Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7CG-2FFVF1517I: AMD Xilinx Zynq UltraScale+ MPSoC FPGA | Complete Technical Guide

Product Details

The XCZU7CG-2FFVF1517I is a high-performance System on Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC family, engineered for industrial-grade embedded applications requiring exceptional processing power and programmable logic flexibility. This advanced FPGA integrates dual ARM Cortex-A53 processors with powerful programmable logic, making it ideal for edge computing, industrial automation, and high-speed signal processing applications.


XCZU7CG-2FFVF1517I Key Features and Benefits

The XCZU7CG-2FFVF1517I combines the flexibility of FPGA programmable logic with the processing capability of a multi-core ARM processor system. Built on AMD’s advanced 20nm FinFET technology, this device delivers industry-leading performance-per-watt efficiency for demanding embedded applications.

Why Choose XCZU7CG-2FFVF1517I for Your Design

  • 504K+ System Logic Cells for complex digital designs
  • Industrial Temperature Range (-40°C to +100°C) ensures reliable operation
  • Dual ARM Cortex-A53 Application Processor running up to 1.3GHz
  • Dual ARM Cortex-R5 Real-Time Processor for deterministic control
  • Integrated High-Speed Connectivity including PCIe Gen2, USB 3.0, and SATA 3.1
  • Advanced Security Features with AES encryption and secure boot

XCZU7CG-2FFVF1517I Technical Specifications

General Device Information

Specification Value
Manufacturer AMD (formerly Xilinx)
Part Number XCZU7CG-2FFVF1517I
Family Zynq UltraScale+ MPSoC
Device Type CG (Cost-optimized Grade)
Technology Node 20nm FinFET
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Size 40mm × 40mm
Pin Count 1517 Balls
Speed Grade -2 (High Performance)
Temperature Grade Industrial (I): -40°C to +100°C
Core Voltage (VCCINT) 0.85V
RoHS Status Compliant

Processing System (PS) Specifications

Component Specification
Application Processing Unit (APU) Dual-core ARM Cortex-A53 MPCore
APU Maximum Frequency Up to 1.3GHz
APU L1 Cache 32KB Instruction / 32KB Data per core
APU L2 Cache 1MB Shared with ECC
Real-Time Processing Unit (RPU) Dual-core ARM Cortex-R5 MPCore
RPU Maximum Frequency Up to 533MHz
RPU L1 Cache 32KB I / 32KB D per core
Tightly Coupled Memory (TCM) 128KB per core with ECC
On-Chip Memory (OCM) 256KB with ECC

Programmable Logic (PL) Resources

Resource Quantity
System Logic Cells 504,000+
CLB Flip-Flops 460,800
Block RAM 11Mb Total
UltraRAM Available
DSP Slices High-performance DSP48E2
Maximum User I/O 464
High-Performance I/O Banks Multiple HP Banks
High-Density I/O Banks Multiple HD Banks
GTH Transceivers 16.3Gb/s capable

XCZU7CG-2FFVF1517I Memory Interface Support

The XCZU7CG-2FFVF1517I provides comprehensive memory controller support for various DDR memory standards, enabling high-bandwidth data processing applications.

Supported Memory Types

Memory Standard Bus Width Features
DDR4 32/64-bit With ECC Support
DDR3/DDR3L 32/64-bit With ECC Support
LPDDR4 32/64-bit Low Power Mode
LPDDR3 32/64-bit Mobile Applications

Static Memory Interfaces

  • Quad-SPI Flash – Dual Quad-SPI controllers for boot and storage
  • NAND Flash – ONFI 3.1 compliant interface

High-Speed Connectivity Features of XCZU7CG-2FFVF1517I

Integrated High-Speed Interfaces

Interface Specification Lanes/Ports
PCIe Gen2 x4 Root Complex/Endpoint
USB 3.0 SuperSpeed 5Gb/s 2 Ports
USB 2.0 High-Speed 480Mb/s 2 Ports
SATA 3.1 6Gb/s 2 Ports
DisplayPort v1.2a Audio/Video Output
Gigabit Ethernet Tri-mode 10/100/1000 4 Controllers

General Purpose Connectivity

Interface Ports Notes
UART 2 Serial Communication
CAN 2.0B 2 Industrial Networking
I2C 2 Sensor Interface
SPI 2 Peripheral Control
SD/SDIO 2 Storage Interface
GPIO 4 × 32-bit General Purpose I/O

