The XCZU6EG-1FFVC900E is a powerful Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) from AMD/Xilinx that delivers exceptional performance for demanding embedded computing, industrial automation, aerospace, and defense applications. This advanced Xilinx FPGA combines a feature-rich 64-bit quad-core ARM Cortex-A53 processing system with highly flexible FPGA programmable logic on a single chip.
XCZU6EG-1FFVC900E Product Overview
The XCZU6EG-1FFVC900E belongs to the Zynq UltraScale+ MPSoC EG family, which represents the second generation of AMD/Xilinx’s heterogeneous computing platform. This device integrates application processing, real-time processing, graphics processing, and programmable logic into a unified architecture, making it ideal for applications requiring both hardware acceleration and software flexibility.
Built on advanced 16nm FinFET+ technology, the XCZU6EG-1FFVC900E delivers industry-leading performance-per-watt efficiency while providing extensive I/O capabilities and security features essential for modern embedded systems.
XCZU6EG-1FFVC900E Key Features and Benefits
Heterogeneous Processing Architecture
The XCZU6EG-1FFVC900E integrates multiple processing domains that work seamlessly together:
- Quad-core 64-bit ARM Cortex-A53 application processors running up to 1.5 GHz
- Dual ARM Cortex-R5F real-time processors for deterministic, low-latency operations
- ARM Mali-400 MP2 graphics processing unit for display and video acceleration
- UltraScale+ programmable logic with 504K+ system logic cells
Advanced Programmable Logic Resources
The FPGA fabric in the XCZU6EG-1FFVC900E provides substantial resources for custom hardware acceleration:
- 469,446 configurable logic cells
- 1,973 DSP48E2 slices for signal processing applications
- 38 Mb of distributed RAM and block RAM
- Built-in UltraRAM high-density on-chip memory
High-Speed Connectivity
This MPSoC FPGA offers comprehensive I/O options for modern system designs:
- GTH transceivers supporting up to 16.3 Gb/s data rates
- Integrated PCIe Gen3/Gen4 controller
- Native support for 100 GbE and Interlaken protocols
- DDR4 memory interface support up to 2,400 MT/s
XCZU6EG-1FFVC900E Technical Specifications
| Parameter |
Specification |
| Part Number |
XCZU6EG-1FFVC900E |
| Manufacturer |
AMD (formerly Xilinx) |
| Device Family |
Zynq UltraScale+ MPSoC EG |
| Package Type |
FFVC900 (Flip-Chip Fine-Pitch BGA) |
| Pin Count |
900 pins |
| Package Dimensions |
31 x 31 mm |
| Speed Grade |
-1 (Standard Performance) |
| Temperature Grade |
Extended (E): 0°C to +100°C |
| Process Technology |
16nm FinFET+ |
| Core Voltage (VCCINT) |
0.85V |
| RoHS Compliance |
Lead-Free, RoHS Compliant |
XCZU6EG-1FFVC900E Processing System Specifications
Application Processing Unit (APU)
| Feature |
Details |
| Processor Cores |
Quad-core ARM Cortex-A53 |
| Architecture |
64-bit ARMv8-A |
| Max Frequency |
Up to 1.5 GHz |
| Cache L1 |
32 KB I-Cache + 32 KB D-Cache per core |
| Cache L2 |
1 MB shared |
| SIMD/NEON |
Yes |
Real-Time Processing Unit (RPU)
| Feature |
Details |
| Processor Cores |
Dual ARM Cortex-R5F |
| Max Frequency |
Up to 600 MHz |
| Operating Mode |
Lockstep or Split mode |
| TCM |
256 KB per processor |
| Features |
ECC support, deterministic execution |
Graphics Processing Unit (GPU)
| Feature |
Details |
| GPU Type |
ARM Mali-400 MP2 |
| Max Frequency |
Up to 667 MHz |
| Shader Processors |
2 |
| API Support |
OpenGL ES 1.1/2.0, OpenVG 1.1 |
XCZU6EG-1FFVC900E Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
504,480 |
| CLB Flip-Flops |
548,160 |
| CLB LUTs |
274,080 |
| Block RAM (36Kb) |
713 |
| Block RAM (Mb) |
25.3 |
| UltraRAM (Mb) |
9.0 |
| DSP48E2 Slices |
1,973 |
| GTH Transceivers |
24 |
| Max I/O Pins |
328 |
XCZU6EG-1FFVC900E Target Applications
The versatile architecture of the XCZU6EG-1FFVC900E makes it suitable for numerous demanding applications across multiple industries:
Industrial Automation and Control
- Motor drive control systems
- Programmable logic controllers (PLCs)
- Machine vision and inspection systems
- Industrial IoT gateway devices
Telecommunications and Networking
- 5G wireless infrastructure
- Software-defined networking (SDN)
- Network function virtualization (NFV)
- High-speed packet processing
Aerospace and Defense
- Radar and electronic warfare systems
- Avionics computing platforms
- Secure communications equipment
- Embedded mission computers
Medical and Healthcare
- Medical imaging equipment
- Ultrasound systems
- Patient monitoring devices
- Diagnostic instruments
Automotive (ADAS)
- Advanced driver assistance systems
- Sensor fusion platforms
- In-vehicle infotainment
- Vehicle-to-everything (V2X) communications
XCZU6EG-1FFVC900E Development Tools and Ecosystem
AMD/Xilinx provides comprehensive development tools for the XCZU6EG-1FFVC900E:
Vivado Design Suite
The industry-leading Vivado Design Suite offers RTL-to-bitstream implementation flows optimized for UltraScale+ devices, including advanced synthesis, placement, and routing algorithms.
