The XCZU7EG-2FBVB900I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family, combining quad-core ARM Cortex-A53 processors with advanced FPGA fabric. This industrial-grade device features 504K+ logic cells in a compact 900-pin FCBGA package, making it ideal for automotive, industrial automation, aerospace, and embedded vision applications requiring both processing power and programmable logic flexibility.
XCZU7EG-2FBVB900I Overview and Key Features
The XCZU7EG-2FBVB900I represents the EG (embedded graphics) variant of the Zynq UltraScale+ family, manufactured using advanced 20nm process technology. This Xilinx FPGA delivers exceptional performance with its heterogeneous multiprocessing architecture that integrates ARM processing system with UltraScale+ programmable logic.
Core Processing Capabilities
| Processor Type |
Specifications |
Performance |
| Application Processors |
Quad ARM Cortex-A53 MPCore with CoreSight |
Up to 1.3 GHz |
| Real-Time Processors |
Dual ARM Cortex-R5 with CoreSight |
Up to 600 MHz |
| Graphics Processing Unit |
ARM Mali-400 MP2 |
Enhanced visual capabilities |
| On-Chip Memory |
256 KB RAM |
High-speed data access |
XCZU7EG-2FBVB900I Technical Specifications
Programmable Logic Resources
The XCZU7EG-2FBVB900I features robust FPGA capabilities that enable custom hardware acceleration and flexible I/O configuration:
| FPGA Resource |
Quantity |
Application |
| Logic Cells |
504,000+ |
Complex digital logic implementation |
| DSP Slices |
3,660 |
Signal processing & mathematical operations |
| UltraRAM |
24.5 Mb |
High-bandwidth on-chip memory |
| Block RAM |
34.6 Mb |
Distributed memory resources |
| Architecture |
UltraScale+ |
Advanced 20nm process technology |
Package and Physical Specifications
| Parameter |
Details |
| Package Type |
900-FCBGA (Flip-Chip Ball Grid Array) |
| Package Dimensions |
31mm × 31mm |
| Total Pins |
900 |
| Operating Voltage |
0.85V (VCCINT) |
| Temperature Grade |
Industrial (I): -40°C to +100°C (TJ) |
| Speed Grade |
-2 (Medium performance) |
XCZU7EG-2FBVB900I Connectivity and Peripherals
Rich I/O and Interface Support
The XCZU7EG-2FBVB900I provides extensive connectivity options essential for modern embedded systems:
High-Speed Communication Interfaces
- CANbus – Automotive and industrial networking
- Gigabit Ethernet – High-speed data transmission
- USB OTG – USB On-The-Go for peripheral connectivity
- PCIe Gen2 – PCI Express for system expansion
- MMC/SD/SDIO – Memory card and wireless connectivity
Standard Serial Protocols
- UART/USART – Universal asynchronous serial communication
- SPI – Serial Peripheral Interface
- I²C – Inter-Integrated Circuit bus
- EBI/EMI – External Bus Interface for memory expansion
Integrated Peripherals
- DMA Controllers – Direct Memory Access for efficient data transfer
- Watchdog Timers (WDT) – System reliability and fault detection
- GPIO – General Purpose Input/Output pins
- Timers/Counters – Precision timing and event counting
XCZU7EG-2FBVB900I Applications and Use Cases
Industrial Automation and Control
The XCZU7EG-2FBVB900I excels in factory automation, robotics control, and programmable logic controllers (PLCs) where real-time processing meets flexible I/O requirements.
Automotive Systems
With its industrial temperature range and robust architecture, this SoC is suitable for:
- Advanced Driver Assistance Systems (ADAS)
- In-vehicle infotainment systems
- Automotive gateway controllers
- Vision processing for autonomous vehicles
Medical Imaging and Healthcare
The combination of processing power and FPGA fabric enables:
- Ultrasound imaging equipment
- CT scan image processing
- Medical device control systems
- Real-time signal processing
Aerospace and Defense
The XCZU7EG-2FBVB900I supports demanding military and aerospace applications including:
- Radar signal processing
- Software-defined radio (SDR)
- Avionics systems
- Secure communication systems
XCZU7EG-2FBVB900I Development Tools and Support
Software Development Environment
Xilinx Vivado Design Suite
The XCZU7EG-2FBVB900I is fully supported by Xilinx’s comprehensive Vivado Design Suite, offering:
- Synthesis and Implementation – Optimized FPGA compilation
- High-Level Synthesis (HLS) – C/C++ to HDL conversion
- IP Integrator – Graphical system design
- Simulation Tools – Verification and debugging
Embedded Software Development
- Vitis Unified Software Platform – Comprehensive embedded development
- PetaLinux – Linux BSP for Zynq devices
- Bare-metal BSP – Real-time operating system support
- FreeRTOS – Open-source RTOS integration
Development Boards and Evaluation Kits
Various Zynq UltraScale+ MPSoC evaluation kits are compatible with the XCZU7EG-2FBVB900I architecture, enabling rapid prototyping and system validation.
