The XCZU47DR-L2FFVE1156I is a high-performance Xilinx FPGA from AMD’s Zynq UltraScale+ RFSoC Gen3 family. This System-on-Chip IC features quad ARM Cortex-A53 and dual ARM Cortex-R5 processors with CoreSight technology, delivering 930K+ logic cells in a 1156-FCBGA package. DigiKey Designed for demanding RF applications, this device combines advanced processing capabilities with direct RF-sampling data converters on a single chip.
XCZU47DR-L2FFVE1156I Key Features and Benefits
The XCZU47DR-L2FFVE1156I represents a breakthrough in RF system integration. This device operates at up to 7.125 GHz input/output frequency and includes device variants with integrated LDPC SD-FEC cores and high DSP density for 5G baseband applications. AMD
Integrated RF Data Converters
The XCZU47DR features 8 RF-ADC channels with up to 5 GSPS sampling and 8 RF-DAC channels with up to 9.85 GSPS sampling, designed for applications in wireless communications, radar systems, and test and measurement. Alinx The RF data converters include power-efficient digital down converters (DDCs) and digital up converters (DUCs) with programmable interpolation and decimation, NCO, and complex mixer capabilities. Mouser
Powerful Processing Subsystem
The device integrates a quad-core ARM Cortex-A53 processor running up to 1.333 GHz and a dual-core ARM Cortex-R5F processor up to 533 MHz, along with 256KB integrated RAM. RayPCB
XCZU47DR-L2FFVE1156I Technical Specifications
| Parameter |
Specification |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Zynq UltraScale+ RFSoC Gen3 |
| Part Number |
XCZU47DR-L2FFVE1156I |
| Speed Grade |
-2L (Low Power Industrial) |
| Package Type |
1156-FCBGA (35×35mm) |
| Temperature Grade |
Industrial: -40°C to +100°C (TJ) |
| Process Technology |
16nm FinFET+ |
| Part Status |
Active |
Programmable Logic Resources
| Resource |
Value |
| System Logic Cells |
930K+ |
| CLB LUTs |
425K |
| DSP Slices |
4,272 |
| Block RAM |
38.0 Mb |
| UltraRAM |
22.5 Mb |
| Max Distributed RAM |
13.0 Mb |
Processing System Specifications
| Feature |
Details |
| Application Processor |
Quad-core ARM Cortex-A53 @ 1.333 GHz |
| Real-Time Processor |
Dual-core ARM Cortex-R5F @ 533 MHz |
| L1 Cache |
32KB/32KB per core |
| L2 Cache (APU) |
1MB shared |
| On-Chip Memory |
256KB with ECC |
RF Data Converter Specifications
| Converter Type |
Channels |
Resolution |
Max Sample Rate |
| RF-ADC with DDC |
8 |
14-bit |
5.0 GSPS |
| RF-DAC with DUC |
8 |
14-bit |
9.85 GSPS |
High-Speed Connectivity
| Interface |
Specification |
| PL GTY Transceivers |
8 channels @ up to 28.21 Gbps |
| PS-GTR Transceivers |
4 channels @ up to 6.0 Gbps |
| PCIe Support |
Gen3 x16 / Gen4 x8 |
| Ethernet |
4× Triple-Speed Ethernet MAC |
XCZU47DR-L2FFVE1156I Peripheral Interfaces and Connectivity
The device supports extensive connectivity options including CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG interfaces. Ysonix
The processing system includes a pair of USB 2.0 controllers configurable as host, device, or OTG; I2C controller; UART; and CAN2.0B controller conforming to ISO11898-1. FPGAkey Additionally, the device provides 128 bits of GPIO, with 78 bits available through MIO and 96 through EMIO. FPGAkey
XCZU47DR-L2FFVE1156I Applications
The Zynq UltraScale+ RFSoC enables optimal millimeter wave IF implementations including fixed wireless access and mobile backhaul. AMD Key target applications include:
5G Wireless Infrastructure
With RFSoC, wireless infrastructure manufacturers can achieve previously unattainable footprint and power reduction, critical to Massive MIMO deployment. AMD
Aerospace and Defense
As a single-chip TRX solution for scalable, multi-function phased array radar, the Zynq UltraScale+ RFSoC enables low latency transmit and receive for optimal response time in early warning scenarios. AMD
Cable Infrastructure
The Zynq UltraScale+ RFSoC enables cable access multi-service operators (MSOs) to move PHY layer processing closer to home with remote PHY nodes, increasing network capacity. AMD
Software-Defined Radio
The Zynq UltraScale+ RFSoC family is capable of implementing a complete software-defined radio including direct RF sampling data converters, enabling CPRI and gigabit Ethernet-to-RF on a single chip. FPGAkey
Advanced Architecture Features
Configurable Logic Blocks (CLBs)
The device contains 6-input look-up tables (LUTs) and flip-flops, DSP slices with 27×18 multipliers, 36Kb block RAMs with built-in FIFO and ECC support, and 4K×72 UltraRAM blocks connected with high-performance low-latency interconnect. FPGAkey
DSP Slice Capabilities
The DSP slice features 96-bit-wide XOR functionality, 27-bit pre-adder, and 30-bit A input, performing numerous independent functions including multiply accumulate, multiply add, and pattern detect. FPGAkey
Security Features
The device boots via the configuration security unit (CSU), which supports secure boot via 256-bit AES-GCM and SHA/384 blocks. The cryptographic engines in the CSU can be used after boot for user encryption. FPGAkey
XCZU47DR-L2FFVE1156I Package Information
| Parameter |
Value |
| Package Code |
FFVE1156 |
| Package Size |
35mm × 35mm |
| Ball Count |
1156 |
| Ball Pitch |
1.0mm |
| RoHS Status |
RoHS3 Compliant |
| Moisture Sensitivity Level |
Consult datasheet |
Why Choose the XCZU47DR-L2FFVE1156I?
The monolithic integration of direct RF-sampling data converters onto an adaptive SoC eliminates the need for external data converters, enabling a flexible solution with up to 50% reduced power and footprint over a multi-component solution. AMD This integration also eliminates power-hungry FPGA-to-Analog interfaces like JESD204.
The Zynq UltraScale+ RFSoC architecture integrates FPGA fabric for flexibility to meet a wide range of requirements with the same foundational hardware, allowing vendors to react quickly to new market opportunities. AMD
Ordering Information and Availability
The XCZU47DR-L2FFVE1156I is currently available through authorized distributors worldwide with volume discounts available for bulk orders. RayPCB Typical lead times range from 2-12 weeks depending on volume.
Related Documentation
Key technical documents include DS889 – Zynq UltraScale+ RFSoC Overview and UG1075 – Zynq UltraScale+ Package and Pinout Guide. RayPCB
Summary
The XCZU47DR-L2FFVE1156I delivers exceptional RF performance combined with heterogeneous processing capabilities for next-generation wireless, radar, and communications systems. With support for 14-bit ADCs at up to 5 GS/s and 14-bit DACs at up to 10 GS/s with analog bandwidth up to 6 GHz, this device provides a comprehensive single-chip solution for demanding RF applications.
