The XCZU7CG-1FFVF1517I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This industrial-grade device combines a powerful dual-core ARM Cortex-A53 application processor with 504K+ programmable logic cells, making it an ideal solution for embedded systems, industrial automation, networking, and edge computing applications. Designed on advanced 20nm technology, the XCZU7CG-1FFVF1517I delivers exceptional performance with optimized power efficiency for demanding industrial environments.
XCZU7CG-1FFVF1517I Key Features and Benefits
The XCZU7CG-1FFVF1517I integrates a complete heterogeneous processing platform in a single chip. Engineers benefit from the combination of software-programmable ARM processors and hardware-configurable FPGA fabric, enabling unprecedented flexibility in system design.
Dual ARM Cortex-A53 Processing System
The processing system features a dual-core ARM Cortex-A53 MPCore running at up to 1.2GHz. Each core includes 32KB L1 instruction cache, 32KB L1 data cache, and shares a 1MB L2 cache. The NEON SIMD engine and single/double precision floating-point unit accelerate multimedia and signal processing workloads.
Real-Time Processing Unit (RPU)
A dual-core ARM Cortex-R5F subsystem operates independently from the application processors. The RPU delivers deterministic, low-latency response for safety-critical and real-time control applications with 32KB L1 caches and tightly coupled memory (TCM).
XCZU7CG-1FFVF1517I Technical Specifications
| Parameter |
Specification |
| Manufacturer |
AMD Xilinx |
| Part Number |
XCZU7CG-1FFVF1517I |
| Family |
Zynq UltraScale+ MPSoC CG |
| System Logic Cells |
504,000+ |
| CLB Look-Up Tables (LUTs) |
230,400 |
| CLB Flip-Flops |
460,800 |
| Distributed RAM |
6.2 Mb |
| Block RAM Blocks |
312 |
| Block RAM Capacity |
11.0 Mb |
| DSP Slices |
1,728 |
| Process Technology |
20nm FinFET |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-1 (Standard Performance) |
| Operating Temperature |
-40°C to +100°C (Industrial) |
XCZU7CG-1FFVF1517I Package Information
| Parameter |
Value |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Package Code |
FFVF1517 |
| Pin Count |
1517 Pins |
| Package Dimensions |
40mm × 40mm |
| Ball Pitch |
1.0mm |
| Mounting Type |
Surface Mount (SMD/SMT) |
| Temperature Grade |
I (Industrial) |
Programmable Logic Resources for the XCZU7CG
The XCZU7CG-1FFVF1517I programmable logic fabric enables custom hardware acceleration and interface implementation. The UltraScale architecture delivers superior performance compared to previous generations.
Configurable Logic Block (CLB) Architecture
The CLB structure provides maximum flexibility for implementing combinational and sequential logic. Each CLB contains eight 6-input LUTs that can be configured as dual 5-input LUTs, distributed RAM, or shift registers.
Digital Signal Processing (DSP) Capabilities
With 1,728 DSP48E2 slices, the XCZU7CG-1FFVF1517I excels at computationally intensive tasks. Each DSP slice includes a 27×18 signed multiplier, 48-bit accumulator, and pre-adder for efficient filter and algorithm implementation.
High-Speed Connectivity and I/O Interfaces
| Interface Type |
Specification |
| Max HP I/O (High-Performance) |
208 |
| Max HD I/O (High-Density) |
120 |
| PS I/O |
214 |
| PS-GTR Transceivers |
4 |
| GTH Transceivers |
Up to 16.3 Gb/s |
| PCIe |
Gen1/Gen2 Support |
| USB 3.0 |
Integrated Controller |
| USB 2.0 |
Dual Host/Device Support |
| SATA |
3.1 Compliant |
| DisplayPort |
1.2a TX Support |
| Gigabit Ethernet |
SGMII/RGMII Support |
XCZU7CG-1FFVF1517I Memory Interface Support
The device supports multiple external memory types through dedicated controllers.
DDR Memory Controller Features
The integrated DDR controller supports DDR4, DDR3, DDR3L, and LPDDR4 memory interfaces with ECC protection. Maximum memory bandwidth enables data-intensive applications in video processing, networking, and storage systems.
On-Chip Memory Resources
| Memory Type |
Capacity |
| Block RAM (BRAM) |
11.0 Mb |
| Distributed RAM |
6.2 Mb |
| L1 Cache (A53) |
32KB I$ + 32KB D$ per core |
| L2 Cache (A53) |
1MB Shared |
| L1 Cache (R5F) |
32KB I$ + 32KB D$ per core |
| TCM (R5F) |
256KB per core |
| On-Chip Memory (OCM) |
256KB |
Peripheral and Interface Connectivity
The XCZU7CG-1FFVF1517I Processing System includes rich peripheral connectivity for embedded applications.
