Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7EG-1FFVC1156I: AMD Xilinx Zynq UltraScale+ MPSoC System-on-Chip

Product Details

The XCZU7EG-1FFVC1156I is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC family, combining a powerful quad-core ARM Cortex-A53 processor with advanced FPGA programmable logic. This industrial-grade embedded processor delivers exceptional computing capabilities for demanding applications in industrial automation, automotive systems, telecommunications, and aerospace. With 504,000 logic cells and advanced 16nm FinFET+ technology, the XCZU7EG-1FFVC1156I stands as one of the most versatile MPSoC devices available for complex embedded system designs.


XCZU7EG-1FFVC1156I Key Features and Specifications

The XCZU7EG-1FFVC1156I integrates processing system (PS) and programmable logic (PL) in a single device, enabling hardware-software co-design flexibility. Below are the complete technical specifications for this Zynq UltraScale+ MPSoC device.

Processor Specifications

Specification Details
Part Number XCZU7EG-1FFVC1156I
Manufacturer AMD (Xilinx)
Family Zynq UltraScale+ MPSoC EG
Application Processor Quad-core ARM Cortex-A53 MPCore with CoreSight
Real-Time Processor Dual-core ARM Cortex-R5F with CoreSight
Graphics Processor ARM Mali-400 MP2 GPU
Maximum Frequency 1.2 GHz (APU), 600 MHz (RPU), 500 MHz (GPU)

Programmable Logic Resources

Resource Quantity
System Logic Cells 504,000
CLB Flip-Flops 460,800
CLB LUTs 230,400
Distributed RAM (Kb) 3,600
Block RAM (Kb) 11,520
UltraRAM (Kb) 4,320
DSP Slices 1,728

Package and Electrical Specifications

Parameter Value
Package Type FCBGA (Flip Chip Ball Grid Array)
Package Size 35mm x 35mm
Pin Count 1156
Ball Pitch 1.0mm
Core Voltage (VCCINT) 0.85V
Speed Grade -1 (Industrial)
Temperature Range -40°C to +100°C
Process Technology 16nm FinFET+

Zynq UltraScale+ MPSoC EG Device Architecture

The XCZU7EG-1FFVC1156I belongs to the EG (Embedded GPU) variant of the Zynq UltraScale+ MPSoC family. This architecture delivers a powerful combination of application processing, real-time processing, graphics processing, and programmable logic capabilities.

Processing System (PS) Components

The processing system in the XCZU7EG-1FFVC1156I features a heterogeneous multi-processor architecture designed for diverse workloads.

Application Processing Unit (APU)

The quad-core ARM Cortex-A53 application processor provides 64-bit processing capability with the following features:

  • 32KB L1 instruction and data cache per core
  • 1MB shared L2 cache
  • ARM NEON SIMD engine
  • Hardware virtualization support
  • TrustZone security technology

Real-Time Processing Unit (RPU)

The dual-core ARM Cortex-R5F real-time processor delivers deterministic performance for time-critical applications:

  • 32KB L1 instruction and data cache per core
  • 128KB tightly-coupled memory (TCM)
  • Lock-step mode for safety-critical applications
  • Split mode for independent operation

Graphics Processing Unit (GPU)

The integrated ARM Mali-400 MP2 GPU provides hardware-accelerated graphics with:

  • OpenGL ES 1.1 and 2.0 support
  • OpenVG 1.1 support
  • Up to 667 million triangles per second
  • Anti-aliasing and texture filtering

Programmable Logic (PL) Capabilities

The XCZU7EG-1FFVC1156I programmable logic fabric offers extensive resources for custom hardware acceleration and peripheral implementation.

Configurable Logic Blocks (CLBs)

The UltraScale architecture CLBs provide enhanced functionality:

  • 8 LUTs per CLB (6-input look-up tables)
  • 16 flip-flops per CLB
  • SLICEM supports distributed RAM and shift registers
  • 8-bit carry chain per CLB
  • Wide multiplexer support for 7, 8, or 9-input functions

Digital Signal Processing (DSP)

The 1,728 DSP48E2 slices deliver exceptional signal processing performance:

  • 27×18 bit signed multiplier
  • 48-bit accumulator
  • Pre-adder for filter applications
  • Pattern detection
  • SIMD arithmetic support

Memory Resources

Multiple memory types enable flexible data storage solutions:

  • Block RAM: 36Kb dual-port memory blocks with ECC support
  • UltraRAM: 288Kb high-density memory blocks
  • Distributed RAM: LUT-based memory for small, fast storage
  • L3 Cache: 1MB shared cache for PS applications

Connectivity and I/O Interfaces

The XCZU7EG-1FFVC1156I provides comprehensive connectivity options for system integration.

