The XCZU7CG-2FBVB900I is a high-performance Zynq UltraScale+ MPSoC from AMD Xilinx, featuring a quad-core ARM Cortex-A53 processor, 504K+ logic cells, and advanced 16nm FinFET+ technology. This industrial-grade SoC FPGA delivers exceptional processing power for embedded vision, industrial IoT, and edge computing applications.
XCZU7CG-2FBVB900I Product Overview
The XCZU7CG-2FBVB900I belongs to AMD Xilinx’s Zynq UltraScale+ MPSoC CG family, combining a powerful processing system (PS) with programmable logic (PL) in a single device. This heterogeneous computing platform enables designers to implement complex system-on-chip designs with hardware acceleration capabilities.
As a leading Xilinx FPGA solution, this MPSoC integrates multiple ARM processor cores with UltraScale+ programmable fabric, delivering unprecedented flexibility for real-time processing and custom hardware acceleration.
Key Technical Specifications for XCZU7CG-2FBVB900I
General Device Specifications
| Parameter |
Specification |
| Manufacturer Part Number |
XCZU7CG-2FBVB900I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Type |
CG Device (Cost-Optimized) |
| Process Technology |
16nm/20nm FinFET+ |
| Speed Grade |
-2 (Standard Performance) |
| Temperature Grade |
Industrial (I): -40°C to +100°C (TJ) |
ARM Processing System (PS) Specifications
| Processor Feature |
Details |
| Application Processor |
Quad-core ARM Cortex-A53 MPCore |
| APU Max Frequency |
Up to 1.5 GHz |
| Real-Time Processor |
Dual-core ARM Cortex-R5F |
| RPU Max Frequency |
Up to 600 MHz |
| On-Chip Memory (OCM) |
256 KB |
| Debug & Trace |
ARM CoreSight Technology |
Programmable Logic (PL) Resources
| FPGA Resource |
Quantity |
| System Logic Cells |
504,000+ |
| CLB Flip-Flops |
461,000+ |
| Look-Up Tables (LUTs) |
230,000+ (6-input) |
| DSP Slices |
1,728 DSP48E2 |
| Block RAM |
11 Mb (36Kb blocks) |
| UltraRAM |
4 Mb (288Kb blocks) |
Package and Electrical Specifications
| Package Parameter |
Value |
| Package Type |
FCBGA (Flip Chip Ball Grid Array) |
| Pin Count |
900 Pins |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Core Voltage (VCCINT) |
0.85V |
| Packaging |
Tray |
Connectivity and Peripheral Interfaces
Integrated Communication Peripherals
The XCZU7CG-2FBVB900I includes a comprehensive set of hardened peripheral interfaces in the processing system:
- USB 2.0/3.0 OTG Controllers
- Gigabit Ethernet MAC with IEEE 1588
- SD/SDIO/eMMC Controllers
- SPI Controllers (Quad-SPI support)
- I2C Controllers
- UART Interfaces
- CAN 2.0B Controllers
- GPIO with interrupt support
External Memory Interface Support
The device supports high-performance DDR memory interfaces including DDR4, LPDDR4, DDR3, and DDR3L with ECC support through dedicated memory controller blocks in the PS.
Target Applications for XCZU7CG-2FBVB900I
The XCZU7CG-2FBVB900I MPSoC FPGA is ideally suited for demanding embedded applications requiring both software programmability and hardware acceleration:
- Industrial Automation and Motor Control Systems
- Embedded Vision and Machine Learning Inference
- Edge Computing and IoT Gateways
- Software-Defined Radio (SDR) Systems
- Medical Imaging and Diagnostics Equipment
- Test and Measurement Instrumentation
- Video Processing and Broadcast Equipment
- Aerospace and Defense Systems
Development Tools and Software Ecosystem
AMD Vivado Design Suite
The XCZU7CG-2FBVB900I is fully supported by AMD Vivado Design Suite, providing comprehensive tools for FPGA development including synthesis, implementation, and debug capabilities. Vivado ML Edition offers AI-driven optimization for improved design closure.
AMD Vitis Unified Software Platform
Vitis provides a unified programming model enabling software developers to leverage hardware acceleration without deep FPGA expertise. It supports C/C++ kernel development, AI/ML frameworks integration, and domain-specific libraries for video, DSP, and networking applications.
Why Choose the XCZU7CG-2FBVB900I MPSoC
Key Benefits and Advantages
- Heterogeneous Computing: Combine ARM processor flexibility with FPGA acceleration in a single chip
- Industrial Temperature Range: Reliable operation from -40°C to +100°C junction temperature
- Cost-Optimized Design: CG variant provides essential features without GPU for cost-sensitive applications
- Advanced Security: Hardware root of trust, secure boot, and anti-tamper features
- Low Power Consumption: 16nm FinFET+ technology enables excellent performance-per-watt
- Scalability: Pin-compatible options allow design migration across the Zynq UltraScale+ family
Ordering Information and Part Number Decoder
Understanding the XCZU7CG-2FBVB900I Part Number
| Code |
Meaning |
| XC |
Xilinx Commercial/Industrial Device |
| ZU7 |
Zynq UltraScale+ Device Size (7 = Mid-Range) |
| CG |
Cost-Optimized Device (No GPU, No Video Codec) |
| -2 |
Speed Grade (-1 slowest, -2 standard, -3 fastest) |
| FBVB |
Package Type (FCBGA with 1.0mm ball pitch) |
| 900 |
Pin Count (900 balls) |
| I |
Industrial Temperature Grade (-40°C to +100°C TJ) |
Summary
The XCZU7CG-2FBVB900I represents an excellent choice for embedded system designers requiring a balance of processing capability, programmable logic resources, and cost efficiency. With its quad-core ARM Cortex-A53 processor, dual real-time ARM Cortex-R5F cores, and over 504K logic cells, this Zynq UltraScale+ MPSoC delivers the performance and flexibility needed for today’s demanding industrial, medical, and communications applications.
For detailed technical specifications, application notes, and design resources, refer to the AMD Xilinx official documentation and authorized distributors.