General Purpose I/O and Communication
| Peripheral |
Quantity/Description |
| GPIO |
78 MIO + EMIO Extension |
| UART |
2 Controllers |
| SPI |
2 Controllers |
| I2C |
2 Controllers |
| CAN |
2 Controllers |
| Triple Timer Counter |
4 Units |
| Watchdog Timer |
3 Units |
| Real-Time Clock |
Integrated |
Development Tools and Software Support
AMD Vivado Design Suite
The XCZU7CG-1FFVF1517I is fully supported by AMD Vivado Design Suite for hardware development. Vivado provides synthesis, implementation, timing analysis, and debugging capabilities optimized for UltraScale+ devices.
Embedded Software Development
Vitis Unified Software Platform enables comprehensive embedded software development. Support includes bare-metal programming, FreeRTOS, and Linux-based development with pre-built Board Support Packages (BSP).
XCZU7CG-1FFVF1517I Target Applications
The industrial temperature rating and comprehensive feature set make the XCZU7CG-1FFVF1517I suitable for demanding applications.
Industrial and Automation Applications
- Motor control and drives
- Industrial networking (EtherCAT, PROFINET, EtherNet/IP)
- Machine vision and image processing
- PLC and DCS systems
- Robotics controllers
Communications and Networking
- 5G wireless infrastructure
- Software-defined radio (SDR)
- Network packet processing
- Protocol bridging and conversion
Aerospace and Defense
- Radar signal processing
- Electronic warfare systems
- Avionics computing
- Secure communications
Medical and Scientific Equipment
- Medical imaging systems
- Diagnostic equipment
- Laboratory instrumentation
- Data acquisition systems
Part Number Breakdown for XCZU7CG-1FFVF1517I
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial Prefix |
| ZU7 |
ZU7 |
Zynq UltraScale+ Device Size 7 |
| CG |
CG |
Cost-Optimized General Purpose (No GPU/VCU) |
| -1 |
-1 |
Speed Grade (Standard) |
| FF |
FF |
Flip-Chip Fine-pitch BGA Package |
| V |
V |
Lead-free (RoHS Compliant) |
| F1517 |
F1517 |
1517-Ball Package Footprint |
| I |
I |
Industrial Temperature (-40°C to +100°C) |
Why Choose the XCZU7CG-1FFVF1517I for Your Design?
The XCZU7CG-1FFVF1517I offers an optimal balance of processing power, programmable logic resources, and cost-effectiveness for industrial embedded systems. Key advantages include:
- Heterogeneous Computing – Combine ARM processing with FPGA acceleration
- Industrial Reliability – Extended temperature operation for harsh environments
- Scalable Architecture – Pin-compatible migration path within the ZU7 family
- Reduced BOM Cost – Integration eliminates external components
- Long-Term Availability – AMD commitment to industrial product longevity
For comprehensive Xilinx FPGA solutions including the XCZU7CG-1FFVF1517I and related devices, explore our complete Xilinx FPGA product catalog with competitive pricing and technical support.
XCZU7CG-1FFVF1517I Ordering Information
| Parameter |
Details |
| Full Part Number |
XCZU7CG-1FFVF1517I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Status |
Active |
| RoHS Status |
Compliant |
| ECCN |
3A001.a.7 |
| Packaging |
Tray |
Related Zynq UltraScale+ MPSoC Devices
| Part Number |
Logic Cells |
Package |
Temperature |
| XCZU7CG-1FFVF1517E |
504K+ |
1517-FCBGA |
Extended (0°C to +100°C) |
| XCZU7CG-2FFVF1517I |
504K+ |
1517-FCBGA |
Industrial (-40°C to +100°C) |
| XCZU7CG-1FFVC1156I |
504K+ |
1156-FCBGA |
Industrial (-40°C to +100°C) |
| XCZU7CG-1FBVB900I |
504K+ |
900-FCBGA |
Industrial (-40°C to +100°C) |
| XCZU7EG-1FFVF1517I |
504K+ |
1517-FCBGA |
Industrial (with GPU) |
Frequently Asked Questions About XCZU7CG-1FFVF1517I
What is the difference between XCZU7CG and XCZU7EG?
The XCZU7CG is the cost-optimized variant without the Mali-400 GPU found in the XCZU7EG. Both share identical programmable logic resources, but the CG variant offers lower power consumption and cost for applications not requiring graphics processing.
What software tools are required for XCZU7CG-1FFVF1517I development?
AMD Vivado Design Suite (version 2018.1 or later) is required for hardware design. Vitis Unified Software Platform provides embedded software development tools. Both tools are available in free WebPACK editions with full device support.
Is the XCZU7CG-1FFVF1517I suitable for automotive applications?
While the industrial temperature grade (-40°C to +100°C) covers many automotive requirements, automotive-qualified XA Zynq UltraScale+ devices are recommended for AEC-Q100 compliance.
What is the typical power consumption of XCZU7CG-1FFVF1517I?
Power consumption varies significantly based on design utilization and operating frequency. AMD provides the Xilinx Power Estimator (XPE) tool for accurate power analysis during the design phase.