XCZU7EG-2FBVB900I Performance and Speed Grades
Understanding Speed Grade -2
The XCZU7EG-2FBVB900I features the -2 speed grade, which offers a balanced performance-to-power ratio:
| Speed Grade |
Application Processor |
Real-Time Processor |
Typical Use |
| -3E (Extended) |
Up to 1.5 GHz |
Up to 600 MHz |
Maximum performance |
| -2 (This Device) |
Up to 1.3 GHz |
Up to 600 MHz |
Balanced performance/power |
| -1 |
Up to 1.2 GHz |
Up to 533 MHz |
Lower power consumption |
Temperature Range Options
The “I” suffix indicates Industrial temperature range qualification:
- Operating Junction Temperature: -40°C to +100°C (TJ)
- Extended (E): 0°C to +100°C
- Automotive (Q): Specialized automotive qualification
- Military (M): Extended environmental specifications
XCZU7EG-2FBVB900I vs. Alternative Models
Comparison with Related Devices
| Part Number |
Key Difference |
Typical Application |
| XCZU7EG-1FBVB900I |
Lower speed grade (-1) |
Power-sensitive applications |
| XCZU7EG-3FBVB900E |
Higher speed grade (-3E) |
Maximum performance requirements |
| XCZU7EG-2FFVC1156I |
Different package (1156-pin) |
More I/O requirements |
| XCZU7EV-2FBVB900I |
Video codec support (EV variant) |
Video processing applications |
XCZU7EG-2FBVB900I Pricing and Availability
Current Market Pricing
The XCZU7EG-2FBVB900I typically ranges from $4,000 to $5,000 USD per unit through authorized distributors. Volume pricing and long-term agreements may offer significant discounts.
Authorized Distributors
- DigiKey Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
- Newark Element14
Lead Time and Stock Availability
Lead times vary based on market conditions and order quantities. Contact authorized distributors for current availability and delivery schedules.
XCZU7EG-2FBVB900I Design Considerations
Power Supply Requirements
| Power Rail |
Voltage |
Purpose |
| VCCINT |
0.85V |
Core logic supply |
| VCCAUX |
1.8V |
Auxiliary circuitry |
| VCCO |
1.2V-3.3V |
I/O bank supplies |
| VCC_PSINTFP |
0.85V |
Processing system |
PCB Design Guidelines
- Package: 900-FCBGA requires advanced PCB design
- Layers: Minimum 8-10 layer board recommended
- Via Technology: Laser-drilled microvias for high-density routing
- Thermal Management: Heat sink or active cooling recommended
- Signal Integrity: Controlled impedance for high-speed signals
Compliance and Certifications
The XCZU7EG-2FBVB900I meets international standards:
- RoHS Compliant: EU RoHS 2011/65/EU, 2015/863
- REACH Compliant: European chemical regulations
- Export Classification: ECCN 5A002.A.4
- Conflict Minerals: Compliant with Dodd-Frank Act
XCZU7EG-2FBVB900I Documentation and Resources
Essential Technical Documents
- Product Data Sheet: Comprehensive specifications and electrical characteristics
- UltraScale Architecture Overview: Architectural reference manual
- Technical Reference Manual: Detailed register and interface documentation
- PCB Design Guide: Layout and routing recommendations
- Power Estimator Tool: Xilinx XPE for power analysis
Online Resources and Support
- AMD Xilinx Forums: Community support and discussions
- Answer Database: Searchable knowledge base
- Reference Designs: Example implementations and IP cores
- Application Notes: Design best practices and guidelines
Why Choose XCZU7EG-2FBVB900I?
Key Advantages
- Heterogeneous Processing – Combines ARM processors with FPGA fabric for optimal performance
- Industrial-Grade Reliability – -40°C to +100°C operating temperature range
- Rich Connectivity – Comprehensive peripheral and interface support
- Scalable Architecture – Easy migration across Zynq UltraScale+ family
- Comprehensive Toolchain – Industry-leading Vivado and Vitis development environment
- Long-Term Availability – AMD Xilinx commitment to product longevity
- Proven Technology – Deployed in thousands of commercial products worldwide
Ideal For System Architects Who Need
- Real-time processing with hardware acceleration
- Flexible I/O and interface customization
- High-performance embedded vision processing
- Secure boot and TrustZone security features
- Low-latency control and data acquisition
XCZU7EG-2FBVB900I Frequently Asked Questions
What is the difference between EG and EV variants?
The EG (Embedded Graphics) variant includes ARM Mali-400 MP2 GPU, while the EV (Embedded Vision) variant adds H.264/H.265 video codec capabilities for video processing applications.
Can I upgrade from -2 to -3 speed grade?
Speed grades are determined during manufacturing. To use higher performance, you must specify the -3 or -3E part number during procurement.
What development board is recommended?
While AMD Xilinx doesn’t offer a specific XCZU7EG-2FBVB900I board, the ZCU102, ZCU104, and ZCU106 evaluation kits use similar Zynq UltraScale+ architecture and provide excellent development platforms.
Is the XCZU7EG-2FBVB900I pin-compatible with other packages?
The 900-FCBGA package has a specific pinout. The XCZU7EG-2FFVC1156I offers a larger 1156-pin package with additional I/O, but they are not pin-compatible.
What FPGA programming tools are required?
Xilinx Vivado Design Suite (version 2019.1 or later recommended) is required for FPGA development. The Vitis software platform is recommended for embedded software development.
Conclusion: XCZU7EG-2FBVB900I – A Powerful SoC Solution
The XCZU7EG-2FBVB900I from AMD Xilinx represents a sophisticated balance of processing power, programmable logic, and industrial reliability. With its quad-core ARM Cortex-A53 processors, extensive FPGA resources, and comprehensive connectivity options, this device enables next-generation embedded systems across automotive, industrial, medical, and aerospace applications.
Whether you’re designing advanced driver assistance systems, industrial automation controllers, or medical imaging equipment, the XCZU7EG-2FBVB900I delivers the performance, flexibility, and reliability demanded by modern embedded applications.
For more information about Xilinx FPGA products and design services, visit our comprehensive Xilinx FPGA resource center.
