Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7EG-1FFVF1517I: High-Performance Zynq UltraScale+ MPSoC FPGA Solution

Product Details

The XCZU7EG-1FFVF1517I is a cutting-edge System-on-Chip (SoC) solution from Xilinx’s Zynq UltraScale+ MPSoC family, combining powerful ARM processing cores with advanced FPGA fabric. This industrial-grade device delivers exceptional performance for demanding embedded applications across AI, 5G, industrial automation, and edge computing markets.

Overview of XCZU7EG-1FFVF1517I Zynq UltraScale+ MPSoC

The XCZU7EG-1FFVF1517I represents Xilinx’s advanced heterogeneous computing architecture, integrating multi-core ARM processors with programmable logic in a single device. Built on 20nm technology, this Xilinx FPGA solution offers designers unprecedented flexibility for hardware acceleration and real-time processing applications.

Key Features of XCZU7EG-1FFVF1517I

The XCZU7EG-1FFVF1517I distinguishes itself through several critical specifications that make it ideal for next-generation embedded systems:

  • Advanced Multi-Core Processing: Quad-core ARM Cortex-A53 MPCore with CoreSight running at 1.2GHz
  • Real-Time Control: Dual ARM Cortex-R5 processors with CoreSight for deterministic operations
  • Graphics Acceleration: ARM Mali-400 MP2 GPU for advanced visualization
  • Extensive Logic Resources: Over 504,000 logic cells for complex FPGA implementations
  • Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ)
  • High-Density Package: 1517-FCBGA (40x40mm) form factor

Technical Specifications of XCZU7EG-1FFVF1517I

Processor Architecture and Performance

Specification Category Technical Details
Processor Type Heterogeneous MPSoC Architecture
Application Processors Quad ARM Cortex-A53 MPCore @ 1.2GHz
Real-Time Processors Dual ARM Cortex-R5 @ 600MHz
Graphics Processing ARM Mali-400 MP2 GPU @ 500MHz
RAM Memory 256KB On-Chip Memory
FPGA Logic Cells 504,000+ Programmable Cells

Connectivity and Peripheral Interfaces

The XCZU7EG-1FFVF1517I offers comprehensive connectivity options essential for modern embedded applications:

Interface Type Supported Protocols
High-Speed Serial USB OTG, Ethernet (Gigabit)
Industrial Protocols CANbus, EBI/EMI
Standard Interfaces I2C, SPI, UART/USART
Storage Interfaces MMC/SD/SDIO
System Features DMA Controllers, Watchdog Timers

Physical and Environmental Specifications

Parameter Value
Package Type 1517-BBGA, FCBGA
Package Dimensions 40mm x 40mm
Pin Count 1517 Pins
Operating Temperature -40°C to +100°C (Industrial Grade)
Speed Grade -1 (Standard Performance)
Technology Node 20nm Process
Supply Voltage 0.85V Core

XCZU7EG-1FFVF1517I Application Fields

Artificial Intelligence and Machine Learning

The XCZU7EG-1FFVF1517I excels in AI inference applications where low latency and power efficiency are critical. The combination of ARM processors and FPGA fabric enables:

  • Neural Network Acceleration: Custom hardware accelerators for CNN, RNN, and transformer models
  • Real-Time Inference: Sub-millisecond response times for edge AI applications
  • Model Flexibility: Reconfigurable logic adapts to evolving AI algorithms
  • Energy Efficiency: Optimized power consumption compared to GPU-based solutions

5G Wireless Infrastructure

For next-generation telecommunications, the XCZU7EG-1FFVF1517I provides essential processing capabilities:

  • Baseband Processing: High-throughput signal processing for massive MIMO
  • Network Slicing: Virtualized network functions with hardware acceleration
  • Low-Latency Requirements: Real-time processing for URLLC applications
  • Beamforming Algorithms: FPGA-based acceleration of complex calculations

Industrial Automation and Control

Industrial applications benefit from the XCZU7EG-1FFVF1517I’s robust operating temperature range and real-time processing:

  • Motion Control: Precise servo control with ARM Cortex-R5 real-time cores
  • Vision Systems: Hardware-accelerated image processing for quality inspection
  • Predictive Maintenance: On-device analytics for equipment monitoring
  • Safety Systems: Deterministic response times for critical safety functions

Medical Equipment and Imaging

Healthcare technology leverages the XCZU7EG-1FFVF1517I for advanced diagnostic equipment:

  • Medical Imaging: Real-time processing for ultrasound, CT, and MRI systems
  • Signal Processing: ECG/EEG analysis with custom hardware accelerators
  • Portable Diagnostics: Power-efficient processing for handheld devices
  • Regulatory Compliance: Industrial temperature grade meets medical equipment standards

Internet of Things (IoT) Edge Computing

IoT gateway and edge computing platforms utilize the XCZU7EG-1FFVF1517I for:

  • Protocol Bridging: Multiple simultaneous communication protocols
  • Data Aggregation: High-speed data collection from distributed sensors
  • Edge Analytics: Local processing reduces cloud bandwidth requirements
  • Security Processing: Hardware-based encryption and secure boot

XCZU7EG-1FFVF1517I Development Ecosystem

Software Development Tools

Xilinx provides comprehensive software support for the XCZU7EG-1FFVF1517I:

  • Vivado Design Suite: Industry-leading FPGA development environment
  • Vitis Unified Software Platform: Accelerated application development
  • PetaLinux Tools: Embedded Linux BSP generation and customization
  • FreeRTOS Support: Real-time operating system for ARM Cortex-R5

Hardware Development Resources

Engineers developing with the XCZU7EG-1FFVF1517I can access:

  • Reference Designs: Pre-validated IP cores and system architectures
  • Evaluation Boards: ZCU104, ZCU106 development platforms
  • Technical Documentation: Comprehensive datasheets and user guides
  • Application Notes: Design guidelines for specific use cases

Performance Characteristics and Speed Grades

The XCZU7EG-1FFVF1517I is available in multiple speed grades to match application requirements:

Speed Grade Options

  • -1 Speed Grade (XCZU7EG-1FFVF1517I): Standard performance for cost-sensitive applications
  • -2 Speed Grade: Enhanced timing performance for demanding designs
  • -3 Speed Grade: Maximum performance for high-speed interfaces

The -1 speed grade (as specified in XCZU7EG-1FFVF1517I) provides excellent performance-per-watt for the majority of industrial and embedded applications.

