The XCZU29DR-2FFVF1760I is a high-performance RF System-on-Chip (RFSoC) from AMD (formerly Xilinx), belonging to the Zynq UltraScale+ RFSoC family. This advanced Xilinx FPGA integrates multi-gigasample RF data converters, powerful processing systems, and programmable logic into a single device, making it ideal for 5G wireless infrastructure, radar systems, and software-defined radio applications.
XCZU29DR-2FFVF1760I Product Overview
The XCZU29DR-2FFVF1760I combines a quad-core ARM Cortex-A53 application processor with dual-core ARM Cortex-R5 real-time processors, 930,300 programmable logic cells, and integrated RF analog-to-digital and digital-to-analog converters. Built on 20nm FinFET+ process technology, this device delivers exceptional performance while maintaining industrial-grade reliability.
Key Features of the XCZU29DR-2FFVF1760I RFSoC
- Integrated 16-channel RF-ADCs and 16-channel RF-DACs
- Soft-Decision Forward Error Correction (SD-FEC) blocks
- 64-bit quad-core ARM Cortex-A53 MPCore processor
- Dual-core ARM Cortex-R5 real-time processing unit
- Over 4,200 DSP slices for signal processing
- 16 GTY high-speed transceivers
- Support for PCIe Gen3/Gen4, 100G Ethernet, and 150G Interlaken
XCZU29DR-2FFVF1760I Technical Specifications
| Parameter |
Specification |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCZU29DR-2FFVF1760I |
| Product Family |
Zynq UltraScale+ RFSoC |
| Logic Cells |
930,300 |
| Process Technology |
20nm FinFET+ |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-2 (High Performance) |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| Package Type |
FFVF1760 (FCBGA) |
| Pin Count |
1760 |
Processing System Specifications
The XCZU29DR-2FFVF1760I features a comprehensive heterogeneous processing system that combines application-class and real-time processors for maximum flexibility.
Application Processing Unit (APU)
| Feature |
Details |
| Processor Core |
Quad-core ARM Cortex-A53 |
| Architecture |
64-bit ARMv8 |
| Maximum Frequency |
Up to 1.5 GHz |
| L1 Cache |
32KB I-Cache + 32KB D-Cache per core |
| L2 Cache |
1MB shared |
| Features |
NEON SIMD, VFPv4, TrustZone |
Real-Time Processing Unit (RPU)
| Feature |
Details |
| Processor Core |
Dual-core ARM Cortex-R5 |
| Architecture |
32-bit ARMv7-R |
| Maximum Frequency |
Up to 600 MHz |
| Operation Modes |
Lock-step or split mode |
| TCM |
256KB per core |
| Features |
ECC protection, low-latency interrupts |
RF Data Converter Specifications
The integrated RF-ADCs and RF-DACs in the XCZU29DR-2FFVF1760I eliminate the need for external data converter components, reducing system complexity and improving performance.
RF-ADC Specifications
| Parameter |
Specification |
| Number of Channels |
16 |
| Resolution |
12-bit |
| Maximum Sample Rate |
2.058 GSPS |
| RF Input Frequency |
Up to 4 GHz |
| Noise Spectral Density |
Excellent |
| Digital Down Converters |
Integrated (programmable) |
RF-DAC Specifications
| Parameter |
Specification |
| Number of Channels |
16 |
| Resolution |
14-bit |
| Maximum Sample Rate |
6.554 GSPS |
| Digital Up Converters |
Integrated (programmable) |
| NCO |
Numerically Controlled Oscillator included |
| Dual-Band Support |
Yes |
Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
930,300 |
| CLB Flip-Flops |
850,560 |
| CLB LUTs |
425,280 |
| Distributed RAM (Mb) |
9.0 |
| Block RAM (Mb) |
22.5 |
| UltraRAM (Mb) |
38.0 |
| DSP Slices |
4,272 |
| Total Internal Memory |
60+ MB |
High-Speed Connectivity Options
The XCZU29DR-2FFVF1760I provides extensive high-speed serial connectivity options for modern communication systems.
