The XCZU7EG-1FFVC1156I is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC family, combining a powerful quad-core ARM Cortex-A53 processor with advanced FPGA programmable logic. This industrial-grade embedded processor delivers exceptional computing capabilities for demanding applications in industrial automation, automotive systems, telecommunications, and aerospace. With 504,000 logic cells and advanced 16nm FinFET+ technology, the XCZU7EG-1FFVC1156I stands as one of the most versatile MPSoC devices available for complex embedded system designs.
XCZU7EG-1FFVC1156I Key Features and Specifications
The XCZU7EG-1FFVC1156I integrates processing system (PS) and programmable logic (PL) in a single device, enabling hardware-software co-design flexibility. Below are the complete technical specifications for this Zynq UltraScale+ MPSoC device.
Processor Specifications
| Specification |
Details |
| Part Number |
XCZU7EG-1FFVC1156I |
| Manufacturer |
AMD (Xilinx) |
| Family |
Zynq UltraScale+ MPSoC EG |
| Application Processor |
Quad-core ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor |
Dual-core ARM Cortex-R5F with CoreSight |
| Graphics Processor |
ARM Mali-400 MP2 GPU |
| Maximum Frequency |
1.2 GHz (APU), 600 MHz (RPU), 500 MHz (GPU) |
Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
504,000 |
| CLB Flip-Flops |
460,800 |
| CLB LUTs |
230,400 |
| Distributed RAM (Kb) |
3,600 |
| Block RAM (Kb) |
11,520 |
| UltraRAM (Kb) |
4,320 |
| DSP Slices |
1,728 |
Package and Electrical Specifications
| Parameter |
Value |
| Package Type |
FCBGA (Flip Chip Ball Grid Array) |
| Package Size |
35mm x 35mm |
| Pin Count |
1156 |
| Ball Pitch |
1.0mm |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-1 (Industrial) |
| Temperature Range |
-40°C to +100°C |
| Process Technology |
16nm FinFET+ |
Zynq UltraScale+ MPSoC EG Device Architecture
The XCZU7EG-1FFVC1156I belongs to the EG (Embedded GPU) variant of the Zynq UltraScale+ MPSoC family. This architecture delivers a powerful combination of application processing, real-time processing, graphics processing, and programmable logic capabilities.
Processing System (PS) Components
The processing system in the XCZU7EG-1FFVC1156I features a heterogeneous multi-processor architecture designed for diverse workloads.
Application Processing Unit (APU)
The quad-core ARM Cortex-A53 application processor provides 64-bit processing capability with the following features:
- 32KB L1 instruction and data cache per core
- 1MB shared L2 cache
- ARM NEON SIMD engine
- Hardware virtualization support
- TrustZone security technology
Real-Time Processing Unit (RPU)
The dual-core ARM Cortex-R5F real-time processor delivers deterministic performance for time-critical applications:
- 32KB L1 instruction and data cache per core
- 128KB tightly-coupled memory (TCM)
- Lock-step mode for safety-critical applications
- Split mode for independent operation
Graphics Processing Unit (GPU)
The integrated ARM Mali-400 MP2 GPU provides hardware-accelerated graphics with:
- OpenGL ES 1.1 and 2.0 support
- OpenVG 1.1 support
- Up to 667 million triangles per second
- Anti-aliasing and texture filtering
Programmable Logic (PL) Capabilities
The XCZU7EG-1FFVC1156I programmable logic fabric offers extensive resources for custom hardware acceleration and peripheral implementation.
Configurable Logic Blocks (CLBs)
The UltraScale architecture CLBs provide enhanced functionality:
- 8 LUTs per CLB (6-input look-up tables)
- 16 flip-flops per CLB
- SLICEM supports distributed RAM and shift registers
- 8-bit carry chain per CLB
- Wide multiplexer support for 7, 8, or 9-input functions
Digital Signal Processing (DSP)
The 1,728 DSP48E2 slices deliver exceptional signal processing performance:
- 27×18 bit signed multiplier
- 48-bit accumulator
- Pre-adder for filter applications
- Pattern detection
- SIMD arithmetic support
Memory Resources
Multiple memory types enable flexible data storage solutions:
- Block RAM: 36Kb dual-port memory blocks with ECC support
- UltraRAM: 288Kb high-density memory blocks
- Distributed RAM: LUT-based memory for small, fast storage
- L3 Cache: 1MB shared cache for PS applications
Connectivity and I/O Interfaces
The XCZU7EG-1FFVC1156I provides comprehensive connectivity options for system integration.
