The XCZU7EG-2FFVF1517E is a high-performance System-on-Chip (SoC) from the Xilinx Zynq UltraScale+ MPSoC family. This advanced multiprocessor device combines powerful ARM processing cores with flexible programmable logic, making it an ideal solution for embedded computing, industrial automation, and AI acceleration applications.
Built on cutting-edge 16nm FinFET+ technology, the XCZU7EG-2FFVF1517E delivers exceptional processing power, energy efficiency, and system integration capabilities that meet the demands of next-generation embedded designs.
Key Features of the XCZU7EG-2FFVF1517E Zynq UltraScale+ MPSoC
Powerful Heterogeneous Processing Architecture
The XCZU7EG-2FFVF1517E features a sophisticated multiprocessor architecture that includes:
- Quad-core ARM Cortex-A53 Application Processor running at up to 1.5GHz with L1/L2 caches and ECC support
- Dual-core ARM Cortex-R5F Real-Time Processor for deterministic, low-latency processing at up to 600MHz
- ARM Mali-400 MP2 Graphics Processing Unit operating at up to 667MHz for graphics and display acceleration
High-Density Programmable Logic Resources
| Specification |
Value |
| System Logic Cells |
504,000+ |
| CLB Flip-Flops |
460,800 |
| CLB LUTs |
230,400 |
| DSP Slices |
1,728 |
| Block RAM |
11 Mb |
| UltraRAM |
8 Mb |
XCZU7EG-2FFVF1517E Technical Specifications
Package and Electrical Characteristics
| Parameter |
Specification |
| Part Number |
XCZU7EG-2FFVF1517E |
| Manufacturer |
Xilinx (AMD) |
| Family |
Zynq UltraScale+ MPSoC |
| Device Type |
EG (Graphics Processing) |
| Package Type |
FFVF (Flip Chip Fine-Pitch BGA) |
| Pin Count |
1517 Pins |
| Package Dimensions |
40mm × 40mm |
| Speed Grade |
-2 |
| Temperature Grade |
Extended (E) |
| Core Voltage (VCCINT) |
0.85V |
| Process Technology |
16nm FinFET+ |
High-Speed Connectivity and I/O Interfaces
| Interface |
Details |
| User I/O Pins |
464 |
| HP I/O Banks |
8 |
| HD I/O Banks |
4 |
| GTH Transceivers |
24 (up to 16.3 Gbps) |
| PCIe Support |
Gen3 x16 / Gen4 x8 |
| DisplayPort |
1.2a / HDMI 2.0 |
| USB |
USB 2.0 / USB 3.0 |
Understanding the XCZU7EG-2FFVF1517E Part Number
| Code |
Meaning |
| XC |
Xilinx Component |
| ZU |
Zynq UltraScale+ |
| 7 |
Device Size (Medium Density) |
| EG |
Embedded Graphics (with GPU) |
| -2 |
Speed Grade 2 (Mid-Performance) |
| FF |
Flip-Chip Package |
| VF |
Lead-Free Ball |
| 1517 |
Pin Count |
| E |
Extended Temperature Range (0°C to +100°C) |
Applications for the XCZU7EG-2FFVF1517E
Industrial and Embedded Systems
The XCZU7EG-2FFVF1517E excels in demanding industrial applications including motor control, sensor fusion, machine vision, and industrial IoT gateways. The combination of real-time ARM Cortex-R5F processors with programmable logic enables precise timing and deterministic control.
Automotive Advanced Driver Assistance Systems (ADAS)
With its robust temperature range and powerful processing capabilities, this device supports automotive applications such as surround-view cameras, radar signal processing, and sensor data fusion.
AI and Machine Learning Edge Computing
The 1,728 DSP slices and high-bandwidth memory interfaces make the XCZU7EG-2FFVF1517E suitable for deploying neural network inference at the edge, enabling real-time AI processing in smart cameras, drones, and robotics.
Wireless Communications Infrastructure
The device supports 5G small cells, software-defined radios, and wireless baseband processing with its extensive signal processing resources and high-speed transceiver interfaces.
Development Tools and Software Support
The XCZU7EG-2FFVF1517E is supported by AMD’s comprehensive development ecosystem:
- Vivado Design Suite – Industry-leading FPGA synthesis, implementation, and debugging environment
- Vitis Unified Software Platform – C/C++/Python-based application development with AI acceleration libraries
- PetaLinux Tools – Embedded Linux development for ARM processors
- Extensive IP Library – Pre-verified IP cores for rapid system integration
XCZU7EG-2FFVF1517E vs. Alternative Devices
| Device |
Logic Cells |
DSP Slices |
GPU |
Key Difference |
| XCZU7EG-2FFVF1517E |
504K |
1,728 |
Mali-400 MP2 |
Graphics-enabled EG variant |
| XCZU7CG-2FFVF1517E |
504K |
1,728 |
None |
CG variant without GPU |
| XCZU7EV-2FFVF1517E |
504K |
1,728 |
Mali-400 MP2 |
EV variant with H.264/H.265 VCU |
| XCZU9EG-2FFVC1156E |
599K |
2,520 |
Mali-400 MP2 |
Higher logic density |
Quality and Compliance Standards
| Standard |
Status |
| RoHS Compliance |
EU RoHS 2011/65/EU, 2015/863 |
| REACH Compliant |
Yes |
| Halogen-Free |
Yes |
| ECCN |
5A002.A.4 |
| USHTS |
8542390001 |
Where to Buy XCZU7EG-2FFVF1517E
The XCZU7EG-2FFVF1517E is available through authorized AMD/Xilinx distributors worldwide. For reliable sourcing and competitive pricing on this Zynq UltraScale+ MPSoC and other Xilinx FPGA products, contact your preferred distributor or electronic component supplier.
Frequently Asked Questions (FAQ)
What is the difference between XCZU7EG and XCZU7CG?
The XCZU7EG includes an ARM Mali-400 MP2 graphics processing unit, while the XCZU7CG is a dual-core variant without the integrated GPU. Choose the EG variant when your application requires graphics or display processing capabilities.
What speed grades are available for the XCZU7EG?
The XCZU7EG is available in -1, -2, and -3 speed grades, with -3E providing the highest performance. The -2 speed grade in the XCZU7EG-2FFVF1517E offers an optimal balance between performance and power consumption.
What is the operating temperature range of the XCZU7EG-2FFVF1517E?
The “E” suffix indicates an extended temperature range of 0°C to +100°C junction temperature, suitable for demanding industrial and commercial applications.
Is the XCZU7EG-2FFVF1517E suitable for automotive applications?
While the “E” (extended) temperature grade is suitable for many automotive applications, AMD/Xilinx offers specific automotive-qualified variants with “Q” designation for safety-critical automotive systems requiring AEC-Q100 compliance.
Summary
The XCZU7EG-2FFVF1517E represents a powerful and versatile solution for embedded system designers requiring the combination of advanced ARM processing, GPU acceleration, and flexible FPGA fabric. With 504K+ logic cells, 1,728 DSP slices, and comprehensive I/O connectivity, this Zynq UltraScale+ MPSoC enables the development of sophisticated embedded systems across industrial, automotive, communications, and AI applications.
