Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XCZU6EG-2FFVB1156I: AMD Xilinx Zynq UltraScale+ MPSoC – Complete Buying Guide

Product Details

The XCZU6EG-2FFVB1156I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This industrial-grade device combines quad-core ARM Cortex-A53 application processors with powerful programmable logic, making it ideal for demanding embedded computing applications in aerospace, defense, 5G infrastructure, and industrial automation.

Whether you’re designing next-generation wireless systems, advanced driver assistance systems (ADAS), or industrial IoT solutions, the XCZU6EG-2FFVB1156I delivers the processing power, flexibility, and reliability your project demands.


XCZU6EG-2FFVB1156I Key Features and Benefits

The XCZU6EG-2FFVB1156I stands out in the Zynq UltraScale+ EG family for its exceptional balance of processing capability and programmable logic resources. Here’s why engineers choose this device for mission-critical applications:

Powerful Heterogeneous Processing Architecture

This MPSoC integrates multiple processing engines on a single chip, eliminating the need for discrete components and reducing board complexity. The heterogeneous architecture enables workload optimization across different processing domains.

Industrial-Grade Temperature Rating

The “-I” suffix indicates industrial temperature range support (-40°C to +100°C), ensuring reliable operation in harsh environmental conditions typical of industrial, automotive, and aerospace applications.

High-Speed Connectivity Options

Built-in support for PCIe Gen2/Gen3, USB 3.0, SATA 3.0, and Gigabit Ethernet provides extensive connectivity options for modern embedded systems without requiring additional interface chips.


XCZU6EG-2FFVB1156I Technical Specifications

Specification Details
Manufacturer AMD (formerly Xilinx)
Part Number XCZU6EG-2FFVB1156I
Family Zynq UltraScale+ MPSoC
Series EG (Embedded + Graphics)
Process Technology 16nm FinFET+
Package Type FCBGA-1156
Pin Count 1156
Speed Grade -2
Temperature Grade Industrial (-40°C to +100°C)
Core Voltage (VCCINT) 0.85V
RoHS Status Compliant

XCZU6EG-2FFVB1156I Processor Subsystem Specifications

Application Processing Unit (APU)

Feature Specification
Processor Cores Quad-core ARM Cortex-A53
Max Frequency 1.5 GHz
Architecture 64-bit ARMv8-A
L1 Cache 32KB I-Cache + 32KB D-Cache per core
L2 Cache 1MB shared
NEON/FPU Included

Real-Time Processing Unit (RPU)

Feature Specification
Processor Cores Dual-core ARM Cortex-R5F
Max Frequency 600 MHz
Architecture 32-bit ARMv7-R
Floating Point Unit Included
Memory Protection Yes
Operating Modes Lock-step or Split

Graphics Processing Unit (GPU)

Feature Specification
GPU Core ARM Mali-400 MP2
Pixel Processors 2
OpenGL ES Support 1.1, 2.0
OpenVG Support 1.1

XCZU6EG-2FFVB1156I Programmable Logic Resources

The XCZU6EG-2FFVB1156I features extensive programmable logic (PL) resources built on AMD’s UltraScale architecture, enabling custom hardware acceleration and I/O expansion.

Logic Resource Quantity
System Logic Cells 429,208
CLB Flip-Flops 469,446
CLB LUTs 234,720
Distributed RAM (Mb) 3.7
Block RAM (Mb) 11.0
UltraRAM (Mb) 9.0
DSP Slices 1,368

XCZU6EG-2FFVB1156I Memory and Interface Specifications

DDR Memory Controller

Feature Specification
DDR Standards DDR3, DDR3L, DDR4, LPDDR3, LPDDR4
Max Data Rate 2,400 Mb/s
ECC Support Yes
Max Capacity 32GB per controller

High-Speed Serial Transceivers

Feature Specification
PS-GTR Transceivers 4
Max Data Rate 6.0 Gb/s
Supported Protocols USB 3.0, SATA 3.0, DisplayPort, PCIe Gen2

Integrated Peripherals

Peripheral Quantity/Details
Gigabit Ethernet 4× GEM with IEEE 1588
USB 3.0 2× with PHY
SATA 3.0 2× ports
PCIe Gen2 x4
DisplayPort Dual-lane, 4K@30fps
SPI
I2C
UART
CAN 2× (CAN 2.0B)
GPIO 78× MIO + 96× EMIO

XCZU6EG-2FFVB1156I Package Information

FFVB1156 Package Details

Parameter Value
Package Type Flip-Chip Fine-Pitch BGA
Dimensions 35mm × 35mm
Ball Pitch 1.0mm
Ball Count 1156
Lead-Free Yes (RoHS Compliant)
Alpha Particle Emission Ultra-Low Alpha (ULA)

Maximum User I/O

I/O Type Quantity
High-Performance (HP) I/O 156
High-Density (HD) I/O 48
Total User I/O 204

XCZU6EG-2FFVB1156I Applications

The XCZU6EG-2FFVB1156I is designed for demanding applications requiring high processing performance, hardware acceleration, and industrial reliability.

Aerospace and Defense Systems

The industrial temperature rating and comprehensive security features make the XCZU6EG-2FFVB1156I suitable for avionic systems, radar processing, secure communications, and electronic warfare applications.

5G Wireless Infrastructure

Advanced signal processing capabilities and high-speed transceivers enable implementation of 5G base station equipment, massive MIMO systems, and beamforming applications.

Industrial Automation and IoT

Motor control, sensor fusion, predictive maintenance systems, and industrial robots benefit from the real-time processing capability of the dual Cortex-R5F cores combined with programmable logic.

