The XCZU7CG-1FBVB900E is a high-performance System-on-Chip (SoC) from the AMD/Xilinx Zynq UltraScale+ MPSoC CG series. This multiprocessor device integrates dual ARM Cortex-A53 application processors and dual ARM Cortex-R5 real-time processors with over 504,000 programmable logic cells. Packaged in a compact 900-pin FCBGA format, the XCZU7CG-1FBVB900E is ideal for industrial motor control, sensor fusion, and space-constrained embedded designs requiring extended temperature operation.
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XCZU7CG-1FBVB900E Overview and Key Features
The XCZU7CG-1FBVB900E belongs to the Zynq UltraScale+ MPSoC family, combining a feature-rich 64-bit dual-core ARM processing system with Xilinx UltraScale+ programmable logic architecture. This heterogeneous computing platform enables hardware-software co-design approaches that optimize both performance and power efficiency.
Dual ARM Cortex-A53 64-Bit Application Processor
The XCZU7CG-1FBVB900E features dual ARM Cortex-A53 MPCore processors with CoreSight debug technology operating at speeds up to 1.2 GHz. These 64-bit application processors deliver substantial computational throughput for running embedded Linux, RTOS environments, and complex application software stacks.
Dual ARM Cortex-R5 Real-Time Processing Unit
Complementing the application processors, this device includes dual ARM Cortex-R5 real-time processing units running at 500 MHz. The Cortex-R5 cores provide deterministic, low-latency response for time-critical control functions essential in industrial automation and safety-critical applications.
504K+ UltraScale+ Programmable Logic Cells
The integrated programmable logic fabric offers more than 504,000 system logic cells manufactured using advanced 20nm process technology. This FPGA fabric enables custom hardware acceleration, parallel processing implementations, and high-speed interface bridging that extends the capabilities of the processing system.
XCZU7CG-1FBVB900E Technical Specifications
| Parameter |
Specification |
| Part Number |
XCZU7CG-1FBVB900E |
| Manufacturer |
AMD (Xilinx) |
| Series |
Zynq® UltraScale+™ MPSoC CG |
| Device Family |
XCZU7 |
| Logic Cells |
504,000+ |
| Application Processor |
Dual ARM® Cortex®-A53 MPCore™ @ 1.2 GHz |
| Real-Time Processor |
Dual ARM® Cortex™-R5 @ 500 MHz |
| Process Technology |
20nm |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-1 (Standard Performance) |
| Package Type |
900-FCBGA (31mm x 31mm) |
| Pin Count |
900 |
| Operating Temperature |
Extended (E) Range |
| RoHS Compliance |
Yes (Lead-Free) |
| Product Status |
Active |
XCZU7CG-1FBVB900E Connectivity and Interface Options
The XCZU7CG-1FBVB900E provides a comprehensive set of peripheral interfaces suitable for diverse embedded system requirements.
High-Speed Serial Communication
- Ethernet: Gigabit Ethernet MAC for network connectivity
- USB: USB 2.0/3.0 with On-The-Go (OTG) support
- CANbus: Controller Area Network interface for industrial and automotive protocols
- UART/USART: Multiple serial communication channels
Memory Interface Support
- DDR4/DDR3/DDR3L/LPDDR4: High-bandwidth external memory controller
- QSPI Flash: Quad SPI interface for boot and configuration storage
- eMMC/SD/SDIO: Multimedia and secure digital card interfaces
- NAND Flash: Raw NAND memory controller support
Additional Peripherals
- SPI: Serial Peripheral Interface controllers
- I²C: Inter-Integrated Circuit interface for low-speed peripherals
- GPIO: General-purpose I/O with programmable functionality
- DMA: Direct Memory Access controller for efficient data movement
- Watchdog Timer (WDT): System monitoring and recovery
Extended Temperature Range Operation
The “E” suffix in XCZU7CG-1FBVB900E indicates extended temperature grade qualification. This device operates reliably across an extended temperature range, making it suitable for applications in environments with temperature variations beyond standard commercial specifications. Extended temperature grade devices provide enhanced reliability for outdoor deployments, industrial environments, and applications with variable thermal conditions.
XCZU7CG-1FBVB900E Compact FBVB900 Package Benefits
The FBVB900 package offers significant advantages for space-constrained designs requiring high integration density.
Package Specifications
| Parameter |
Value |
| Package Code |
FBVB900 |
| Ball Count |
900 |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Mounting Type |
Surface Mount (BGA) |
| Package Style |
Flip-Chip Ball Grid Array |
Compact Form Factor Advantages
The 31mm x 31mm package footprint enables high-density PCB designs where board space is at a premium. Compared to larger 1156-pin package variants, the FBVB900 package reduces overall system size while maintaining access to essential device features. This makes the XCZU7CG-1FBVB900E particularly attractive for portable equipment, embedded modules, and applications requiring multiple processing nodes in limited space.
