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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7CG-L1FFVC1156I: AMD Xilinx Zynq UltraScale+ MPSoC FPGA

Product Details

The XCZU7CG-L1FFVC1156I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family, designed for industrial applications requiring powerful processing capabilities with optimized power consumption. This industrial-grade embedded processor combines dual-core ARM Cortex-A53 application processors with programmable logic in a single device, making it ideal for cost-sensitive embedded designs.

XCZU7CG-L1FFVC1156I Overview

The XCZU7CG-L1FFVC1156I belongs to the CG (Cost-optimized General-purpose) series within the Zynq UltraScale+ family. Built on advanced 16nm FinFET+ technology, this Xilinx FPGA delivers exceptional performance-per-watt while maintaining industrial-grade reliability across demanding operating environments.

Part Number Breakdown

Element Meaning
XC Xilinx Component
ZU7 Zynq UltraScale+ 7 Series
CG Cost-optimized General-purpose Device
L1 Low Power, Speed Grade 1
FF Flip-Chip Fine-pitch BGA
VC Ball Configuration Code
1156 1156-Ball FCBGA Package
I Industrial Temperature Grade

Key Specifications and Features

Processing System Architecture

The XCZU7CG-L1FFVC1156I integrates a powerful multi-processor system with real-time processing capabilities:

Specification Details
Application Processor Dual-core ARM Cortex-A53 MPCore with CoreSight
Real-Time Processor Dual-core ARM Cortex-R5 with CoreSight
APU Architecture ARMv8 64-bit
APU Clock Speed Up to 1.2 GHz
RPU Architecture ARMv7 32-bit
RPU Clock Speed Up to 500 MHz
Performance 2.3 DMIPS/MHz

Programmable Logic Resources

The XCZU7CG-L1FFVC1156I provides substantial FPGA fabric for custom hardware acceleration:

Resource Quantity
Logic Cells 504,000+
CLB Flip-Flops 460,800
CLB LUTs 230,400
Block RAM 11.0 Mb
UltraRAM 4.0 Mb
DSP Slices 1,728

Package and Electrical Characteristics

Parameter Value
Package Type 1156-FCBGA (Flip-Chip Ball Grid Array)
Package Dimensions 35mm × 35mm
Ball Pitch 1.0mm
Core Voltage (VCCINT) 0.85V or 0.72V
Process Technology 16nm FinFET+
Operating Temperature -40°C to +100°C (Junction)
Temperature Grade Industrial (I)
RoHS Status Compliant
Moisture Sensitivity Level MSL-3

Low Power Operation Benefits

The “L1” designation in XCZU7CG-L1FFVC1156I indicates this device is specifically screened for lower maximum static power consumption. When operated at VCCINT = 0.85V, the device maintains the same speed specifications as standard -1I speed grade devices. Operating at VCCINT = 0.72V further reduces both performance and static/dynamic power, enabling ultra-low-power designs for battery-operated or thermally constrained applications.

Industrial Applications

The XCZU7CG-L1FFVC1156I excels in applications requiring a combination of software programmability and hardware acceleration:

Embedded Vision and Imaging

The integrated processing system and programmable logic make this device ideal for real-time image processing, machine vision inspection systems, and video analytics platforms.

Industrial Automation and Control

With dual ARM Cortex-R5 real-time processors supporting lock-step mode for safety-critical functions, the XCZU7CG-L1FFVC1156I is well-suited for PLC controllers, motion control systems, and industrial IoT gateways.

Communications Infrastructure

The extensive I/O capabilities and high-speed transceivers enable applications in software-defined radio, 5G small cells, and network packet processing equipment.

Medical and Scientific Equipment

The industrial temperature rating and deterministic real-time processing make this SoC appropriate for portable medical devices, laboratory instrumentation, and diagnostic equipment.

Development Tools and Software Support

AMD provides comprehensive development support for the XCZU7CG-L1FFVC1156I:

Tool/Resource Description
Vivado Design Suite Integrated development environment for FPGA design
Vitis Unified Platform Software development and AI acceleration
PetaLinux Tools Embedded Linux development
Xilinx Power Estimator (XPE) Power consumption analysis and optimization
Reference Designs Pre-validated application examples

XCZU7CG-L1FFVC1156I Ordering Information

Attribute Details
Manufacturer AMD (formerly Xilinx)
Part Number XCZU7CG-L1FFVC1156I
Family Zynq UltraScale+ MPSoC
Series CG (Cost-optimized)
Packaging Tray
Lead Time Contact distributor

Why Choose XCZU7CG-L1FFVC1156I?

The XCZU7CG-L1FFVC1156I offers an optimal balance of processing power, programmable logic resources, and power efficiency for industrial embedded applications. Its low-power screening ensures reliable operation in thermally challenging environments while maintaining performance parity with standard speed grade devices. The combination of 64-bit application processing, real-time control capabilities, and over 504,000 logic cells in a single chip significantly reduces board complexity and system cost.

Frequently Asked Questions

What is the difference between XCZU7CG and XCZU7EG?

The CG variant features dual-core ARM Cortex-A53 processors and no GPU, while the EG variant includes quad-core Cortex-A53 processors and Mali-400 MP2 graphics processing unit for video codec and graphics acceleration applications.

What does the “L1” speed grade mean?

The L1 designation indicates a low-power screened device at speed grade 1. These devices are tested for lower maximum static power and can operate at reduced core voltage (0.72V) for additional power savings.

Is XCZU7CG-L1FFVC1156I suitable for automotive applications?

This specific part carries an Industrial (I) temperature rating. For automotive applications, consider the automotive-qualified (Q grade) variants from the same family.

What operating systems are supported?

The XCZU7CG-L1FFVC1156I supports Linux (PetaLinux), FreeRTOS, VxWorks, and bare-metal applications. The ARM Cortex-A53 processors enable full operating system support with hardware virtualization capabilities.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.