Vitis Unified Software Platform
Vitis enables software-centric development, allowing engineers to accelerate C/C++ applications using the programmable logic without requiring deep hardware expertise.
PetaLinux Tools
The PetaLinux toolchain simplifies embedded Linux development, providing a complete build environment for creating custom Linux distributions targeting Zynq UltraScale+ devices.
XCZU6EG-1FFVC900E Security Features
The XCZU6EG-1FFVC900E includes robust security capabilities essential for modern applications:
- AES-GCM 256-bit encryption for bitstream and data protection
- RSA-4096 authentication
- Physical Unclonable Function (PUF) for secure key storage
- Secure boot with chain of trust
- Anti-tamper features
- JTAG disable capability
XCZU6EG-1FFVC900E Package Information
The FFVC900 package offers an optimal balance of I/O density and thermal performance:
| Package Parameter |
Value |
| Package Code |
FFVC900 |
| Package Type |
Flip-Chip Fine-Pitch BGA |
| Ball Pitch |
1.0 mm |
| Body Size |
31 x 31 mm |
| Ball Count |
900 |
| Theta-JA |
Approximately 8.0°C/W |
| Maximum User I/O |
328 |
XCZU6EG-1FFVC900E Ordering Information
When ordering the XCZU6EG-1FFVC900E, the part number can be decoded as follows:
- XC – Xilinx Commercial
- ZU6 – Zynq UltraScale+ Device Size (ZU6)
- EG – Device Subfamily (EG = with GPU)
- -1 – Speed Grade (Standard)
- FF – Package Type (Flip-Chip Fine-Pitch)
- VC – Package Variant
- 900 – Pin Count
- E – Temperature Grade (Extended: 0°C to +100°C)
Related Part Numbers
| Part Number |
Description |
| XCZU6EG-1FFVC900I |
Industrial Temperature Grade (-40°C to +100°C) |
| XCZU6EG-2FFVC900E |
Speed Grade -2 (Higher Performance) |
| XCZU6EG-1FFVB1156E |
Larger Package (1156-Pin) |
| XCZU6CG-1FFVC900E |
Without GPU (CG Variant) |
XCZU6EG-1FFVC900E vs. Alternatives Comparison
| Feature |
XCZU6EG-1FFVC900E |
XCZU4EG |
XCZU9EG |
| Logic Cells |
504K |
350K |
600K |
| DSP Slices |
1,973 |
1,728 |
2,520 |
| Block RAM |
25.3 Mb |
15.0 Mb |
32.1 Mb |
| GTH Transceivers |
24 |
16 |
24 |
| GPU |
Mali-400 MP2 |
Mali-400 MP2 |
Mali-400 MP2 |
| Relative Price |
Medium |
Lower |
Higher |
Why Choose XCZU6EG-1FFVC900E for Your Design
The XCZU6EG-1FFVC900E represents an excellent choice for engineers seeking a balanced combination of processing power, programmable logic resources, and integrated peripherals. Key advantages include:
- Unified Platform – Single-chip solution combining processors, FPGA, and GPU eliminates the need for multiple devices
- Scalable Performance – Extensive programmable logic enables custom hardware acceleration
- Low Power Consumption – 16nm FinFET+ technology delivers superior performance-per-watt
- Long-Term Availability – Part of AMD/Xilinx’s flagship product line with extended lifecycle support
- Comprehensive Ecosystem – Robust tool support and extensive documentation accelerate development
Frequently Asked Questions About XCZU6EG-1FFVC900E
What is the difference between XCZU6EG and XCZU6CG?
The XCZU6EG includes an integrated ARM Mali-400 MP2 GPU, while the XCZU6CG variant does not have a GPU. Choose the EG variant if your application requires graphics or video acceleration capabilities.
What speed grades are available for XCZU6EG-1FFVC900E?
The XCZU6EG is available in -1, -2, and -3 speed grades, with -3 offering the highest performance. The -1 suffix in XCZU6EG-1FFVC900E indicates the standard speed grade.
What temperature range does the XCZU6EG-1FFVC900E support?
The “E” suffix indicates extended temperature grade (0°C to +100°C). Industrial grade (-40°C to +100°C) variants are available with the “I” suffix.
What is the maximum DDR4 memory speed supported?
The XCZU6EG-1FFVC900E supports DDR4 memory interfaces with speeds up to 2,400 MT/s, providing high-bandwidth access to external memory.
Is the XCZU6EG-1FFVC900E RoHS compliant?
Yes, the XCZU6EG-1FFVC900E is fully RoHS compliant with lead-free packaging, as indicated by the “E” suffix in the part number.
Get XCZU6EG-1FFVC900E Technical Support
For comprehensive technical resources including datasheets, reference designs, and application notes for the XCZU6EG-1FFVC900E, visit the AMD/Xilinx documentation portal. Development boards and evaluation kits are available to accelerate your design cycle.
Contact authorized distributors for pricing, availability, and volume quotations for the XCZU6EG-1FFVC900E and related Zynq UltraScale+ MPSoC devices.