Advanced Driver Assistance Systems (ADAS)

Camera processing, sensor fusion, and machine learning inference for automotive safety systems leverage the heterogeneous processing architecture and high-bandwidth interfaces.

Medical Imaging Equipment

Ultrasound, CT, and MRI systems utilize the high-performance DSP slices and programmable logic for real-time image processing and reconstruction.

Video and Broadcast Equipment

Professional video processing, encoding, and switching equipment benefits from the Mali-400 GPU and extensive programmable logic resources.


XCZU6EG-2FFVB1156I Development Tools and Software Support

AMD provides comprehensive development tools and software support for the XCZU6EG-2FFVB1156I.

Hardware Design Tools

Tool Purpose
Vivado Design Suite FPGA synthesis, implementation, and debugging
Vitis Unified Software Platform Embedded software development and acceleration
PetaLinux Tools Linux kernel and rootfs development

Operating System Support

OS Support Level
Linux (PetaLinux) Full
FreeRTOS Full
VxWorks Third-party
QNX Third-party
Ubuntu Community

Evaluation and Development Kits

Engineers can prototype designs using AMD evaluation boards such as the ZCU102 and ZCU104, or third-party development kits from partners like Avnet, Trenz Electronic, and Digilent.


XCZU6EG-2FFVB1156I Part Number Decoder

Understanding the part number helps ensure you order the correct device variant:

XCZU6EG - 2 - FFVB1156 - I
  │   │   │      │       └── Temperature Grade: I = Industrial (-40°C to +100°C)
  │   │   │      └────────── Package: FFVB1156 = 1156-ball Flip-Chip BGA
  │   │   └───────────────── Speed Grade: -2 (Standard performance)
  │   └───────────────────── Family: EG = Embedded + Graphics (with Mali GPU)
  └───────────────────────── Device: ZU6 = Zynq UltraScale+ ZU6 resources

Available Speed Grades

Speed Grade Performance Level
-1 Standard
-2 High Performance
-3 Highest Performance

Temperature Grade Options

Suffix Temperature Range
E Extended (0°C to +100°C)
I Industrial (-40°C to +100°C)
Q Automotive Q-Grade

Why Choose XCZU6EG-2FFVB1156I Over Competitors

Single-Chip Solution

The XCZU6EG-2FFVB1156I integrates processors, GPU, programmable logic, and connectivity in one device, reducing BOM cost, board space, and power consumption compared to multi-chip alternatives.

Scalable Architecture

Pin-compatible with other Zynq UltraScale+ devices allows design migration to higher or lower resource variants without PCB redesign.

Long-Term Availability

AMD commits to extended product longevity for UltraScale+ devices through 2045, providing supply chain security for products with long lifecycle requirements.

Comprehensive Security Features

Built-in security includes secure boot, RSA-4096 authentication, AES-256 encryption, and anti-tamper capabilities essential for defense and critical infrastructure applications.


Buy XCZU6EG-2FFVB1156I – Where to Purchase

Looking for authentic XCZU6EG-2FFVB1156I components at competitive prices? PCBsync offers genuine AMD Xilinx products with full manufacturer warranty, competitive pricing, and fast worldwide shipping.

Browse our complete selection of Xilinx FPGA products for your next embedded design project.

Why Buy from PCBsync?

  • 100% Authentic Components – Sourced directly from authorized distribution channels
  • Competitive Pricing – Best prices for both small quantities and volume orders
  • Fast Shipping – Same-day dispatch on in-stock items
  • Technical Support – Expert assistance for component selection and cross-referencing
  • Full Documentation – Access to datasheets, user guides, and application notes

XCZU6EG-2FFVB1156I Frequently Asked Questions

What is the difference between XCZU6EG and XCZU6CG?

The XCZU6EG (EG series) includes the ARM Mali-400 MP2 GPU for graphics processing and has a quad-core Cortex-A53 running at 1.5GHz. The XCZU6CG (CG series) lacks the GPU and features a dual-core Cortex-A53 at 1.3GHz.

Is XCZU6EG-2FFVB1156I suitable for automotive applications?

While the “-I” industrial grade operates from -40°C to +100°C, for full automotive qualification, consider the “-Q” automotive grade variants that meet AEC-Q100 requirements.

What development board supports XCZU6EG?

The AMD ZCU102 evaluation kit is the primary development platform for XCZU6EG designs, providing access to all key interfaces and featuring production-equivalent silicon.

Can I migrate my design from Zynq-7000 to XCZU6EG?

Yes, with code modifications. The Zynq UltraScale+ uses 64-bit Cortex-A53 cores versus 32-bit Cortex-A9 in Zynq-7000. Vivado and Vitis tools support design migration with IP and software adaptation.

What is the typical power consumption?

Power consumption varies by clock speed, logic utilization, and I/O configuration. Use the Vivado Power Estimator tool for accurate estimates. Typical designs range from 5W to 25W depending on configuration.


Related AMD Xilinx Products

Part Number Description Logic Cells
XCZU4EG-2FBVB900I Zynq UltraScale+ ZU4EG, 900-ball BGA 178K
XCZU9EG-2FFVB1156I Zynq UltraScale+ ZU9EG, 1156-ball BGA 600K
XCZU15EG-2FFVB1156I Zynq UltraScale+ ZU15EG, 1156-ball BGA 727K
XCZU6CG-2FFVB1156I Zynq UltraScale+ ZU6CG (No GPU) 429K

Order XCZU6EG-2FFVB1156I Today

Ready to start your next embedded project with the XCZU6EG-2FFVB1156I? Contact our sales team for pricing, availability, and volume discounts on this and other AMD Xilinx Zynq UltraScale+ MPSoC devices.

Explore our full range of Xilinx FPGA solutions for aerospace, defense, industrial, and telecommunications applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.