The XCZU7CG-L1FBVB900I is a high-performance System-on-Chip (SoC) from AMD/Xilinx’s Zynq UltraScale+ MPSoC family. This industrial-grade device combines powerful ARM processing capabilities with advanced programmable logic, making it the ideal solution for embedded systems requiring exceptional computational power and flexibility. As a leading Xilinx FPGA, the XCZU7CG-L1FBVB900I delivers enterprise-level performance in a cost-optimized package designed for demanding industrial applications.
XCZU7CG-L1FBVB900I Key Features and Benefits
The XCZU7CG-L1FBVB900I belongs to the CG (Cost-optimized GPU-less) device family within the Zynq UltraScale+ MPSoC portfolio. This variant provides an optimal balance between processing performance and power efficiency, specifically designed for applications where graphics processing is not required but high-speed data processing and real-time control are essential.
Why Choose the XCZU7CG-L1FBVB900I?
Engineers and system designers select this device for several compelling reasons. The low-power L1 variant operates at reduced voltage levels while maintaining industrial temperature compliance. This combination makes the XCZU7CG-L1FBVB900I particularly attractive for thermally constrained environments and battery-powered applications.
XCZU7CG-L1FBVB900I Technical Specifications
Core Processor Specifications
| Parameter |
Specification |
| Application Processor |
Dual-core ARM Cortex-A53 MPCore with CoreSight |
| Processor Speed |
Up to 1.2 GHz |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| L2 Cache |
1MB Shared |
| Real-Time Processor |
Dual-core ARM Cortex-R5 with CoreSight |
| RPU Speed |
Up to 500 MHz |
| Floating Point |
Single and Double Precision |
| NEON Support |
Yes |
Programmable Logic Specifications
| Parameter |
Specification |
| Logic Cells |
504,000 (504K) |
| System Logic Cells |
504K |
| CLB Flip-Flops |
460,800 |
| CLB LUTs |
230,400 |
| Distributed RAM |
3.6 Mb |
| Block RAM |
11 Mb |
| UltraRAM |
12 Mb |
| DSP Slices |
1,728 |
Package and Electrical Characteristics
| Parameter |
Specification |
| Package Type |
FCBGA (Flip Chip Ball Grid Array) |
| Package Code |
FBVB900 |
| Pin Count |
900 Pins |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Process Technology |
20nm |
| Core Voltage (VCCINT) |
0.85V or 0.72V |
| Speed Grade |
L1 (Low Power) |
| Temperature Range |
Industrial (-40°C to +100°C) |
XCZU7CG-L1FBVB900I Speed Grade and Power Options
Understanding the L1 Speed Grade
The “L” designation in XCZU7CG-L1FBVB900I indicates a low-power variant specifically engineered for reduced power consumption. Available speed grades within the Zynq UltraScale+ family include -3, -2, and -1, with -3E devices delivering the highest performance levels.
| Speed Grade |
Characteristics |
| -3E |
Highest performance |
| -3 |
High performance |
| -2 |
Standard performance |
| -2LE |
Low power, standard performance at 0.85V |
| -1 |
Base performance |
| -1LI |
Low power, industrial temperature |
| L1 |
Low power variant with -1 speed at reduced voltage |
Low Power Operation Modes
The XCZU7CG-L1FBVB900I supports two distinct operating voltage modes. When operated at VCCINT = 0.85V, the device maintains speed specifications equivalent to standard -1I speed grade devices. Operating at VCCINT = 0.72V reduces both performance and static/dynamic power consumption, providing designers with flexibility to optimize for their specific power budget requirements.
XCZU7CG-L1FBVB900I Memory Interface Capabilities
DDR Memory Support
| Memory Type |
Maximum Data Rate |
Interface Width |
| DDR4 |
Up to 2400 Mb/s |
64-bit with ECC |
| DDR3/DDR3L |
Up to 2133 Mb/s |
64-bit with ECC |
| LPDDR4 |
Up to 4266 Mb/s |
32-bit |
| LPDDR3 |
Up to 2133 Mb/s |
32-bit |
On-Chip Memory Resources
The XCZU7CG-L1FBVB900I provides extensive on-chip memory resources critical for high-bandwidth applications. Block RAM delivers high-speed local storage, while UltraRAM provides larger capacity memory blocks ideal for buffering and data processing pipelines.
