The XCZU7CG-1FFVC1156I is a high-performance System-on-Chip (SoC) from AMD/Xilinx’s Zynq UltraScale+ MPSoC family. This dual-core ARM Cortex-A53 FPGA combines powerful processing capabilities with extensive programmable logic, making it ideal for industrial motor control, sensor fusion, and embedded vision applications. As a leading Xilinx FPGA solution, it delivers exceptional performance for demanding edge computing requirements.
XCZU7CG-1FFVC1156I Key Specifications Overview
| Parameter |
Specification |
| Manufacturer |
AMD / Xilinx |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Type |
CG (Dual-Core) |
| Part Number |
XCZU7CG-1FFVC1156I |
| System Logic Cells |
504,000+ |
| CLB Look-Up Tables (LUTs) |
230,400 |
| CLB Flip-Flops |
460,800 |
| Speed Grade |
-1 (Standard) |
| Temperature Grade |
I (Industrial: -40°C to +100°C) |
| Package Type |
FFVC1156 (1156-Ball FCBGA) |
| Package Dimensions |
35mm × 35mm |
| Operating Voltage (VCCINT) |
0.85V |
| Process Technology |
16nm FinFET+ |
XCZU7CG-1FFVC1156I Processing System Specifications
The XCZU7CG-1FFVC1156I integrates a heterogeneous multiprocessing architecture that combines application processing with real-time control capabilities.
ARM Cortex-A53 Application Processing Unit (APU)
| Feature |
Specification |
| Core Configuration |
Dual-Core 64-bit ARM Cortex-A53 |
| Maximum Frequency |
Up to 1.2 GHz |
| L1 Cache |
32KB I-Cache + 32KB D-Cache per core |
| L2 Cache |
1MB Shared |
| NEON SIMD Engine |
Yes |
| Floating Point Unit |
VFPv4 |
| TrustZone Security |
Supported |
ARM Cortex-R5F Real-Time Processing Unit (RPU)
| Feature |
Specification |
| Core Configuration |
Dual-Core 32-bit ARM Cortex-R5F |
| Maximum Frequency |
Up to 500 MHz |
| Operating Mode |
Lock-step or Split Mode |
| Tightly Coupled Memory (TCM) |
256KB per core |
| ECC Support |
Yes |
Programmable Logic (PL) Resources
The XCZU7CG-1FFVC1156I offers extensive programmable logic resources for implementing custom hardware accelerators and high-speed interfaces.
Configurable Logic Block (CLB) Resources
| Resource |
Quantity |
| System Logic Cells |
504,000+ |
| CLB Slices |
28,800 |
| CLB LUTs (6-Input) |
230,400 |
| CLB Flip-Flops |
460,800 |
| Distributed RAM |
4.0 Mb |
On-Chip Memory Resources
| Memory Type |
Quantity |
Total Capacity |
| Block RAM (36Kb) |
312 Blocks |
11.1 Mb |
| UltraRAM (288Kb) |
96 Blocks |
27.0 Mb |
| Total On-Chip Memory |
— |
38.1+ Mb |
DSP Processing Capability
| Feature |
Specification |
| DSP48E2 Slices |
1,728 |
| Multiplier Size |
27×18-bit |
| Pre-Adder |
27-bit |
| Accumulator |
48-bit |
| Peak DSP Performance |
1.9 TOPS (INT8) |
High-Speed Serial Transceivers and I/O
GTH Transceiver Specifications
| Parameter |
Specification |
| GTH Transceivers |
24 Channels |
| Maximum Data Rate |
16.3 Gb/s |
| Supported Protocols |
PCIe Gen3/Gen4, SATA, DisplayPort, USB 3.0, 10G Ethernet |
| TX/RX Equalization |
Integrated |
General Purpose I/O
| I/O Type |
Quantity |
Voltage Support |
| High-Performance (HP) I/O |
416 |
1.0V – 1.8V |
| High-Density (HD) I/O |
48 |
1.2V – 3.3V |
| Maximum User I/O |
464 |
— |
| I/O Banks (HP + HD) |
8 HP + 4 HD |
— |
Integrated Connectivity and Peripherals
Processing System Interfaces
| Interface |
Specification |
| DDR Memory Controller |
DDR4-2400, DDR3, LPDDR4, LPDDR3 (64-bit + ECC) |
| PCIe Controller |
Gen2 x4 (PS-side) |
| USB |
2× USB 2.0 (Host/Device/OTG) |
| Gigabit Ethernet |
4× RGMII/SGMII |
| SD/SDIO/eMMC |
2× Controllers |
| QSPI Flash |
Dual Quad-SPI |
| NAND Flash |
8-bit ONFI 3.1 |
| UART |
2× |
| I2C |
2× |
| SPI |
2× |
| CAN 2.0B |
2× |
| GPIO (MIO) |
78 pins |
| GPIO (EMIO) |
96 pins |
Programmable Logic Interfaces
| Interface |
Capability |
| PCIe Hard Block |
2× Gen4 x8 / Gen3 x16 |
| 100G Ethernet MAC |
Available |
| Interlaken |
Up to 150G |
| Memory Interface |
DDR4, DDR3, QDRII+, RLDRAM3 |
XCZU7CG-1FFVC1156I Part Number Decoding
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial |
| ZU7 |
ZU7 |
Zynq UltraScale+ Device Size |
| CG |
CG |
Dual-Core Configuration (No GPU/VCU) |
| -1 |
-1 |
Speed Grade (Standard) |
| FF |
FF |
Flat Flip-Chip Package |
| V |
V |
Lead-Free (RoHS Compliant) |
| C1156 |
C1156 |
1156-Ball FCBGA Package |
| I |
I |
Industrial Temperature (-40°C to +100°C) |
XCZU7CG-1FFVC1156I Package Information
| Parameter |
Specification |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Ball Count |
1156 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
35mm × 35mm × 3.86mm |
| Moisture Sensitivity Level (MSL) |
3 |
| RoHS Compliant |
Yes |
| REACH Compliant |
Yes |
Environmental and Electrical Specifications
Operating Conditions
| Parameter |
Min |
Typical |
Max |
Unit |
| Junction Temperature (Tj) |
-40 |
— |
+100 |
°C |
| Core Voltage (VCCINT) |
0.825 |
0.85 |
0.876 |
V |
| Auxiliary Voltage (VCCAUX) |
1.746 |
1.80 |
1.854 |
V |
| I/O Voltage (HP Banks) |
1.0 |
— |
1.8 |
V |
| I/O Voltage (HD Banks) |
1.2 |
— |
3.3 |
V |
Power Consumption (Typical)
| Parameter |
Value |
| Static Power |
~2.5W |
| Dynamic Power (Design Dependent) |
5W – 15W |
| Total Typical Power |
8W – 18W |
Target Applications for XCZU7CG-1FFVC1156I
The XCZU7CG-1FFVC1156I Zynq UltraScale+ MPSoC excels in applications requiring heterogeneous processing with programmable logic acceleration.