XCZU7CG-1FBVB900E Target Applications
The dual-core CG variant of Zynq UltraScale+ MPSoC addresses specific application domains where balanced processing capability and programmable logic resources deliver optimal solutions.
Industrial Motor Control and Drives
Advanced motor drive systems benefit from the combination of real-time ARM Cortex-R5 processors for control loop execution and programmable logic for custom PWM generation, encoder interfaces, and current sensing. The XCZU7CG-1FBVB900E supports sophisticated control algorithms including field-oriented control (FOC), direct torque control (DTC), and model predictive control (MPC).
Multi-Sensor Fusion Systems
Applications requiring integration of multiple sensor types leverage the parallel processing capabilities of the programmable logic alongside the computational resources of the ARM Cortex-A53 cores. Use cases include industrial inspection systems, autonomous mobile robots, and environmental monitoring platforms.
Embedded Computing Platforms
The XCZU7CG-1FBVB900E serves as a foundation for compact embedded computing platforms requiring both general-purpose processing and hardware acceleration. Applications span medical devices, test and measurement equipment, and communications infrastructure.
Industrial IoT Edge Devices
Connected industrial devices benefit from the integrated networking capabilities, security features, and processing power of this SoC. Edge computing implementations perform local data processing, analytics, and decision-making while maintaining connectivity to enterprise systems and cloud platforms.
XCZU7CG-1FBVB900E Development Ecosystem
AMD provides comprehensive development tools and resources for the XCZU7CG-1FBVB900E.
Vivado Design Suite
The primary hardware development environment supports RTL design, IP integration, synthesis, implementation, and debug for the programmable logic. Vivado High-Level Synthesis (HLS) enables C/C++ based hardware development for accelerated algorithm implementation.
Vitis Unified Software Platform
The Vitis platform provides embedded software development tools, acceleration libraries, and frameworks for heterogeneous computing applications. It streamlines the development of applications spanning the processing system and programmable logic domains.
PetaLinux Tools
Embedded Linux development is supported through PetaLinux, enabling rapid deployment of Linux-based applications. The tool chain supports kernel customization, root filesystem configuration, and device tree management.
Available Evaluation Boards
Various Zynq UltraScale+ MPSoC evaluation kits and development boards support prototyping and validation of designs targeting the XCZU7CG-1FBVB900E.
XCZU7CG-1FBVB900E Part Number Breakdown
Understanding the AMD/Xilinx part numbering system helps identify device characteristics:
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial |
| ZU7 |
ZU7 |
Zynq UltraScale+ Device Size 7 |
| CG |
CG |
Dual-Core Cortex-A53 Variant (No GPU) |
| -1 |
-1 |
Speed Grade (Standard) |
| FBVB |
FBVB |
Package Type (Flip-Chip BGA) |
| 900 |
900 |
Pin Count |
| E |
E |
Extended Temperature Range |
Ordering and Availability Information
The XCZU7CG-1FBVB900E is available from authorized AMD/Xilinx distributors globally. This component is typically provided in tray packaging and may be classified as NCNR (Non-Cancellable, Non-Returnable) due to its specialized nature and build-to-order characteristics.
Export Control Information
- ECCN: 5A002.A.4
- USHTS: 8542390001
- TARIC: 8542399000
Related Zynq UltraScale+ MPSoC Variants
Engineers evaluating the XCZU7CG-1FBVB900E may also consider these related devices based on specific requirements:
| Part Number |
Key Difference |
| XCZU7CG-1FBVB900I |
Industrial temperature range (-40°C to +100°C) |
| XCZU7CG-2FBVB900E |
Higher speed grade (-2) for increased performance |
| XCZU7EG-1FBVB900E |
Quad-core Cortex-A53 with Mali-400 MP2 GPU |
| XCZU7EV-1FBVB900E |
Video codec equipped variant for multimedia |
| XCZU7CG-1FFVC1156E |
Larger 1156-pin package with more I/O |
Conclusion
The XCZU7CG-1FBVB900E delivers an optimal balance of processing capability, programmable logic resources, and compact packaging for embedded applications. With dual ARM Cortex-A53 and dual ARM Cortex-R5 processors combined with 504K+ logic cells in a space-efficient 900-pin FCBGA package, this SoC addresses the needs of industrial motor control, sensor fusion, and embedded computing applications requiring extended temperature operation. The proven Zynq UltraScale+ architecture and comprehensive development ecosystem ensure a robust foundation for demanding embedded designs.
