Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU6EG-L1FFVC900I: AMD Xilinx Zynq UltraScale+ MPSoC FPGA | Industrial Grade SoC

Product Details

The XCZU6EG-L1FFVC900I is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC EG family. This industrial-grade FPGA combines powerful ARM processors with programmable logic, making it ideal for demanding embedded computing, edge AI, and industrial automation applications.

XCZU6EG-L1FFVC900I Key Features and Benefits

The XCZU6EG-L1FFVC900I delivers exceptional heterogeneous multi-processing capabilities by integrating multiple processor cores with high-performance programmable logic. Engineers choosing this device gain access to industry-leading performance-per-watt ratios and comprehensive connectivity options.

This Zynq UltraScale+ MPSoC device stands out for its combination of real-time processing capabilities and flexible FPGA fabric. The EG variant specifically includes the Mali-400 MP2 GPU, enabling sophisticated graphics and display applications without requiring external GPU hardware.

XCZU6EG-L1FFVC900I Technical Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XCZU6EG-L1FFVC900I
Series Zynq UltraScale+ MPSoC EG
Package 900-FCBGA (31mm x 31mm)
Technology Node 16nm FinFET+
Core Voltage 0.85V
Speed Grade -1 (L1 Low Power)
Operating Temperature Industrial: -40°C to +100°C
RoHS Compliance Yes (Lead-Free)

Programmable Logic Resources

Resource Value
System Logic Cells 469,446 (469K+)
CLB Flip-Flops 548,160
CLB LUTs 274,080
Block RAM 11.0 Mb
UltraRAM 9.4 Mb
DSP Slices 1,973

Processing System Architecture

Processor Specifications
Application Processing Unit (APU) Quad-core ARM Cortex-A53 MPCore with CoreSight™
APU Clock Speed Up to 1.2 GHz
Real-Time Processing Unit (RPU) Dual-core ARM Cortex-R5F with CoreSight™
RPU Clock Speed Up to 533 MHz
Graphics Processing Unit (GPU) ARM Mali-400 MP2
GPU Features OpenGL ES 2.0 capable, 2D/3D graphics

Memory and Storage Interface Support

The XCZU6EG-L1FFVC900I provides comprehensive memory controller support for modern high-speed memory technologies. The integrated DDR controller accommodates DDR3, DDR4, LPDDR3, and LPDDR4 SDRAM with ECC functionality for mission-critical applications.

Both the Processing System (PS) and Programmable Logic (PL) sections share access to the SDRAM memory space. This architecture enables seamless data sharing between software running on the ARM processors and custom hardware accelerators implemented in the FPGA fabric.

Memory Controller Specifications

Feature Capability
DDR Support DDR3, DDR4, LPDDR3, LPDDR4
ECC Support Yes
Memory Interface Width Up to 64-bit
PS-PL Memory Sharing Supported

Connectivity and Peripheral Interfaces

High-Speed Serial Transceivers

The XCZU6EG-L1FFVC900I integrates multiple high-speed serial transceivers supporting data rates essential for modern communication protocols.

Interface Specification
PS-GTR Transceivers 4 channels, up to 6 Gbps
PL GTH Transceivers Up to 16.3 Gbps per channel
PCIe Support Gen2 (PS), Gen3/Gen4 (PL)
USB Support USB 3.0, USB 2.0
SATA Support SATA 3.0
DisplayPort Supports 4Kp30 video streams

Integrated Peripheral Controllers

The Processing System includes hardened peripheral controllers that reduce FPGA resource utilization while providing reliable connectivity.

Peripheral Interface Count
Gigabit Ethernet 4x GigE MAC
USB 3.0 2 ports
UART 2 ports
SPI 2 ports
I2C 2 ports
CAN 2 ports
QSPI Flash Controller 1 port
SD/eMMC Controller 2 ports
NAND Flash Controller 1 port (ONFI)

XCZU6EG-L1FFVC900I Application Areas

Industrial Automation and Control

The industrial temperature rating (-40°C to +100°C) makes the XCZU6EG-L1FFVC900I suitable for factory automation, motor control systems, and industrial robotics. The real-time ARM Cortex-R5 processors handle time-critical control loops while the Cortex-A53 cores run higher-level application software.

Edge Computing and Embedded AI

Machine learning inference at the edge benefits from the combination of ARM processors for pre/post-processing and FPGA fabric for custom neural network accelerators. The Mali-400 GPU adds display capabilities for visualization applications.

Video Processing and Machine Vision

DisplayPort support for 4K video combined with high-bandwidth memory interfaces makes this device excellent for camera systems, video analytics, and machine vision applications. The substantial DSP slice count (1,973) enables efficient image processing pipelines.

Communications Infrastructure

High-speed transceivers supporting Gigabit Ethernet, PCIe Gen3/Gen4, and other protocols position the XCZU6EG-L1FFVC900I for networking equipment, 5G infrastructure, and software-defined radio applications.

Medical and Scientific Instrumentation

The combination of precision analog interfaces, real-time processing, and industrial temperature rating makes this SoC appropriate for medical imaging equipment, laboratory instruments, and scientific research hardware.

Part Number Decoding: XCZU6EG-L1FFVC900I

Understanding the AMD Xilinx part numbering system helps engineers select the correct device variant.

Code Segment Meaning
XC Xilinx Commercial Device
ZU6 Zynq UltraScale+ Device Size 6
EG EG Variant (includes Mali GPU)
L1 Speed Grade -1, Low Power
FF Flip-Chip Package
VC Package Ball Grid Array Type
900 900 Ball Count
I Industrial Temperature Range

Development Tools and Software Support

AMD provides comprehensive development resources for the XCZU6EG-L1FFVC900I through the Vivado Design Suite and Vitis Unified Software Platform. These tools support hardware design, software development, and system integration workflows.

Available Development Resources

Resource Description
Vivado Design Suite FPGA synthesis, implementation, and analysis
Vitis Platform Embedded software and acceleration development
PetaLinux Linux distribution optimized for Zynq devices
Reference Designs Pre-built example projects
ZCU102 Evaluation Kit Hardware development platform

Comparison: XCZU6EG vs Other Zynq UltraScale+ Variants

Feature XCZU6EG XCZU6CG XCZU7EV
Logic Cells 469K 469K 504K
Mali GPU Yes No Yes
Video Codec No No Yes (H.264/H.265)
Target Applications Graphics, Industrial Cost-Optimized Video Processing

Ordering Information and Availability

The XCZU6EG-L1FFVC900I is available through authorized AMD distributors worldwide. The device ships in tray packaging suitable for automated assembly processes.

Parameter Details
Packaging Tray
Minimum Order Quantity Check with distributor
Lead Time Typically 16+ weeks
Lifecycle Status Active

For comprehensive Xilinx FPGA product selection and technical support, consult with authorized distribution partners who can provide current pricing, inventory availability, and engineering assistance.

XCZU6EG-L1FFVC900I Summary

The XCZU6EG-L1FFVC900I represents AMD’s commitment to delivering integrated SoC solutions that combine processor flexibility with FPGA programmability. With its quad-core ARM Cortex-A53 application processors, dual-core real-time Cortex-R5 processors, Mali-400 GPU, and 469K logic cells, this device provides the computational resources needed for sophisticated embedded systems.

The industrial temperature rating ensures reliable operation in challenging environments, while the comprehensive peripheral set minimizes external component requirements. Engineers developing next-generation industrial automation, edge computing, video processing, or communications systems will find the XCZU6EG-L1FFVC900I an excellent foundation for their designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.