Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU6CG-2FFVB1156E: AMD Xilinx Zynq UltraScale+ MPSoC System-on-Chip

Product Details

The XCZU6CG-2FFVB1156E is a high-performance System-on-Chip (SoC) from AMD Xilinx’s renowned Zynq UltraScale+ MPSoC family. This advanced embedded processor combines dual ARM Cortex-A53 application processors with dual ARM Cortex-R5 real-time processors and programmable logic in a single, powerful device. Designed for demanding industrial, automotive, and communications applications, the XCZU6CG-2FFVB1156E delivers exceptional processing power with 469K+ logic cells and advanced 16nm FinFET+ technology.


XCZU6CG-2FFVB1156E Key Features and Benefits

The XCZU6CG-2FFVB1156E belongs to the CG (Cost-optimized, no GPU) variant of the Zynq UltraScale+ MPSoC family. This device offers an optimal balance between performance, power efficiency, and cost-effectiveness for embedded system designers.

Dual ARM Cortex-A53 Application Processing Unit

The XCZU6CG-2FFVB1156E features a powerful Application Processing Unit (APU) with dual ARM Cortex-A53 MPCore processors with CoreSight technology. These 64-bit processors operate at frequencies up to 1.3 GHz, providing exceptional computing performance for complex algorithms and operating system tasks.

Dual ARM Cortex-R5 Real-Time Processing Unit

For deterministic, low-latency operations, the XCZU6CG-2FFVB1156E includes a Real-Time Processing Unit (RPU) with dual ARM Cortex-R5 processors running at up to 533 MHz. This architecture enables precise motor control, safety-critical functions, and real-time sensor processing.


XCZU6CG-2FFVB1156E Technical Specifications

Parameter Specification
Part Number XCZU6CG-2FFVB1156E
Manufacturer AMD (formerly Xilinx)
Product Family Zynq UltraScale+ MPSoC
Device Variant CG (Dual A53, no GPU)
Logic Cells 469,446+ (469K+)
CLB LUTs 117K
Speed Grade -2 (Standard Performance)
Package Type 1156-FCBGA (Flip-Chip BGA)
Package Dimensions 35mm x 35mm
Operating Voltage (VCCINT) 0.85V
Temperature Grade Extended (E): 0°C to +100°C
Process Technology 16nm FinFET+

XCZU6CG-2FFVB1156E Programmable Logic Resources

The XCZU6CG-2FFVB1156E integrates high-performance UltraScale+ programmable logic fabric, enabling custom hardware acceleration and flexible I/O interfacing.

Programmable Logic Specifications

Resource Quantity
System Logic Cells 469,446
CLB Look-Up Tables (LUTs) 117K
CLB Flip-Flops 234K
Max. Distributed RAM 3.5 Mb
Total Block RAM 5.1 Mb
DSP Slices 1,248
Clock Management Tiles (CMTs) 4

XCZU6CG-2FFVB1156E Processing System Architecture

Application Processing Unit (APU) Features

Feature Description
Processor Cores Dual ARM Cortex-A53 MPCore
Architecture 64-bit ARMv8-A with AArch64 support
Maximum Frequency Up to 1.3 GHz
L1 Cache 32KB I-Cache + 32KB D-Cache per core
L2 Cache 1MB shared
Debug Technology ARM CoreSight

Real-Time Processing Unit (RPU) Features

Feature Description
Processor Cores Dual ARM Cortex-R5F
Architecture 32-bit ARMv7-R
Maximum Frequency Up to 533 MHz
Operating Modes Lock-step or Split mode
Debug Technology ARM CoreSight

XCZU6CG-2FFVB1156E Memory and Connectivity

Memory Interface Support

The XCZU6CG-2FFVB1156E provides comprehensive memory interface support for high-bandwidth data processing:

Interface Type Support
DDR4 Yes, with ECC
DDR3/DDR3L Yes, with ECC
LPDDR4 Yes
LPDDR3 Yes
QSPI Flash Yes
NAND Flash ONFI 3.1
eMMC Yes
SD/SDIO Yes

Peripheral Connectivity

Peripheral Specification
Gigabit Ethernet GEM with IEEE 1588
USB 3.0 Dual-role device
USB 2.0 Host/Device
PCIe Gen2 x4 (PS-side)
SATA 3.1 (up to 6 Gb/s)
DisplayPort 1.2a
SPI Multiple channels
I2C Multiple channels
UART Multiple channels
CAN 2.0B
GPIO Up to 78 PS MIO

XCZU6CG-2FFVB1156E Package Information

1156-FCBGA Package Details

Parameter Value
Package Code FFVB1156
Package Type Flip-Chip Fine-Pitch BGA
Pin Count 1156
Ball Pitch 1.0mm
Body Size 35mm x 35mm
Lead-Free Yes (RoHS Compliant)

XCZU6CG-2FFVB1156E Industrial Applications

The XCZU6CG-2FFVB1156E is engineered for high-reliability embedded applications across multiple industries:

Industrial Automation and Control

  • Programmable Logic Controllers (PLCs)
  • Industrial motor drives and servo control
  • Factory automation systems
  • Robotics and motion control
  • Industrial IoT gateways

Communications Infrastructure

  • 5G wireless base stations
  • Network packet processing
  • Software-defined radio (SDR)
  • Wired communications equipment

Aerospace and Defense

  • Radar signal processing
  • Electronic warfare systems
  • Mission-critical computing
  • Secure communications

Medical and Scientific

  • Medical imaging systems
  • Diagnostic equipment
  • Laboratory instrumentation
  • Real-time data acquisition

XCZU6CG-2FFVB1156E Development Tools and Software

AMD provides comprehensive development support for the XCZU6CG-2FFVB1156E:

Tool Purpose
Vivado Design Suite FPGA synthesis, implementation, and debug
Vitis Unified Software Platform Embedded software and AI/ML development
PetaLinux Tools Embedded Linux customization and deployment
SDK/IDE Bare-metal and RTOS development

Why Choose XCZU6CG-2FFVB1156E for Your Design?

The XCZU6CG-2FFVB1156E offers significant advantages for embedded system designers:

  1. Heterogeneous Processing: Combine software programmability with hardware acceleration
  2. Power Efficiency: 16nm FinFET+ technology delivers optimal performance per watt
  3. Scalability: Part of a pin-compatible family for easy migration
  4. Security: Hardware-based security features including encryption and secure boot
  5. Flexibility: Programmable logic enables custom interfaces and accelerators
  6. Long-Term Availability: Industrial-grade component with extended lifecycle support

Order XCZU6CG-2FFVB1156E Today

Looking for high-quality AMD Xilinx Zynq UltraScale+ MPSoC components? Explore our complete selection of Xilinx FPGA products for your embedded design requirements. We offer competitive pricing, authentic components, and reliable supply chain solutions for your XCZU6CG-2FFVB1156E procurement needs.


XCZU6CG-2FFVB1156E Related Part Numbers

Part Number Description
XCZU6CG-1FFVB1156E Speed Grade -1, Extended Temp
XCZU6CG-2FFVB1156I Speed Grade -2, Industrial Temp
XCZU6CG-1FFVC900E Speed Grade -1, 900-FCBGA Package
XCZU6EG-2FFVB1156E EG Variant with GPU, Same Package
XCZU9EG-2FFVB1156E Higher Logic Capacity Option

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.