Power Management and Efficiency

Advanced Power Architecture

The XCZU7EG-1FFVF1517I implements sophisticated power management features:

  • Dynamic Voltage and Frequency Scaling (DVFS): Optimizes power consumption based on workload
  • Power Domains: Independent control of processor subsystems and FPGA fabric
  • Clock Gating: Automatic reduction of power in unused circuits
  • Multi-Core Power Management: Per-core power state control

Thermal Considerations

With an industrial operating temperature range of -40°C to 100°C junction temperature, the XCZU7EG-1FFVF1517I requires appropriate thermal management:

  • Heat Dissipation: Thermal design power considerations for system design
  • Package Selection: FCBGA package optimized for thermal performance
  • Temperature Monitoring: On-chip sensors for thermal management
  • Cooling Solutions: Natural convection to forced-air cooling options

XCZU7EG-1FFVF1517I vs. Alternative Devices

Comparison with Other Zynq UltraScale+ Variants

Feature XCZU7EG-1FFVF1517I XCZU7EG-1FFVC1156I XCZU7EG-2FBVB900E
Logic Cells 504K+ 504K+ 504K+
Package 1517-FCBGA 1156-FCBGA 900-FCBGA
Temperature Grade Industrial (-I) Industrial (-I) Extended (-E)
Speed Grade -1 -1 -2
Pin Count 1517 1156 900

The XCZU7EG-1FFVF1517I offers the highest pin count option, providing maximum I/O flexibility for complex system designs.

Procurement and Availability

XCZU7EG-1FFVF1517I Pricing

Current market pricing for the XCZU7EG-1FFVF1517I ranges from $2,753 to $3,587 depending on order quantity and distribution channel. Volume pricing is available for production quantities.

Lead Time and Stock Availability

The XCZU7EG-1FFVF1517I is available through authorized Xilinx distributors including:

  • Franchised Distributors: Factory-direct stock with full warranty
  • Factory Excess Stock: Cost-effective options for prototyping
  • Global Distribution: Worldwide availability through multiple channels

Ordering Information

When ordering the XCZU7EG-1FFVF1517I, specify:

  • Complete Part Number: XCZU7EG-1FFVF1517I
  • Quantity Requirements: Minimum order quantities may apply
  • Packaging Options: Tray packaging standard for industrial devices
  • Lead Time Requirements: Standard vs. expedited delivery

Design Considerations for XCZU7EG-1FFVF1517I

PCB Layout Requirements

Successful implementation of the XCZU7EG-1FFVF1517I requires careful PCB design:

  • Layer Stack-Up: Minimum 10-layer PCB recommended for signal integrity
  • Power Distribution: Dedicated power planes for clean voltage delivery
  • High-Speed Routing: Controlled impedance for GTH transceivers and DDR interfaces
  • Thermal Vias: Adequate thermal path to PCB and heat sink

System Integration Guidelines

Integrating the XCZU7EG-1FFVF1517I into system designs involves:

  • Memory Subsystem: DDR4 memory interface design considerations
  • Configuration: JTAG, QSPI, or SD card boot options
  • Clocking: External oscillator and PLL configuration
  • I/O Standards: Voltage level translation for 1.8V, 2.5V, 3.3V interfaces

Frequently Asked Questions About XCZU7EG-1FFVF1517I

What is the difference between XCZU7EG variants?

The XCZU7EG family includes multiple package and speed grade options. The XCZU7EG-1FFVF1517I specifically refers to the -1 speed grade in a 1517-pin FCBGA package with industrial temperature range.

Does the XCZU7EG-1FFVF1517I support Linux?

Yes, the XCZU7EG-1FFVF1517I fully supports embedded Linux through Xilinx PetaLinux tools, enabling rapid development of Linux-based embedded systems.

What development boards are compatible?

While no board uses exactly the XCZU7EG-1FFVF1517I, the ZCU104 and ZCU106 evaluation boards feature similar Zynq UltraScale+ devices and provide excellent development platforms.

Is RoHS compliance available?

The XCZU7EG-1FFVF1517I is available in RoHS-compliant versions. Verify compliance requirements with your distributor when ordering.

What software tools are required?

Development requires Xilinx Vivado Design Suite (version 2016.1 or later) and optionally the Vitis unified software platform for application development.

Conclusion: Why Choose XCZU7EG-1FFVF1517I

The XCZU7EG-1FFVF1517I represents an optimal balance of processing power, programmable logic resources, and industrial reliability. Its heterogeneous architecture combining quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and extensive FPGA fabric makes it suitable for the most demanding embedded applications.

Whether developing AI-powered edge devices, 5G infrastructure equipment, industrial automation systems, or advanced medical instruments, the XCZU7EG-1FFVF1517I provides the computational flexibility and performance required for next-generation embedded designs.

For applications requiring proven reliability, comprehensive software support, and scalable performance, the XCZU7EG-1FFVF1517I from Xilinx’s Zynq UltraScale+ family stands as a premier choice in modern SoC FPGA technology.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.