High-Speed Serial Transceivers

Transceiver Type Data Rate Quantity
GTH Transceivers Up to 16.3 Gb/s 16
PS-GTR Transceivers Up to 6 Gb/s 4

Memory Interfaces

The device supports multiple external memory standards:

  • DDR4 up to 2400 MT/s
  • DDR3/DDR3L up to 1866 MT/s
  • LPDDR3/LPDDR4
  • QSPI Flash
  • NAND Flash
  • eMMC 4.51

Standard Peripherals

Interface Quantity Features
USB 2.0 2 Host, Device, OTG support
Gigabit Ethernet 4 IEEE 1588 PTP support
PCIe 2 Gen1/Gen2 x1, x2, x4
UART 2 Standard serial communication
I2C 2 Master/Slave support
SPI 2 Master/Slave support
CAN 2 CAN 2.0B compliant
GPIO 174 MIO and EMIO

XCZU7EG-1FFVC1156I Applications

The versatile architecture of the XCZU7EG-1FFVC1156I makes it suitable for numerous demanding applications.

Industrial Automation

  • Motor control systems
  • Industrial IoT gateways
  • Machine vision systems
  • Programmable logic controllers (PLCs)
  • Robotics control

Automotive Systems

  • Advanced Driver Assistance Systems (ADAS)
  • Infotainment systems
  • Camera-based sensing
  • Sensor fusion
  • Vehicle networking

Telecommunications

  • 5G wireless infrastructure
  • Software-defined networking (SDN)
  • Network function virtualization (NFV)
  • Base station processing
  • Packet processing

Aerospace and Defense

  • Radar signal processing
  • Electronic warfare systems
  • Avionics systems
  • Satellite communications
  • Secure communications

Medical Equipment

  • Medical imaging systems
  • Diagnostic equipment
  • Patient monitoring
  • Ultrasound systems
  • Surgical robotics

Development Tools and Software Support

AMD provides comprehensive development tools for the XCZU7EG-1FFVC1156I.

Vivado Design Suite

The Vivado Design Suite offers complete FPGA development capabilities:

  • RTL synthesis and implementation
  • IP Integrator for block-based design
  • High-Level Synthesis (HLS)
  • Timing analysis and optimization
  • Power estimation and analysis

Vitis Unified Software Platform

Vitis enables software and hardware acceleration development:

  • Embedded software development
  • AI inference acceleration
  • Application acceleration
  • Linux and RTOS support

PetaLinux Tools

PetaLinux provides embedded Linux development:

  • Yocto-based build system
  • Device tree customization
  • Kernel and driver development
  • Root filesystem configuration

Part Number Breakdown: XCZU7EG-1FFVC1156I

Understanding the part number helps identify device specifications:

Code Meaning
XC Xilinx Commercial
ZU Zynq UltraScale+
7 Device size (logic density)
EG Embedded GPU variant
-1 Speed grade (industrial performance)
FF Flip-chip package
V Lead-free
C Package type code
1156 Pin count
I Industrial temperature range

Where to Buy XCZU7EG-1FFVC1156I

The XCZU7EG-1FFVC1156I is available through authorized AMD distributors and electronic component suppliers. For engineers seeking this Zynq UltraScale+ MPSoC or other advanced programmable devices, explore our comprehensive selection of Xilinx FPGA products for competitive pricing and reliable sourcing.


Related Zynq UltraScale+ MPSoC Devices

Part Number Logic Cells Package Key Difference
XCZU7EG-2FFVC1156I 504,000 1156 FCBGA Higher speed grade (-2)
XCZU7EV-1FFVC1156I 504,000 1156 FCBGA Video codec support
XCZU9EG-1FFVC900I 599,550 900 FCBGA More logic resources
XCZU7CG-1FFVC1156I 504,000 1156 FCBGA No GPU (CG variant)
XCZU5EG-1FBVB900I 341,280 900 FBGA Smaller device option

Conclusion

The XCZU7EG-1FFVC1156I represents a powerful integration of processing and programmable logic for demanding embedded applications. With its quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processor, ARM Mali-400 GPU, and 504,000 logic cells of programmable fabric, this Zynq UltraScale+ MPSoC delivers the flexibility and performance needed for next-generation industrial, automotive, telecommunications, and aerospace systems.

The industrial temperature rating (-40°C to +100°C), comprehensive peripheral set, and high-speed serial connectivity make the XCZU7EG-1FFVC1156I an ideal choice for mission-critical applications requiring reliability, performance, and design flexibility.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.