The XCZU7CG-L2FBVB900E is a high-performance System-on-Chip (SoC) from AMD/Xilinx’s Zynq UltraScale+ MPSoC family. This advanced programmable logic device combines a powerful quad-core ARM Cortex-A53 processor with 504,000 logic cells, delivering exceptional computing power for industrial, automotive, and embedded applications. Built on 20nm technology and packaged in a 900-pin FCBGA, the XCZU7CG-L2FBVB900E offers unmatched flexibility for system designers seeking the ultimate balance between processing capability and power efficiency.
XCZU7CG-L2FBVB900E Key Features and Benefits
The XCZU7CG-L2FBVB900E belongs to the CG (Cost-optimized with Graphics-less) device family within the Zynq UltraScale+ portfolio. This makes it an ideal choice for applications requiring robust processing without dedicated GPU resources. The -L2 speed grade designation indicates this device is optimized for low-power operation while maintaining excellent performance characteristics.
Why Choose the XCZU7CG-L2FBVB900E for Your Design?
Engineers and system architects select the XCZU7CG-L2FBVB900E for several compelling reasons. First, the integration of heterogeneous processing elements eliminates the need for multiple discrete components. Second, the UltraScale+ architecture delivers superior performance-per-watt compared to previous generations. Third, the extensive I/O options support virtually any connectivity requirement in modern embedded systems.
XCZU7CG-L2FBVB900E Technical Specifications
The following tables provide comprehensive technical specifications for the XCZU7CG-L2FBVB900E Zynq UltraScale+ MPSoC.
General Device Information
| Parameter |
Specification |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCZU7CG-L2FBVB900E |
| Device Family |
Zynq UltraScale+ MPSoC |
| Device Type |
CG (Cost-optimized, Graphics-less) |
| Process Technology |
20nm |
| Speed Grade |
-2L (Low Power) |
| Temperature Range |
Extended (E): 0°C to +100°C (Tj) |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
900 Pins |
| Package Dimensions |
31mm × 31mm |
| Ball Pitch |
1.0mm |
| Packaging |
Tray |
Processing System (PS) Specifications
| Component |
Details |
| Application Processor |
Quad-core ARM Cortex-A53 MPCore with CoreSight |
| APU Clock Speed |
Up to 1.2 GHz |
| APU L1 Cache |
32KB Instruction / 32KB Data per core |
| APU L2 Cache |
1MB Shared |
| Real-Time Processor |
Dual-core ARM Cortex-R5F with CoreSight |
| RPU Clock Speed |
Up to 600 MHz |
| RPU L1 Cache |
32KB Instruction / 32KB Data per core |
| On-Chip Memory |
256KB with ECC |
| Floating Point |
Single/Double Precision Support |
Programmable Logic (PL) Resources
| Resource |
Quantity |
| System Logic Cells |
504,000 |
| CLB Flip-Flops |
460,800 |
| CLB LUTs |
230,400 |
| Distributed RAM (Mb) |
3.6 |
| Block RAM (36Kb Blocks) |
312 |
| Total Block RAM (Mb) |
11 |
| UltraRAM Blocks |
96 |
| Total UltraRAM (Mb) |
27 |
| DSP Slices |
1,728 |
Memory Interface Support
| Interface Type |
Specification |
| DDR4 |
Up to 2,400 Mb/s |
| DDR3/DDR3L |
Up to 1,866 Mb/s |
| LPDDR4 |
Up to 2,133 Mb/s |
| LPDDR3 |
Up to 1,066 Mb/s |
| Memory Controller |
Multi-Protocol Dynamic Memory Controller |
| External Flash |
Quad-SPI, NAND, eMMC |
I/O and Connectivity Features
| Feature |
Specification |
| Maximum User I/O |
252 |
| HP I/O Banks |
4 |
| HD I/O Banks |
3 |
| SelectIO Standards |
LVCMOS, LVDS, HSTL, SSTL, POD |
| USB Controllers |
2× USB 2.0 (Host/Device/OTG) |
| Gigabit Ethernet |
4× Tri-Speed MACs |
| UART |
2× Controllers |
| CAN Bus |
2× CAN 2.0B Controllers |
| I²C |
2× Controllers |
| SPI |
2× Controllers |
| GPIO |
128-bit (78 MIO + 96 EMIO) |
Power Specifications
| Parameter |
Value |
| Core Voltage (VCCINT) |
0.85V or 0.72V |
| Auxiliary Voltage (VCCAUX) |
1.8V |
| I/O Voltage Range |
1.0V to 3.3V |
| Low Power Features |
Screened for lower maximum static power |
| Power Modes |
Full Power Domain (FPD), Low Power Domain (LPD) |
XCZU7CG-L2FBVB900E Part Number Breakdown
Understanding the XCZU7CG-L2FBVB900E part number helps identify the exact device configuration:
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial |
| ZU7 |
ZU7 |
Zynq UltraScale+ Size 7 |
| CG |
CG |
Cost-optimized, Graphics-less |
| L2 |
L2 |
Low Power, Speed Grade -2 equivalent |
| F |
F |
Flip-Chip Package |
| BVB |
BVB |
Package Code |
| 900 |
900 |
900-Ball Count |
| E |
E |
Extended Temperature Range |
Applications for XCZU7CG-L2FBVB900E Zynq UltraScale+ MPSoC
The versatile architecture of the XCZU7CG-L2FBVB900E makes it suitable for demanding applications across multiple industries:
Industrial Automation and Control
The XCZU7CG-L2FBVB900E excels in industrial settings where real-time processing and deterministic response are critical. The dual ARM Cortex-R5 cores handle time-sensitive control loops while the Cortex-A53 cluster manages supervisory functions and human-machine interfaces.
