The XCZU6EG-3FFVB1156E is a high-performance System-on-Chip (SoC) FPGA from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This powerful EG-series device combines a quad-core ARM Cortex-A53 processor with programmable logic, delivering exceptional performance for embedded applications, AI acceleration, and industrial control systems. Whether you’re designing next-generation 5G infrastructure or advanced machine vision systems, the XCZU6EG-3FFVB1156E provides the processing power and flexibility your project demands.
XCZU6EG-3FFVB1156E Key Features and Benefits
The XCZU6EG-3FFVB1156E stands out in the Xilinx FPGA portfolio due to its unique combination of heterogeneous processing capabilities. This device integrates multiple processing domains into a single chip, reducing system complexity and power consumption while maximizing computational throughput.
High-Performance Processing System (PS)
The processing system of the XCZU6EG-3FFVB1156E includes:
- Quad-core ARM Cortex-A53 Application Processing Unit (APU) running at up to 1.5 GHz
- Dual-core ARM Cortex-R5F Real-Time Processing Unit (RPU) operating at 600 MHz
- Integrated CoreSight debug and trace technology
- 256KB on-chip RAM for low-latency data access
Programmable Logic (PL) Resources
The XCZU6EG device delivers substantial programmable logic resources:
- 469K+ Logic Cells for complex digital designs
- High-speed transceivers for multi-gigabit serial connectivity
- Abundant DSP slices for signal processing applications
- Rich block RAM and UltraRAM resources
XCZU6EG-3FFVB1156E Technical Specifications
| Specification |
Value |
| Part Number |
XCZU6EG-3FFVB1156E |
| Manufacturer |
AMD Xilinx |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Series |
EG (with GPU) |
| Architecture |
MCU + FPGA Hybrid SoC |
| Logic Cells |
469K+ |
| On-Chip RAM |
256KB |
| Speed Grade |
-3 (Highest Performance) |
| Temperature Grade |
E (Extended: 0°C to 100°C TJ) |
| Package Type |
1156-FCBGA |
| Package Dimensions |
35mm x 35mm |
| Ball Pitch |
1.0mm |
| RoHS Compliant |
Yes |
XCZU6EG-3FFVB1156E Processor Architecture Details
Application Processing Unit (APU) Specifications
| Parameter |
Specification |
| Core Type |
ARM Cortex-A53 (64-bit) |
| Number of Cores |
4 |
| Maximum Frequency |
1.5 GHz |
| L1 Cache |
32KB I-Cache + 32KB D-Cache per core |
| L2 Cache |
1MB Shared |
| NEON/FPU |
Yes (SIMD and Floating Point) |
| Virtualization |
ARM TrustZone Support |
Real-Time Processing Unit (RPU) Specifications
| Parameter |
Specification |
| Core Type |
ARM Cortex-R5F |
| Number of Cores |
2 |
| Maximum Frequency |
600 MHz |
| Configuration |
Dual-core lockstep or split mode |
| TCM |
256KB (128KB per core) |
| ECC Support |
Yes |
Connectivity and Peripheral Interfaces
The XCZU6EG-3FFVB1156E offers comprehensive connectivity options essential for modern embedded systems:
Communication Interfaces
| Interface |
Quantity |
Description |
| Gigabit Ethernet |
4 |
10/100/1000 Mbps with IEEE 1588 |
| USB 3.0/2.0 |
2 |
USB OTG with integrated PHY |
| PCIe Gen2 |
1-2 |
Root Port or Endpoint support |
| SATA 3.1 |
2 |
6 Gbps storage interface |
| DisplayPort |
1-2 |
Video output up to 4K |
| CAN 2.0B |
2 |
Industrial communication |
| I2C |
2 |
Serial peripheral interface |
| SPI |
2 |
High-speed serial communication |
| UART |
2 |
Serial debug/communication |
| GPIO |
78 |
MIO pins (Multiplexed I/O) |
Memory Controller Interfaces
| Memory Type |
Support |
| DDR4 |
Up to 2400 MT/s with ECC |
| DDR3/DDR3L |
Up to 1866 MT/s |
| LPDDR4 |
Up to 2133 MT/s |
| LPDDR3 |
Up to 1866 MT/s |
| eMMC |
4.51 compliant |
| SD/SDIO |
3.0 compliant |
| QSPI |
Dual Quad-SPI Flash |
| NAND |
8-bit with ECC |
XCZU6EG-3FFVB1156E Speed Grade Comparison
The “-3” speed grade designation indicates this is the highest performance variant available in the XCZU6EG family:
| Speed Grade |
Performance Level |
Typical Applications |
| -3E |
Highest |
High-frequency trading, 5G infrastructure |
| -2 |
Standard |
Industrial automation, medical imaging |
| -1 |
Entry-level |
Consumer electronics, IoT gateways |
Target Applications for XCZU6EG-3FFVB1156E
Artificial Intelligence and Machine Learning
The XCZU6EG-3FFVB1156E excels in AI/ML edge computing applications due to its powerful combination of ARM processors and programmable logic. Engineers can implement custom neural network accelerators in the PL fabric while running inference frameworks on the APU.
