensitive applications.
XCZU7EG-3FBVB900E Technical Specifications
Processing System Specifications
| Parameter |
Specification |
| Application Processor |
Quad-core ARM® Cortex®-A53 MPCore™ with CoreSight™ |
| APU Clock Speed |
Up to 1.5 GHz |
| Real-Time Processor |
Dual-core ARM® Cortex™-R5F with CoreSight™ |
| RPU Clock Speed |
Up to 600 MHz |
| Graphics Processor |
ARM Mali™-400 MP2 GPU |
| GPU Clock Speed |
Up to 667 MHz |
| L2 Cache |
1 MB (shared) |
| On-Chip Memory |
256 KB |
Programmable Logic Specifications
| Parameter |
Specification |
| Logic Cells |
504,000 |
| CLB Flip-Flops |
461,160 |
| CLB LUTs |
230,580 |
| Distributed RAM (Kb) |
3,600 |
| Block RAM (Mb) |
11 |
| UltraRAM (Mb) |
24.5 |
| DSP Slices |
1,728 |
| Architecture |
UltraScale+™ |
| Process Technology |
20nm |
Package and Electrical Specifications
| Parameter |
Specification |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Package Code |
FBVB900 |
| Pin Count |
900 |
| Package Dimensions |
31mm × 31mm |
| Core Voltage (VCCINT) |
0.90V |
| Speed Grade |
-3E (Highest Performance) |
| Temperature Range |
Extended (E): 0°C to +100°C |
XCZU7EG-3FBVB900E High-Speed Connectivity
Serial Transceiver Performance
The XCZU7EG-3FBVB900E integrates advanced serial transceivers that enable high-bandwidth communication interfaces essential for modern embedded systems.
| Transceiver Type |
Maximum Data Rate |
| PS-GTR |
Up to 6.0 Gb/s |
| GTH |
Up to 16.3 Gb/s |
| GTY |
Up to 32.75 Gb/s |
Supported Interface Protocols
The device supports numerous industry-standard protocols including PCIe Gen3/Gen4, 100G Ethernet, SATA 3.1, USB 3.0, DisplayPort 1.2, and HDMI 2.0. The integrated protocol controllers reduce external component requirements and simplify PCB design.
XCZU7EG-3FBVB900E Applications
Industrial Automation and Control
The XCZU7EG-3FBVB900E excels in industrial applications requiring deterministic real-time control combined with advanced analytics. The dual ARM Cortex-R5F cores handle time-critical control loops while the Cortex-A53 processors run higher-level algorithms and user interfaces.
Communications Infrastructure
Telecommunications equipment manufacturers leverage the XCZU7EG-3FBVB900E for base stations, network switches, and protocol converters. The high-speed transceivers and abundant DSP resources enable complex signal processing and packet handling operations.
Aerospace and Defense Systems
The extended temperature range and robust architecture make the XCZU7EG-3FBVB900E suitable for mission-critical aerospace and defense applications including radar systems, electronic warfare, and avionics.
Medical Imaging Equipment
Medical device designers utilize the XCZU7EG-3FBVB900E’s parallel processing capabilities for real-time image processing in ultrasound machines, CT scanners, and endoscopy systems.
Advanced Driver Assistance Systems (ADAS)
The combination of ARM processing power, GPU acceleration, and programmable logic makes the XCZU7EG-3FBVB900E ideal for sensor fusion, computer vision, and machine learning inference in automotive applications.
XCZU7EG-3FBVB900E Part Number Decoder
Understanding the complete part number helps engineers select the correct device variant:
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial |
| ZU |
ZU |
Zynq UltraScale+ |
| 7 |
7 |
Device Size (Medium-Large) |
| EG |
EG |
Device Type: With GPU, Without Video Codec |
| -3 |
-3 |
Speed Grade (-3E = Highest Performance) |
| FBVB |
FBVB |
Package Type (900-pin FCBGA) |
| 900 |
900 |
Pin Count |
| E |
E |
Temperature Range (Extended) |
XCZU7EG-3FBVB900E Development Tools and Resources
Vivado Design Suite
AMD Xilinx provides the Vivado Design Suite for FPGA development, synthesis, implementation, and debugging. The suite includes integrated logic analyzers, timing analysis tools, and power estimation utilities specifically optimized for UltraScale+ devices.
Vitis Unified Software Platform
The Vitis platform enables application development for the ARM processing system, including bare-metal programming, Linux development, and AI/ML acceleration using the Vitis AI toolchain.
Available Documentation
Engineers can access comprehensive documentation including the XCZU7EG-3FBVB900E datasheet, packaging and pinout specifications, PCB design guidelines, and application notes through AMD’s technical documentation portal.
XCZU7EG-3FBVB900E Compliance and Certifications
| Certification |
Status |
| RoHS Compliance |
EU RoHS Compliant (2011/65/EU, 2015/863) |
| REACH |
Compliant |
| Moisture Sensitivity Level |
MSL-3 |
| ECCN |
5A002.A.4 |
| USHTS Code |
8542390001 |
| TARIC Code |
8542399000 |
XCZU7EG-3FBVB900E vs. Related Part Numbers
Speed Grade Comparison
| Part Number |
Speed Grade |
VCCINT |
Performance Level |
| XCZU7EG-1FBVB900E |
-1E |
0.85V |
Standard |
| XCZU7EG-2FBVB900E |
-2E |
0.85V |
Enhanced |
| XCZU7EG-3FBVB900E |
-3E |
0.90V |
Highest |
Temperature Grade Variants
| Part Number |
Temperature Range |
Application |
| XCZU7EG-3FBVB900E |
Extended (0°C to +100°C) |
Commercial/Industrial |
| XCZU7EG-3FBVB900I |
Industrial (-40°C to +100°C) |
Industrial |
Ordering Information for XCZU7EG-3FBVB900E
When ordering the XCZU7EG-3FBVB900E, verify the following specifications match your design requirements:
- Full Part Number: XCZU7EG-3FBVB900E
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Zynq UltraScale+ MPSoC
- Device Variant: EG (with GPU, without Video Codec)
- Package: 900-pin FCBGA (31mm × 31mm)
- Speed Grade: -3E (Highest Performance)
- Temperature: Extended (E)
Frequently Asked Questions About XCZU7EG-3FBVB900E
What is the difference between XCZU7EG and XCZU7EV?
The XCZU7EG includes a Mali-400 GPU but lacks the H.264/H.265 video codec present in the XCZU7EV variant. Choose the EG variant for general-purpose embedded applications not requiring hardware video encoding/decoding.
What development boards support the XCZU7EG?
Several evaluation platforms support XCZU7EG devices, including AMD’s official Zynq UltraScale+ MPSoC development kits and third-party boards from partners like Avnet and Trenz Electronic.
What is the typical lead time for XCZU7EG-3FBVB900E?
Lead times vary based on market conditions. Current estimates range from 12-26 weeks. Contact authorized distributors for accurate availability information.
What is the recommended core voltage for -3E speed grade?
The -3E speed grade requires VCCINT = 0.90V to achieve maximum performance specifications. Lower speed grades (-1E, -2E) operate at 0.85V.
