The XCZU6EG-3FFVC900E is a high-performance System-on-Chip (SoC) from the Xilinx Zynq UltraScale+ MPSoC family, combining powerful ARM processors with programmable logic for demanding embedded applications. This XCZU6EG-3FFVC900E device features the fastest -3 speed grade, making it ideal for AI, 5G, industrial automation, and edge computing solutions.
XCZU6EG-3FFVC900E Key Features and Benefits
The XCZU6EG-3FFVC900E integrates a processing system with programmable logic fabric in a single 900-FCBGA package. This heterogeneous architecture delivers exceptional computational flexibility and performance for next-generation embedded systems.
Quad-Core ARM Cortex-A53 Application Processor
The XCZU6EG-3FFVC900E incorporates a Quad-Core ARM Cortex-A53 MPCore running at 1.5GHz, providing robust application processing power with ARM CoreSight debug and trace capabilities. This 64-bit processor cluster handles complex software workloads including Linux, RTOS, and bare-metal applications.
Dual-Core ARM Cortex-R5 Real-Time Processor
For time-critical operations, the XCZU6EG-3FFVC900E includes dual ARM Cortex-R5 processors operating at 600MHz. These real-time processing units ensure deterministic response times essential for safety-critical and industrial control applications.
469K+ Programmable Logic Cells
The FPGA fabric in the XCZU6EG-3FFVC900E contains over 469,000 logic cells, enabling custom hardware acceleration and peripheral implementation. The -3 speed grade offers the highest performance for timing-critical designs.
XCZU6EG-3FFVC900E Technical Specifications
| Parameter |
Specification |
| Part Number |
XCZU6EG-3FFVC900E |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Type |
EG (with GPU) |
| Architecture |
MCU + FPGA SoC |
| Speed Grade |
-3 (Highest Performance) |
| Package Type |
900-FCBGA (31mm × 31mm) |
| Logic Cells |
469,000+ |
| On-Chip RAM |
256KB |
| Operating Temperature |
0°C to +100°C (TJ) |
| RoHS Compliant |
Yes |
XCZU6EG-3FFVC900E Processor Subsystem Details
| Processor |
Cores |
Frequency |
Features |
| ARM Cortex-A53 |
Quad-Core |
1.5 GHz |
64-bit, NEON SIMD, CoreSight Debug |
| ARM Cortex-R5 |
Dual-Core |
600 MHz |
Real-Time Processing, Lock-Step Mode |
| Mali-400 GPU |
— |
— |
3D Graphics Acceleration (EG Device) |
XCZU6EG-3FFVC900E Connectivity and Peripherals
The XCZU6EG-3FFVC900E offers extensive peripheral interfaces for versatile system integration.
High-Speed Interfaces
| Interface |
Description |
| USB |
USB 2.0/3.0 OTG Support |
| Ethernet |
Gigabit Ethernet MAC |
| PCIe |
PCI Express Gen2 |
| SATA |
SATA 3.1 Interface |
Communication Protocols
| Protocol |
Application |
| CANbus |
Automotive and Industrial Networks |
| SPI |
Serial Peripheral Communication |
| I²C |
Low-Speed Device Connectivity |
| UART/USART |
Serial Debug and Communication |
| MMC/SD/SDIO |
Storage and Wireless Module Support |
System Features
| Feature |
Capability |
| DMA Controller |
High-Bandwidth Data Transfer |
| Watchdog Timer (WDT) |
System Reliability Monitoring |
| EBI/EMI |
External Memory Interface |
XCZU6EG-3FFVC900E Application Areas
The XCZU6EG-3FFVC900E is engineered for high-performance embedded applications across multiple industries.
Artificial Intelligence and Machine Learning
Deploy neural network inference accelerators using the XCZU6EG-3FFVC900E programmable logic while running AI frameworks on the ARM processors.