Automotive Electronics
With extended temperature range certification (0°C to 100°C), the XCZU7CG-L2FBVB900E meets the rigorous requirements of automotive applications. Common implementations include advanced driver assistance systems (ADAS), infotainment processing, and vehicle network gateways.
Communications Infrastructure
The rich connectivity options and high-bandwidth memory interfaces make the XCZU7CG-L2FBVB900E ideal for wireless base stations, network switches, and software-defined networking equipment.
Medical and Healthcare Equipment
Medical imaging systems, patient monitoring devices, and diagnostic equipment benefit from the XCZU7CG-L2FBVB900E’s combination of processing power and programmable logic for custom algorithm acceleration.
Aerospace and Defense
Rugged systems in avionics, radar processing, and electronic warfare applications leverage the XCZU7CG-L2FBVB900E’s security features and reliable extended-temperature operation.
Development Tools and Software Support
The XCZU7CG-L2FBVB900E is fully supported by AMD’s comprehensive development ecosystem:
Vivado Design Suite
AMD’s Vivado Design Suite provides a complete environment for FPGA development, including synthesis, implementation, and debugging capabilities specifically optimized for UltraScale+ devices.
Vitis Unified Software Platform
The Vitis platform enables software developers to leverage the XCZU7CG-L2FBVB900E’s heterogeneous computing capabilities through familiar programming paradigms and accelerated libraries.
PetaLinux Tools
For embedded Linux development, PetaLinux provides a streamlined workflow for building, customizing, and deploying Linux-based systems on Zynq UltraScale+ MPSoCs.
Security Features
The XCZU7CG-L2FBVB900E incorporates enterprise-grade security features essential for protecting intellectual property and ensuring system integrity:
| Security Feature |
Description |
| AES-GCM Encryption |
256-bit hardware encryption for configuration bitstream |
| RSA Authentication |
4096-bit RSA for secure boot |
| SHA-3/384 |
Hardware hash acceleration |
| Secure Boot |
Configuration Security Unit (CSU) |
| Key Storage |
eFUSE or battery-backed RAM options |
| Anti-Tamper |
Physical security monitoring |
XCZU7CG-L2FBVB900E vs Related Devices
When selecting the optimal device for your application, consider these related Zynq UltraScale+ MPSoC options:
| Part Number |
Key Difference |
| XCZU7CG-1FBVB900I |
Standard speed grade, Industrial temperature |
| XCZU7CG-2FBVB900E |
Standard power, Speed grade -2 |
| XCZU7EG-L2FBVB900E |
EG variant with GPU (Mali-400 MP2) |
| XCZU7EV-L2FBVB900E |
EV variant with H.264/H.265 video codec |
| XCZU9CG-L2FFVC900E |
Larger device with more logic resources |
Where to Buy XCZU7CG-L2FBVB900E
The XCZU7CG-L2FBVB900E is available through authorized AMD distributors worldwide. For competitive pricing and technical support on this and other Xilinx FPGA devices, contact a trusted supplier who can provide genuine components with full manufacturer warranty.
XCZU7CG-L2FBVB900E Datasheet and Documentation
Engineers designing with the XCZU7CG-L2FBVB900E should reference these essential documents from AMD:
| Document |
Description |
| DS891 |
Zynq UltraScale+ MPSoC Overview |
| DS925 |
DC and AC Switching Characteristics |
| UG1085 |
Zynq UltraScale+ MPSoC Technical Reference Manual |
| UG1075 |
Packaging and Pinouts Product Specification |
| PG201 |
Zynq UltraScale+ MPSoC Processing System |
Frequently Asked Questions About XCZU7CG-L2FBVB900E
What is the difference between CG, EG, and EV variants?
The XCZU7CG-L2FBVB900E belongs to the CG (Cost-optimized, Graphics-less) family. EG variants add an ARM Mali-400 MP2 GPU for graphics processing. EV variants include both the GPU and an integrated H.264/H.265 video codec for multimedia applications.
What operating voltage does the XCZU7CG-L2FBVB900E support?
The -L2 speed grade devices can operate at either 0.85V or 0.72V VCCINT. At 0.85V, performance matches the standard -2I/-2E speed grades. At 0.72V, both performance and power consumption are reduced.
Is the XCZU7CG-L2FBVB900E suitable for safety-critical applications?
Yes, the Zynq UltraScale+ MPSoC family, including the XCZU7CG-L2FBVB900E, supports functional safety certification up to ISO 26262 ASIL-C for automotive and IEC 61508 SIL-3 for industrial applications.
What is the typical lead time for XCZU7CG-L2FBVB900E?
Lead times vary based on market conditions. Current lead times typically range from 25-52 weeks. Contact authorized distributors for the most accurate availability information.
Conclusion
The XCZU7CG-L2FBVB900E represents AMD/Xilinx’s commitment to delivering high-performance, power-efficient programmable solutions for demanding embedded applications. With its quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processor, and 504,000 logic cells of programmable fabric, this Zynq UltraScale+ MPSoC provides the perfect foundation for next-generation industrial, automotive, and communications systems.
Whether you’re designing advanced motor control systems, implementing software-defined radio, or building intelligent edge computing platforms, the XCZU7CG-L2FBVB900E delivers the performance, flexibility, and reliability your application demands.