XCZU7CG-2FFVF1517I Security and Power Management

Advanced Security Features

The XCZU7CG-2FFVF1517I incorporates enterprise-grade security capabilities essential for industrial and military applications:

  • AES-256 Decryption – Hardware-accelerated bitstream encryption
  • RSA Authentication – Secure boot verification
  • SHA-3 Hashing – Data integrity verification
  • Anti-Tamper Features – Secure key storage
  • TrustZone Technology – Isolated secure processing environment

Intelligent Power Management

Power Domain Description
Full Power Domain (FPD) APU and high-performance peripherals
Low Power Domain (LPD) RPU and essential peripherals
PL Power Domain Programmable Logic
Battery Power Domain RTC and secure storage

XCZU7CG-2FFVF1517I Package Information

1517 FCBGA Package Details

Parameter Specification
Package Code FFVF1517
Ball Pitch 1.0mm
Body Size 40mm × 40mm
Ball Count 1517
Mounting Type Surface Mount
Height 2.74mm (typical)
Moisture Sensitivity Level MSL-3

XCZU7CG-2FFVF1517I Development Tools and Software

Vivado Design Suite Compatibility

The XCZU7CG-2FFVF1517I is fully supported by AMD’s Vivado Design Suite, providing comprehensive tools for hardware development, simulation, and implementation.

Supported Vivado Features:

  • High-Level Synthesis (HLS) for C/C++ to RTL conversion
  • IP Integrator for block-based design
  • Advanced timing analysis and optimization
  • Power estimation and optimization tools
  • Debug cores (ILA, VIO, JTAG)

Vitis Unified Software Platform

For software development on the ARM processors:

  • Bare-metal application development
  • Linux and RTOS support (PetaLinux, FreeRTOS)
  • AI/ML acceleration libraries
  • OpenCL runtime support

Target Applications for XCZU7CG-2FFVF1517I

The XCZU7CG-2FFVF1517I is optimized for a wide range of industrial and commercial applications:

Industrial Automation

  • Programmable Logic Controllers (PLC)
  • Motion control systems
  • Industrial robotics
  • Machine vision systems

Communications Infrastructure

  • 5G base station processing
  • Software-defined networking
  • Packet processing and routing
  • Network security appliances

Medical and Healthcare

  • Medical imaging systems
  • Patient monitoring equipment
  • Diagnostic instrumentation
  • Surgical robotics

Aerospace and Defense

  • Radar signal processing
  • Electronic warfare systems
  • Secure communications
  • Avionics systems

Edge Computing

  • AI inference acceleration
  • Real-time data analytics
  • IoT gateway devices
  • Smart city infrastructure

XCZU7CG-2FFVF1517I Ordering Information

Part Number Breakdown

XCZU7CG-2FFVF1517I
│  │  │ │  │   │
│  │  │ │  │   └─ Temperature Grade: I = Industrial (-40°C to +100°C)
│  │  │ │  └───── Pin Count: 1517
│  │  │ └──────── Package: FFVF = Flip-Chip Fine-pitch BGA
│  │  └────────── Speed Grade: -2 = High Performance
│  └───────────── Device Type: CG = Cost-optimized Grade
└──────────────── Device: ZU7 = Zynq UltraScale+ 7

Available Speed Grades

Speed Grade Performance Level Operating Frequency
-1 Standard APU: 1.2GHz, RPU: 500MHz
-2 High Performance APU: 1.3GHz, RPU: 533MHz
-3 Highest Performance APU: 1.5GHz, RPU: 600MHz

Related Zynq UltraScale+ MPSoC Devices

Part Number Logic Cells Package Features
XCZU7CG-2FFVC1156I 504K+ 1156 FCBGA Compact Package
XCZU7CG-2FBVB900I 504K+ 900 FCBGA Smallest Footprint
XCZU7EG-2FFVF1517I 504K+ 1517 FCBGA With Mali GPU
XCZU9CG-2FFVF1517I 600K+ 1517 FCBGA Higher Logic Capacity

Where to Buy XCZU7CG-2FFVF1517I

The XCZU7CG-2FFVF1517I is available through authorized AMD distributors worldwide. For competitive pricing and stock availability on this and other Xilinx FPGA products, contact your local distributor or visit authorized electronics component suppliers.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.