5G Wireless Infrastructure
The XCZU6EG-3FFVC900E provides the processing power and flexibility required for 5G base stations, small cells, and radio units.
Industrial Automation and Control
Implement real-time motor control, PLC functionality, and machine vision systems with the XCZU6EG-3FFVC900E dual real-time processors.
Medical Imaging Equipment
Build high-resolution imaging systems leveraging the XCZU6EG-3FFVC900E parallel processing capabilities for CT, MRI, and ultrasound applications.
Automotive ADAS Systems
The XCZU6EG-3FFVC900E extended temperature range supports advanced driver assistance systems including sensor fusion and object detection.
Edge Computing and IoT Gateways
Deploy intelligent edge devices with local AI processing using the XCZU6EG-3FFVC900E integrated SoC architecture.
XCZU6EG-3FFVC900E Speed Grade Comparison
| Speed Grade |
Performance Level |
Recommended Use |
| -3 (This Device) |
Highest |
Maximum Frequency Designs |
| -2 |
Standard |
General Purpose Applications |
| -1 |
Economy |
Cost-Sensitive Designs |
The XCZU6EG-3FFVC900E with -3 speed grade delivers the best timing margins and highest achievable clock frequencies within the XCZU6EG device family.
XCZU6EG-3FFVC900E Development Tools
Vivado Design Suite
Xilinx Vivado provides comprehensive FPGA development tools for the XCZU6EG-3FFVC900E, including synthesis, implementation, and hardware debugging capabilities.
Vitis Unified Software Platform
Develop embedded applications for the XCZU6EG-3FFVC900E ARM processors using Vitis IDE with support for Linux, FreeRTOS, and bare-metal programming.
PetaLinux Tools
Build custom Linux distributions optimized for the XCZU6EG-3FFVC900E processing system with integrated device tree and driver support.
XCZU6EG-3FFVC900E Package Information
| Specification |
Value |
| Package Code |
FFVC900 |
| Package Type |
Flip-Chip Fine-Pitch BGA |
| Ball Count |
900 |
| Body Size |
31mm × 31mm |
| Ball Pitch |
1.0mm |
| Height |
2.91mm (max) |
Why Choose XCZU6EG-3FFVC900E for Your Design
The XCZU6EG-3FFVC900E combines the flexibility of programmable logic with the efficiency of dedicated processors, reducing system complexity and power consumption. Key advantages include hardware-software co-design capabilities, extensive peripheral integration, and proven reliability for industrial applications.
For comprehensive Xilinx FPGA solutions and component sourcing, explore our complete product catalog featuring the XCZU6EG-3FFVC900E and other Zynq UltraScale+ MPSoC devices.
XCZU6EG-3FFVC900E Ordering Information
| Order Code |
Description |
| XCZU6EG-3FFVC900E |
Zynq UltraScale+ MPSoC, EG Device, -3 Speed, 900-FCBGA, Extended Temp |
Frequently Asked Questions About XCZU6EG-3FFVC900E
What is the difference between XCZU6EG and XCZU6CG?
The XCZU6EG-3FFVC900E includes a Mali-400 GPU for graphics acceleration, while the CG variant omits the GPU for applications not requiring display output.
What operating systems support the XCZU6EG-3FFVC900E?
The XCZU6EG-3FFVC900E supports Linux (PetaLinux, Ubuntu), FreeRTOS, VxWorks, and bare-metal applications on the ARM processor subsystem.
Is the XCZU6EG-3FFVC900E suitable for automotive applications?
Yes, the XCZU6EG-3FFVC900E extended temperature variant operates from 0°C to +100°C junction temperature, suitable for automotive and industrial environments. Automotive-qualified (Q-grade) variants are also available.
What is the typical power consumption of XCZU6EG-3FFVC900E?
Power consumption varies based on design utilization and clock frequencies. Use Xilinx Power Estimator (XPE) tool for accurate XCZU6EG-3FFVC900E power analysis.