High-Speed Serial Transceivers
| Transceiver Type |
Data Rate |
Quantity |
| GTH Transceivers |
Up to 16.3 Gb/s |
16 |
| PS-GTR Transceivers |
Up to 6 Gb/s |
4 |
Memory Interfaces
The device supports multiple external memory standards:
- DDR4 up to 2400 MT/s
- DDR3/DDR3L up to 1866 MT/s
- LPDDR3/LPDDR4
- QSPI Flash
- NAND Flash
- eMMC 4.51
Standard Peripherals
| Interface |
Quantity |
Features |
| USB 2.0 |
2 |
Host, Device, OTG support |
| Gigabit Ethernet |
4 |
IEEE 1588 PTP support |
| PCIe |
2 |
Gen1/Gen2 x1, x2, x4 |
| UART |
2 |
Standard serial communication |
| I2C |
2 |
Master/Slave support |
| SPI |
2 |
Master/Slave support |
| CAN |
2 |
CAN 2.0B compliant |
| GPIO |
174 |
MIO and EMIO |
XCZU7EG-1FFVC1156I Applications
The versatile architecture of the XCZU7EG-1FFVC1156I makes it suitable for numerous demanding applications.
Industrial Automation
- Motor control systems
- Industrial IoT gateways
- Machine vision systems
- Programmable logic controllers (PLCs)
- Robotics control
Automotive Systems
- Advanced Driver Assistance Systems (ADAS)
- Infotainment systems
- Camera-based sensing
- Sensor fusion
- Vehicle networking
Telecommunications
- 5G wireless infrastructure
- Software-defined networking (SDN)
- Network function virtualization (NFV)
- Base station processing
- Packet processing
Aerospace and Defense
- Radar signal processing
- Electronic warfare systems
- Avionics systems
- Satellite communications
- Secure communications
Medical Equipment
- Medical imaging systems
- Diagnostic equipment
- Patient monitoring
- Ultrasound systems
- Surgical robotics
Development Tools and Software Support
AMD provides comprehensive development tools for the XCZU7EG-1FFVC1156I.
Vivado Design Suite
The Vivado Design Suite offers complete FPGA development capabilities:
- RTL synthesis and implementation
- IP Integrator for block-based design
- High-Level Synthesis (HLS)
- Timing analysis and optimization
- Power estimation and analysis
Vitis Unified Software Platform
Vitis enables software and hardware acceleration development:
- Embedded software development
- AI inference acceleration
- Application acceleration
- Linux and RTOS support
PetaLinux Tools
PetaLinux provides embedded Linux development:
- Yocto-based build system
- Device tree customization
- Kernel and driver development
- Root filesystem configuration
Part Number Breakdown: XCZU7EG-1FFVC1156I
Understanding the part number helps identify device specifications:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU |
Zynq UltraScale+ |
| 7 |
Device size (logic density) |
| EG |
Embedded GPU variant |
| -1 |
Speed grade (industrial performance) |
| FF |
Flip-chip package |
| V |
Lead-free |
| C |
Package type code |
| 1156 |
Pin count |
| I |
Industrial temperature range |
Where to Buy XCZU7EG-1FFVC1156I
The XCZU7EG-1FFVC1156I is available through authorized AMD distributors and electronic component suppliers. For engineers seeking this Zynq UltraScale+ MPSoC or other advanced programmable devices, explore our comprehensive selection of Xilinx FPGA products for competitive pricing and reliable sourcing.
Related Zynq UltraScale+ MPSoC Devices
| Part Number |
Logic Cells |
Package |
Key Difference |
| XCZU7EG-2FFVC1156I |
504,000 |
1156 FCBGA |
Higher speed grade (-2) |
| XCZU7EV-1FFVC1156I |
504,000 |
1156 FCBGA |
Video codec support |
| XCZU9EG-1FFVC900I |
599,550 |
900 FCBGA |
More logic resources |
| XCZU7CG-1FFVC1156I |
504,000 |
1156 FCBGA |
No GPU (CG variant) |
| XCZU5EG-1FBVB900I |
341,280 |
900 FBGA |
Smaller device option |
Conclusion
The XCZU7EG-1FFVC1156I represents a powerful integration of processing and programmable logic for demanding embedded applications. With its quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processor, ARM Mali-400 GPU, and 504,000 logic cells of programmable fabric, this Zynq UltraScale+ MPSoC delivers the flexibility and performance needed for next-generation industrial, automotive, telecommunications, and aerospace systems.
The industrial temperature rating (-40°C to +100°C), comprehensive peripheral set, and high-speed serial connectivity make the XCZU7EG-1FFVC1156I an ideal choice for mission-critical applications requiring reliability, performance, and design flexibility.