Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7CG-2FFVF1517E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA

Product Details

The XCZU7CG-2FFVF1517E is a high-performance System on Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This advanced FPGA integrates dual-core ARM Cortex-A53 processors with powerful programmable logic, delivering exceptional computing capabilities for industrial automation, embedded vision, and edge computing applications. Built on 16nm FinFET+ technology, this device offers 504K+ logic cells and comprehensive connectivity options in a 1517-FCBGA package.

XCZU7CG-2FFVF1517E Key Features and Specifications

The XCZU7CG-2FFVF1517E combines the flexibility of programmable logic with the performance of dedicated processing cores. This Xilinx FPGA device delivers industry-leading power efficiency while maintaining high computational throughput for demanding applications.

Processing System Specifications

Parameter Specification
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™
Real-Time Processor Dual ARM® Cortex™-R5F with CoreSight™
Maximum Clock Speed 1.3 GHz (APU), 533 MHz (RPU)
On-Chip RAM 256 KB
Cache Support L1 and L2 with ECC
Architecture MCU + FPGA Hybrid

Programmable Logic Resources

Resource Value
System Logic Cells 504,000+
CLB Flip-Flops 460,800
CLB LUTs 230,400
Block RAM 11 Mb
DSP Slices 1,728
Maximum User I/O 464
Technology Node 16nm FinFET+

XCZU7CG-2FFVF1517E Package and Electrical Characteristics

Package Information

Specification Details
Package Type 1517-FCBGA (Fine-pitch Ball Grid Array)
Package Dimensions 40mm x 40mm
Ball Pitch 1.0mm
Pin Count 1517
Mounting Type Surface Mount
Speed Grade -2 (Extended Temperature)

Electrical Specifications

Parameter Value
Core Voltage (VCCINT) 0.85V
Operating Temperature 0°C to +100°C (TJ)
Temperature Grade Extended (E)
Part Status Active
Moisture Sensitivity Level MSL-3

Connectivity and Interface Options

The XCZU7CG-2FFVF1517E provides comprehensive connectivity for diverse application requirements.

Supported Communication Protocols

Interface Type Details
Ethernet Quad Gigabit Ethernet MAC
USB USB 2.0 OTG (Host/Device/OTG)
Serial UART/USART, SPI, I²C
Automotive CAN 2.0B (ISO11898-1)
Storage MMC/SD/SDIO, NAND, Quad SPI
Memory Interface EBI/EMI
High-Speed Serial PS-GTR Transceivers (up to 6.0 Gb/s)

Peripheral Features

Feature Description
DMA Controller Multi-channel Direct Memory Access
Watchdog Timer Hardware WDT for system reliability
GPIO 128-bit (78 MIO + 96 EMIO)
Interrupt Controller ARM GIC-400
System Monitor On-chip temperature and voltage monitoring

Zynq UltraScale+ MPSoC Architecture Benefits

Heterogeneous Processing Power

The XCZU7CG-2FFVF1517E leverages AMD Xilinx’s UltraScale+ MPSoC architecture to deliver heterogeneous computing capabilities. The dual ARM Cortex-A53 application processing unit handles complex software workloads, while the dual ARM Cortex-R5F real-time processing unit manages time-critical operations with deterministic response times.

Advanced Programmable Logic

Built on the UltraScale+ fabric, this device features 6-input look-up tables (LUTs) and high-performance DSP slices with 27×18 multipliers. The 36Kb block RAMs with built-in FIFO and ECC support enable efficient data buffering and processing for applications requiring high memory bandwidth.

Power Efficiency

The -2 speed grade variant operates at 0.85V core voltage, providing an optimal balance between performance and power consumption. The 16nm FinFET+ process technology ensures industry-leading power efficiency for battery-powered and thermally constrained applications.

Target Applications for XCZU7CG-2FFVF1517E

Industrial and Embedded Applications

  • Industrial automation and control systems
  • Motor drive and robotics
  • Machine vision and image processing
  • Industrial IoT gateways
  • PLC and DCS controllers

Communications and Networking

  • 5G wireless infrastructure
  • Software-defined radio (SDR)
  • Network packet processing
  • Protocol bridging and conversion

Automotive and Transportation

  • Advanced driver assistance systems (ADAS)
  • In-vehicle infotainment
  • Telematics and connectivity
  • Sensor fusion applications

Medical and Scientific

  • Medical imaging equipment
  • Diagnostic instrumentation
  • Laboratory automation
  • Data acquisition systems

XCZU7CG-2FFVF1517E vs. Alternative Part Numbers

Part Number Speed Grade Temperature Range Package
XCZU7CG-2FFVF1517E -2 Extended (0°C to 100°C) 1517-FCBGA
XCZU7CG-2FFVF1517I -2 Industrial (-40°C to 100°C) 1517-FCBGA
XCZU7CG-1FFVF1517E -1 Extended (0°C to 100°C) 1517-FCBGA
XCZU7CG-2FFVC1156E -2 Extended (0°C to 100°C) 1156-FCBGA

Development Tools and Software Support

Vivado Design Suite Compatibility

The XCZU7CG-2FFVF1517E is fully supported by AMD Xilinx Vivado Design Suite, providing comprehensive tools for hardware design, implementation, and debugging. The integrated development environment supports IP-based design methodologies and automated design flows.

Software Development

  • Vitis Unified Software Platform
  • PetaLinux embedded Linux distribution
  • FreeRTOS for real-time applications
  • Bare-metal application development

Ordering Information Summary

Parameter Details
Manufacturer Part Number XCZU7CG-2FFVF1517E
Manufacturer AMD (formerly Xilinx)
Product Category Embedded – System On Chip (SoC)
Product Family Zynq UltraScale+ MPSoC
Device Variant CG (Cost-optimized without GPU/VCU)
RoHS Status Compliant
Lead-Free Status Lead-Free
Packaging Tray

Conclusion

The XCZU7CG-2FFVF1517E represents an excellent choice for engineers seeking a cost-effective, high-performance SoC FPGA solution. With its powerful dual-core ARM Cortex-A53 processors, extensive programmable logic resources, and comprehensive connectivity options, this Zynq UltraScale+ MPSoC device enables rapid development of sophisticated embedded systems across industrial, communications, automotive, and medical applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.