XCZU7CG-L1FBVB900I I/O and Connectivity Features
Processing System I/O
| Interface |
Specification |
| PS I/O Pins |
214 Maximum |
| UART |
Multiple channels |
| CAN |
2.0B compliant |
| USB |
2.0 with OTG support |
| I2C |
Multiple channels |
| SPI |
Multiple channels |
| GPIO |
32-bit |
| Ethernet |
Gigabit MAC |
High-Speed Transceivers
The XCZU7CG-L1FBVB900I incorporates PS-GTR transceivers supporting multiple high-speed protocols. These transceivers enable connectivity for DisplayPort, USB 3.0, SATA, SGMII, and PCIe interfaces, providing system designers with extensive protocol flexibility.
XCZU7CG-L1FBVB900I Application Areas
Industrial Automation and Control
The industrial temperature rating and low-power characteristics make the XCZU7CG-L1FBVB900I exceptionally suitable for factory automation systems, motor drives, programmable logic controllers (PLCs), and industrial networking equipment.
Communications Infrastructure
Telecommunications equipment manufacturers leverage this SoC for wireless infrastructure, network processing, and protocol conversion applications where deterministic real-time performance is mandatory.
Aerospace and Defense
The robust operating temperature range and industrial qualification support deployment in avionics systems, radar processing, electronic warfare platforms, and military communications systems requiring extended temperature operation.
Medical Equipment
Medical imaging systems, patient monitoring equipment, and diagnostic instruments benefit from the combination of real-time processing capabilities and programmable logic flexibility.
XCZU7CG-L1FBVB900I Development Tools and Software Support
Vivado Design Suite
AMD/Xilinx’s Vivado Design Suite provides comprehensive FPGA development capabilities including synthesis, implementation, timing analysis, and debugging. The integrated development environment streamlines the design flow from RTL specification through bitstream generation.
Vitis Unified Software Platform
For software developers targeting the ARM processing system, the Vitis platform delivers familiar embedded software development workflows including compilation, debugging, and profiling capabilities across the dual Cortex-A53 and dual Cortex-R5 processor subsystems.
Petalinux
AMD provides PetaLinux tools specifically optimized for Zynq UltraScale+ devices, enabling rapid Linux-based embedded system development with pre-configured board support packages and kernel customization utilities.
XCZU7CG-L1FBVB900I Comparison with Related Devices
| Part Number |
Processor Cores |
GPU |
Primary Application |
| XCZU7CG-L1FBVB900I |
Dual A53 + Dual R5 |
None |
Cost-optimized industrial |
| XCZU7EG-L1FBVB900I |
Quad A53 + Dual R5 |
Mali-400 MP2 |
Graphics-enabled |
| XCZU7EV-L1FBVB900I |
Quad A53 + Dual R5 |
Mali-400 MP2 + VCU |
Video processing |
XCZU7CG-L1FBVB900I Ordering Information
Part Number Breakdown
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU7 |
Zynq UltraScale+ Size 7 |
| CG |
Cost-optimized, GPU-less |
| L1 |
Low-power, -1 speed grade |
| FBV |
Flip-chip BGA, 1.0mm pitch, Pb-free |
| B900 |
900-ball package |
| I |
Industrial temperature range |
Package Marking
Devices are supplied in tray packaging format suitable for automated pick-and-place assembly operations. The 900-pin FCBGA package uses RoHS-compliant lead-free ball composition.
XCZU7CG-L1FBVB900I Design Considerations
Power Supply Sequencing
Proper power supply sequencing is critical for reliable device operation. The low-power domain (LPD) must reach operating voltage before the full-power domain (FPD) can initialize. Designers must ensure all power rails meet minimum current requirements during power-on configuration.
Thermal Management
Industrial temperature operation from -40°C to +100°C junction temperature requires careful thermal design. Heat sink selection, airflow management, and PCB thermal relief patterns must accommodate worst-case power dissipation scenarios.
Signal Integrity
The 1.0mm ball pitch of the FBVB900 package necessitates careful PCB design attention. High-speed differential pairs require controlled impedance routing, and DDR memory interfaces demand precise trace length matching.
Conclusion
The XCZU7CG-L1FBVB900I represents an outstanding choice for engineers requiring a cost-optimized Zynq UltraScale+ MPSoC with industrial-grade reliability. Combining dual ARM Cortex-A53 application processors, dual ARM Cortex-R5 real-time processors, and 504K logic cells of programmable fabric, this device delivers exceptional versatility for next-generation embedded systems. The low-power L1 variant enables deployment in power-constrained applications while maintaining full industrial temperature compliance.
For system designs requiring graphics processing or video codec capabilities, consider the EG or EV variants within the Zynq UltraScale+ portfolio. The XCZU7CG-L1FBVB900I remains the optimal selection when maximum processing density and programmable logic resources are required without integrated GPU functionality