Transceiver Specifications
| Transceiver Type |
Quantity |
Max Data Rate |
| GTY Transceivers |
16 |
Up to 32.75 Gb/s |
| PS-GTR Transceivers |
4 |
Up to 6 Gb/s |
Supported Protocols
| Interface |
Support |
| PCIe |
Gen1/Gen2/Gen3/Gen4 |
| 100G Ethernet |
Yes |
| 150G Interlaken |
Yes |
| USB 3.0 |
Yes |
| SATA 3.1 |
Yes |
| DisplayPort 1.2a |
Yes |
| SGMII |
Yes |
XCZU29DR-2FFVF1760I Package Information
| Parameter |
Specification |
| Package Code |
FFVF1760 |
| Package Type |
Flip-Chip BGA |
| Ball Count |
1760 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
42.5mm × 42.5mm |
| Moisture Sensitivity Level |
MSL-3 |
| Packaging |
Tray |
XCZU29DR-2FFVF1760I Ordering Information
Understanding the part number breakdown helps engineers select the correct variant for their application requirements.
| Code |
Meaning |
| XC |
Commercial/Standard |
| ZU29DR |
Zynq UltraScale+ RFSoC, 29DR variant |
| -2 |
Speed Grade (-2 = High Performance) |
| FF |
Flip-Chip package |
| VF |
Lead-free (RoHS compliant) |
| 1760 |
Pin count |
| I |
Industrial temperature range |
Target Applications for XCZU29DR-2FFVF1760I
The XCZU29DR-2FFVF1760I is optimized for demanding RF and signal processing applications across multiple industries.
Wireless Communications
- 5G Massive MIMO base stations
- Small cell and macro cell infrastructure
- LTE/LTE-Advanced systems
- Wireless backhaul equipment
Defense and Aerospace
- Phased array radar systems
- Electronic warfare (EW) systems
- Software-defined radio (SDR)
- SIGINT and COMINT platforms
Cable Infrastructure
- DOCSIS 3.1 cable modem termination systems
- Remote PHY devices
- Distributed access architectures
Test and Measurement
- High-speed data acquisition systems
- RF signal analyzers
- Arbitrary waveform generators
Development Tools and Software Support
AMD provides comprehensive development tools and IP cores to accelerate XCZU29DR-2FFVF1760I-based designs.
Software Tools
| Tool |
Purpose |
| Vivado Design Suite |
RTL design, synthesis, implementation |
| Vitis Unified Platform |
Software development, acceleration |
| PetaLinux |
Embedded Linux development |
| Model Composer |
Model-based design |
Available IP Cores
| IP Core |
Function |
| RF Data Converter IP |
ADC/DAC configuration and control |
| SD-FEC IP |
Forward error correction |
| Zynq MPSoC IP |
Processing system integration |
| AXI Infrastructure |
System interconnect |
XCZU29DR-2FFVF1760I vs Similar RFSoC Devices
| Parameter |
XCZU29DR |
XCZU28DR |
XCZU49DR |
| Logic Cells |
930,300 |
930,300 |
930,300 |
| RF-ADC Channels |
16 |
8 |
16 |
| RF-DAC Channels |
16 |
8 |
16 |
| GTY Transceivers |
16 |
8 |
16 |
| SD-FEC Blocks |
Yes |
Yes |
Yes |
| Package Options |
1760 FCBGA |
1156/1517 FCBGA |
1760 FCBGA |
Why Choose the XCZU29DR-2FFVF1760I?
The XCZU29DR-2FFVF1760I offers several advantages for system designers requiring high-performance RF signal processing capabilities.
Reduced System Complexity
By integrating RF data converters directly into the SoC, the XCZU29DR-2FFVF1760I eliminates the need for separate ADC/DAC chips, reducing board space, power consumption, and design complexity.
Exceptional Performance
The -2 speed grade provides the highest performance levels, with industrial temperature qualification ensuring reliable operation in demanding environments from -40°C to +100°C.
Future-Proof Architecture
Support for emerging standards including 5G NR, advanced MIMO configurations, and next-generation protocols ensures long product lifecycles for infrastructure equipment.
Comprehensive Ecosystem
AMD’s mature development tools, extensive IP portfolio, and worldwide support network accelerate time-to-market for complex RF system designs.
Conclusion
The XCZU29DR-2FFVF1760I represents the pinnacle of programmable RF SoC technology, combining advanced processing capabilities, high-speed data converters, and flexible programmable logic in a single integrated device. Whether designing 5G wireless infrastructure, radar systems, or software-defined radio platforms, this Zynq UltraScale+ RFSoC delivers the performance, integration, and reliability required for next-generation RF systems.
