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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU6EG-2FFVB1156E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA

Product Details

The XCZU6EG-2FFVB1156E is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This advanced FPGA combines powerful ARM processing cores with extensive programmable logic, making it ideal for demanding applications in industrial automation, telecommunications, embedded vision, and edge computing.


XCZU6EG-2FFVB1156E Key Features and Benefits

The XCZU6EG-2FFVB1156E delivers exceptional processing power and flexibility in a single integrated device. Built on advanced 16nm FinFET+ technology, this Xilinx FPGA offers significant advantages for modern embedded system designs.

Heterogeneous Processing Architecture

The XCZU6EG-2FFVB1156E integrates multiple processing engines to handle diverse workloads efficiently:

  • Quad-core ARM Cortex-A53 Application Processing Unit (APU) operating at up to 1.5GHz with NEON SIMD extensions and single/double precision floating-point support
  • Dual-core ARM Cortex-R5 Real-Time Processing Unit (RPU) running at up to 600MHz for deterministic, low-latency operations
  • ARM Mali-400 MP2 Graphics Processing Unit (GPU) with dedicated 64KB L2 cache for graphics rendering and display applications

Advanced Programmable Logic Resources

The XCZU6EG-2FFVB1156E provides substantial programmable logic capacity for custom hardware acceleration and signal processing.


XCZU6EG-2FFVB1156E Technical Specifications

Parameter Specification
Manufacturer AMD Xilinx
Product Family Zynq UltraScale+ MPSoC (EG Device)
Part Number XCZU6EG-2FFVB1156E
Package Type 1156-Ball FCBGA (Flip-Chip Fine-Pitch BGA)
Speed Grade -2 (Extended Temperature)
Process Technology 16nm FinFET+
Core Voltage 0.85V

Processing System Specifications

Processing Unit Details
Application Processor Quad-core ARM Cortex-A53 @ 1.5GHz
Real-Time Processor Dual-core ARM Cortex-R5 @ 600MHz
Graphics Processor ARM Mali-400 MP2
APU L1 Cache 32KB Instruction / 32KB Data per core
APU L2 Cache 1MB Shared
RPU L1 Cache 32KB Instruction / 32KB Data per core
RPU TCM 128KB per core

Programmable Logic Resources

Resource Quantity
System Logic Cells 469,446
CLB Flip-Flops 429,208
CLB LUTs 214,604
DSP Slices 1,728
Block RAM 19.1 Mb
UltraRAM 3.0 Mb
Maximum Distributed RAM 8.0 Mb

High-Speed Connectivity

Interface Specification
GTH Transceivers Up to 24 channels
GTH Data Rate Up to 16.3 Gb/s
PS-GTR Transceivers 4 channels
PCIe Support Gen1/Gen2 x1, x2, x4
USB USB 3.0 and USB 2.0
DisplayPort 1.2a (up to 4K @ 30fps)
SATA 3.1 (up to 6 Gb/s)
Ethernet Dual Gigabit Ethernet with IEEE 1588

Memory Interface Support

Memory Type Support
DDR4 Up to 2400 Mb/s with 72-bit ECC
DDR3/DDR3L Up to 1866 Mb/s with 72-bit ECC
LPDDR4 Up to 2133 Mb/s
LPDDR3 Up to 1866 Mb/s

XCZU6EG-2FFVB1156E Package Information

Physical Dimensions and Pinout

Specification Value
Package Code FFVB1156
Ball Count 1156
Ball Pitch 1.0 mm
Package Size 35mm × 35mm
Maximum User I/O (HP) 312
Maximum User I/O (HD) 48
PS I/O 214

XCZU6EG-2FFVB1156E Applications

The XCZU6EG-2FFVB1156E is engineered for performance-critical applications across multiple industries.

Industrial Automation and Control

This SoC excels in industrial environments requiring real-time processing, motor control, and machine vision capabilities. The combination of ARM Cortex-R5 real-time processors with high-speed programmable logic enables deterministic control loops with sub-microsecond latency.