5G Wireless Infrastructure
Telecom equipment manufacturers choose the XCZU6EG-3FFVB1156E for:
- Massive MIMO baseband processing
- Beamforming algorithms
- Fronthaul/backhaul processing
- Small cell base stations
Industrial Automation and Control
Industrial applications benefit from:
- Real-time motor control via RPU
- Machine vision processing
- Industrial Ethernet protocols (EtherCAT, PROFINET)
- Functional safety implementations (IEC 61508)
Medical Imaging Equipment
Healthcare device manufacturers leverage:
- Ultrasound image processing
- CT/MRI reconstruction
- Endoscopy video processing
- Patient monitoring systems
Autonomous Systems and Robotics
The XCZU6EG-3FFVB1156E enables:
- Sensor fusion algorithms
- LiDAR point cloud processing
- Real-time path planning
- Multi-axis motion control
Cloud Computing and Data Centers
Data center applications include:
- Hardware acceleration for databases
- Network function virtualization (NFV)
- Video transcoding
- Encryption/decryption acceleration
XCZU6EG-3FFVB1156E Package Information
1156-FCBGA Package Details
| Parameter |
Value |
| Package Type |
Flip-Chip Ball Grid Array |
| Total Ball Count |
1156 |
| Body Size |
35mm x 35mm |
| Ball Pitch |
1.0mm |
| Ball Diameter |
0.5mm nominal |
| Max Height |
4.57mm |
| Weight |
Approximately 10g |
Thermal Considerations
| Parameter |
Condition |
Value |
| θJA |
Natural convection |
~12°C/W |
| θJC |
Junction to case |
~0.15°C/W |
| Max Junction Temp |
Extended grade |
100°C |
| Recommended Heatsink |
Active cooling |
Required for max performance |
Development Tools and Software Support
Vivado Design Suite Compatibility
The XCZU6EG-3FFVB1156E is fully supported by AMD Xilinx development tools:
- Vivado Design Suite – RTL synthesis, implementation, and timing analysis
- Vitis Unified Software Platform – Application development and acceleration
- PetaLinux Tools – Embedded Linux development
- Vitis AI – Deep learning inference optimization
Operating System Support
| OS/RTOS |
Support Level |
| Linux (PetaLinux) |
Full BSP support |
| FreeRTOS |
Official support |
| VxWorks |
Certified |
| QNX |
Certified |
| Bare-metal |
Full support |
XCZU6EG-3FFVB1156E vs. Alternative Part Numbers
Related XCZU6EG Variants
| Part Number |
Package |
Temp Grade |
Speed |
| XCZU6EG-3FFVB1156E |
1156-FCBGA |
Extended |
-3 |
| XCZU6EG-2FFVB1156I |
1156-FCBGA |
Industrial |
-2 |
| XCZU6EG-2FFVC900I |
900-FCBGA |
Industrial |
-2 |
| XCZU6EG-3FFVC900E |
900-FCBGA |
Extended |
-3 |
| XCZU6EG-L1FFVB1156I |
1156-FCBGA |
Industrial |
-1L |
Ordering Information and Part Number Breakdown
Understanding the XCZU6EG-3FFVB1156E part number structure:
| Segment |
Meaning |
| XC |
Xilinx Commercial |
| ZU |
Zynq UltraScale+ |
| 6 |
Device density tier |
| EG |
With Mali GPU |
| -3 |
Speed grade (highest) |
| FF |
Flip-chip package |
| VB |
Package variant |
| 1156 |
Ball count |
| E |
Extended temperature |
Quality and Compliance Standards
The XCZU6EG-3FFVB1156E meets stringent quality requirements:
- RoHS Compliant – Lead-free manufacturing
- REACH Compliant – European chemical regulations
- AEC-Q100 – Automotive qualification (Q-grade variants)
- IPC-A-610 – Workmanship standards
- ISO 9001 – Quality management certified
Conclusion: Why Choose the XCZU6EG-3FFVB1156E
The XCZU6EG-3FFVB1156E represents the pinnacle of heterogeneous computing in a single device. Its combination of quad-core ARM Cortex-A53 processors, dual Cortex-R5 real-time cores, and 469K+ programmable logic cells makes it ideal for demanding applications in AI, 5G, industrial automation, and medical imaging.
Key advantages include:
- Highest performance -3 speed grade for maximum throughput
- Extended temperature range for harsh environments
- Comprehensive I/O including PCIe, USB 3.0, and Gigabit Ethernet
- Full software ecosystem with Vivado, Vitis, and Linux support
- Scalable architecture for future-proof designs
For engineers and procurement teams seeking a reliable, high-performance SoC FPGA solution, the XCZU6EG-3FFVB1156E delivers unmatched capability and flexibility for next-generation embedded systems.