Industrial Applications
The XCZU7CG-1FFVC1156I is optimized for industrial motor control, factory automation, and real-time sensor fusion applications. Its dual ARM Cortex-R5F cores provide deterministic real-time response while the programmable logic enables custom motor control algorithms and high-speed I/O interfaces.
Embedded Vision and Machine Learning
With 1,728 DSP slices and abundant on-chip memory, the XCZU7CG-1FFVC1156I supports embedded vision applications including object detection, image classification, and machine learning inference at the edge. The UltraRAM blocks enable efficient weight storage for neural network implementations.
Communications Infrastructure
The 24 GTH transceivers supporting data rates up to 16.3 Gb/s make the XCZU7CG-1FFVC1156I suitable for wireless base stations, network switches, and software-defined radio applications. The integrated PCIe Gen4 hard blocks provide high-bandwidth host connectivity.
Aerospace and Defense
The industrial temperature rating (-40°C to +100°C) and robust design make the XCZU7CG-1FFVC1156I suitable for radar signal processing, electronic warfare, and avionics applications requiring reliable operation in harsh environments.
Development Tools and Software Support
Xilinx Vivado Design Suite
The XCZU7CG-1FFVC1156I is fully supported by Xilinx Vivado Design Suite, providing integrated design, synthesis, implementation, and debug capabilities for both hardware and embedded software development.
Vitis Unified Software Platform
The Vitis platform enables software developers to leverage hardware acceleration without deep FPGA expertise, supporting C/C++ application development with automated hardware optimization.
PetaLinux and Yocto
Full Linux support through PetaLinux and Yocto Project enables rapid embedded Linux deployment with comprehensive driver support for all integrated peripherals.
XCZU7CG-1FFVC1156I vs. Related Devices
| Feature |
XCZU7CG |
XCZU7EG |
XCZU7EV |
| ARM Cortex-A53 |
Dual-Core |
Quad-Core |
Quad-Core |
| ARM Cortex-R5F |
Dual-Core |
Dual-Core |
Dual-Core |
| Mali GPU |
No |
Yes (Mali-400 MP2) |
Yes (Mali-400 MP2) |
| Video Codec Unit |
No |
No |
Yes (H.264/H.265) |
| Logic Cells |
504K |
504K |
504K |
| DSP Slices |
1,728 |
1,728 |
1,728 |
| Best For |
Industrial Control |
Edge AI/ML |
Video Processing |
Ordering Information
| Part Number |
Description |
| XCZU7CG-1FFVC1156I |
Industrial Temp, -1 Speed Grade, 1156 FCBGA |
| XCZU7CG-2FFVC1156I |
Industrial Temp, -2 Speed Grade, 1156 FCBGA |
| XCZU7CG-1FFVC1156E |
Extended Temp, -1 Speed Grade, 1156 FCBGA |
| XCZU7CG-2FFVC1156E |
Extended Temp, -2 Speed Grade, 1156 FCBGA |
Documentation and Resources
For complete technical specifications, refer to the following AMD/Xilinx documentation:
- DS891: Zynq UltraScale+ MPSoC Data Sheet: Overview
- DS925: Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
- UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual
- UG1075: Zynq UltraScale+ MPSoC Packaging and Pinouts
Frequently Asked Questions
What is the difference between XCZU7CG and XCZU7EG?
The XCZU7CG features a dual-core ARM Cortex-A53 processor, while the XCZU7EG includes a quad-core ARM Cortex-A53 along with an integrated Mali-400 MP2 GPU. The XCZU7CG is optimized for cost-sensitive applications where GPU functionality is not required.
What temperature range does the XCZU7CG-1FFVC1156I support?
The “I” suffix indicates Industrial temperature grade, supporting operation from -40°C to +100°C junction temperature, making it suitable for harsh industrial environments.
What is the maximum DDR4 memory speed supported?
The XCZU7CG-1FFVC1156I supports DDR4 memory up to 2400 MT/s with a 64-bit data bus plus ECC, enabling high-bandwidth memory access for demanding applications.
Is the XCZU7CG-1FFVC1156I RoHS compliant?
Yes, the XCZU7CG-1FFVC1156I is fully RoHS and REACH compliant, indicated by the “V” in the package designation (FFVC1156) which denotes lead-free packaging.
