The XCZU47DR-1FFVG1517I is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ RFSoC family. This advanced Xilinx FPGA device integrates direct RF-sampling data converters with programmable logic and ARM processing cores, making it an ideal solution for 5G wireless infrastructure, software-defined radio (SDR), radar systems, and electronic warfare applications.
XCZU47DR-1FFVG1517I Key Features and Benefits
The XCZU47DR-1FFVG1517I belongs to the third generation of Zynq UltraScale+ RFSoC devices. This architecture eliminates the need for external data converters, enabling up to 50% reduced power consumption and footprint compared to multi-component solutions. AMD The device supports all frequency bands below 6GHz, satisfying essential requirements for fifth-generation (5G) network deployments. Vemeko
ARM Processing System Specifications
The XCZU47DR-1FFVG1517I features a powerful heterogeneous processing system combining application and real-time processors for maximum flexibility.
| Processor Core |
Specifications |
| Application Processor |
Quad-core ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor |
Dual-core ARM Cortex-R5F with CoreSight |
| A53 Clock Speed |
Up to 1.2 GHz |
| R5 Clock Speed |
Up to 500 MHz |
| L1 Cache |
32KB/32KB per core |
| L2 Cache |
1MB shared (A53) |
| Floating Point |
Single/Double Precision (both cores) |
XCZU47DR-1FFVG1517I FPGA Logic Resources
| Parameter |
Specification |
| System Logic Cells |
930K+ |
| Architecture |
UltraScale+ |
| Series |
Zynq UltraScale+ RFSoC |
| On-Chip Memory |
256KB with ECC |
RF Data Converter Specifications for XCZU47DR-1FFVG1517I
The Zynq UltraScale+ RFSoC family integrates key subsystems for multiband, multi-mode cellular radios and cable infrastructure into a single SoC platform. FPGAkey
RF-ADC (Analog-to-Digital Converter) Specifications
| Parameter |
Specification |
| Resolution |
14-bit |
| Maximum Sample Rate |
Up to 5 GSPS |
| Analog Bandwidth |
Up to 6 GHz |
| Digital Down Converter |
Integrated DDC with programmable decimation |
| Configuration |
Real or I/Q data modes |
RF-DAC (Digital-to-Analog Converter) Specifications
| Parameter |
Specification |
| Resolution |
14-bit |
| Maximum Sample Rate |
Up to 9.85 GSPS |
| Analog Bandwidth |
Up to 6 GHz |
| Digital Up Converter |
Integrated DUC with programmable interpolation |
| Configuration |
Real or I/Q data modes |
XCZU47DR-1FFVG1517I Package and Environmental Information
| Parameter |
Specification |
| Package Type |
1517-FCBGA |
| Package Dimensions |
40mm x 40mm |
| Pin Count |
1517 |
| Speed Grade |
-1 |
| Temperature Grade |
Industrial |
| RoHS Status |
RoHS3 Compliant |
| Product Status |
Active |
| Packaging |
Tray |
Memory Interface Support
The XCZU47DR-1FFVG1517I supports various memory technologies for both the processing system and programmable logic:
| Memory Type |
Support |
| DDR4 |
Yes |
| DDR3/DDR3L |
Yes |
| LPDDR4 |
Yes |
| LPDDR3 |
Yes |
| Quad-SPI Flash |
Yes |
| NAND Flash |
Yes |
| eMMC |
Yes |
Advanced Security Features of XCZU47DR-1FFVG1517I
Zynq UltraScale+ RFSoCs are booted via the configuration security unit (CSU), which supports secure boot via 256-bit AES-GCM and SHA/384 blocks. PCC The cryptographic engines remain available after boot for user encryption operations, ensuring robust protection for sensitive applications.
| Security Feature |
Specification |
| Encryption |
256-bit AES-GCM |
| Authentication |
SHA-3/384 |
| RSA Support |
4096-bit |
| Secure Boot |
Yes |
Integrated SD-FEC (Soft-Decision Forward Error Correction)
Zynq UltraScale+ RFSoC integrates soft-decision forward error correction cores with low-density parity checking (LDPC) and turbo codec support. AMD This integrated FEC capability is essential for wireless communication standards including 5G NR and LTE.
Target Applications for XCZU47DR-1FFVG1517I
The XCZU47DR-1FFVG1517I is designed for demanding applications requiring high-performance RF signal processing:
| Application |
Use Case |
| 5G Wireless Infrastructure |
Massive MIMO base stations, remote radio units |
| Software-Defined Radio |
Multi-band, multi-mode radio platforms |
| Phased Array Radar |
Low-latency transmit/receive for early warning systems |
| Electronic Warfare |
DRFM, beamforming, sensor processing |
| Cable Infrastructure |
Remote PHY nodes, DOCSIS systems |
| Test & Measurement |
High-speed signal generation and analysis instruments |
| Quantum Computing |
Qubit control systems |
Why Choose the XCZU47DR-1FFVG1517I RFSoC?
The monolithic integration of direct RF-sampling data converters onto an adaptive SoC eliminates power-hungry FPGA-to-analog interfaces like JESD204, moving much of the RF signal processing into the digital domain. AMD This single-chip approach delivers significant advantages for system designers.
Design Advantages
AMD devices offer typical lifespans extending well past 15 years, with UltraScale+ FPGAs and adaptive SoCs supported through 2045. AMD This long-term availability ensures design longevity for products with extended lifecycles.
The Zynq UltraScale+ RFSoC enables implementation of a complete software-defined radio, including direct RF sampling data converters, enabling CPRI and Gigabit Ethernet-to-RF on a single programmable SoC. FPGAkey
XCZU47DR-1FFVG1517I Ordering Information
| Parameter |
Value |
| Manufacturer Part Number |
XCZU47DR-1FFVG1517I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Zynq UltraScale+ RFSoC |
| Generation |
Gen 3 |
Development Tools and Support
AMD provides comprehensive development tools for the XCZU47DR-1FFVG1517I including Vivado Design Suite for FPGA development, Vitis unified software platform for embedded applications, and the PYNQ framework for Python-based rapid prototyping. Evaluation boards such as the ZCU216 enable designers to quickly prototype and validate their designs.
Frequently Asked Questions About XCZU47DR-1FFVG1517I
What is the difference between XCZU47DR speed grades?
The “-1” in XCZU47DR-1FFVG1517I indicates the standard speed grade. Higher speed grades (-2) offer faster performance but at increased power consumption, while low-power variants (L2) optimize for reduced power applications.
What package options are available for XCZU47DR?
The XCZU47DR is available in the FFVG1517 package, which is a 1517-ball fine-pitch BGA measuring 40mm x 40mm. This package provides the necessary pin count for the extensive I/O requirements of the integrated RF data converters and high-speed interfaces.
Is the XCZU47DR-1FFVG1517I suitable for industrial applications?
Yes, the “I” suffix indicates industrial temperature grade operation, making this device suitable for extended temperature range applications in demanding environments.