Embedded Vision and Image Processing

With 469,446 logic cells and 1,728 DSP slices, the XCZU6EG-2FFVB1156E provides exceptional performance for video analytics, computer vision, and image processing applications. The integrated GPU supports display interfaces while the FPGA fabric handles parallel pixel processing.

5G Wireless Infrastructure

The high-speed GTH transceivers and extensive logic resources make this device suitable for 5G base stations, radio units, and network equipment requiring massive MIMO processing and beamforming acceleration.

Automotive ADAS Systems

Designed with automotive applications in mind, the XCZU6EG-2FFVB1156E supports advanced driver assistance systems (ADAS) including sensor fusion, object detection, and autonomous driving functions.

Edge Computing and AI Acceleration

The programmable logic fabric enables deployment of custom neural network accelerators and machine learning inference engines at the network edge, combining AI processing with traditional control functions.


XCZU6EG-2FFVB1156E Design Resources

Development Tools

The XCZU6EG-2FFVB1156E is fully supported by AMD Xilinx’s comprehensive design ecosystem:

  • Vivado Design Suite for FPGA logic design, synthesis, and implementation
  • Vitis Unified Software Platform for embedded software development and AI/ML deployment
  • PetaLinux Tools for Linux-based embedded systems
  • Vitis AI for deep learning inference acceleration

Documentation and Support

Designers working with the XCZU6EG-2FFVB1156E have access to extensive technical documentation including datasheets, user guides, application notes, and reference designs through AMD’s official documentation portal.


XCZU6EG-2FFVB1156E Ordering Information

Part Number Description Temperature Range
XCZU6EG-2FFVB1156E Zynq UltraScale+ MPSoC EG, -2 Speed, 1156 FCBGA Extended: 0°C to +100°C
XCZU6EG-2FFVB1156I Zynq UltraScale+ MPSoC EG, -2 Speed, 1156 FCBGA Industrial: -40°C to +100°C
XCZU6EG-1FFVB1156E Zynq UltraScale+ MPSoC EG, -1 Speed, 1156 FCBGA Extended: 0°C to +100°C
XCZU6EG-1FFVB1156I Zynq UltraScale+ MPSoC EG, -1 Speed, 1156 FCBGA Industrial: -40°C to +100°C

Why Choose the XCZU6EG-2FFVB1156E?

The XCZU6EG-2FFVB1156E represents an optimal balance of processing power, programmable logic resources, and power efficiency for mid-range to high-performance embedded applications. Key differentiators include:

  1. Unified Platform Architecture combining ARM processors, GPU, and FPGA in a single device reduces board complexity and BOM cost
  2. Scalable Performance with support for hardware acceleration through custom RTL or Vitis high-level synthesis
  3. Comprehensive Security Features including secure boot, encryption engines, and hardware root of trust
  4. Power Management with advanced power domains enabling aggressive power optimization for battery-powered or thermally constrained applications
  5. Long-Term Availability with AMD’s commitment to extended product lifecycle support through 2045 for UltraScale+ devices

XCZU6EG-2FFVB1156E Summary

The XCZU6EG-2FFVB1156E is a versatile and powerful Zynq UltraScale+ MPSoC that combines quad-core ARM Cortex-A53 application processors, dual-core ARM Cortex-R5 real-time processors, an ARM Mali-400 MP2 GPU, and 469,446 programmable logic cells. With comprehensive connectivity options including 24 GTH transceivers, PCIe Gen2, USB 3.0, and Gigabit Ethernet, this SoC provides a complete solution for advanced embedded systems requiring both processing flexibility and hardware acceleration.

Whether designing industrial automation equipment, embedded vision systems, 5G infrastructure, or edge AI applications, the XCZU6EG-2FFVB1156E delivers the performance, integration, and design flexibility needed to bring innovative products to market faster.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.