The XCZU27DR-1FFVG1517E is a high-performance Xilinx FPGA from AMD’s Zynq UltraScale+ RFSoC family. This advanced System-on-Chip (SoC) integrates RF data converters, programmable logic, and a powerful processing system into a single chip, making it ideal for 5G wireless, software-defined radio, and cable infrastructure applications.
XCZU27DR-1FFVG1517E Overview and Key Features
The XCZU27DR-1FFVG1517E belongs to the first generation of Zynq UltraScale+ RFSoC devices. It combines a feature-rich 64-bit quad-core ARM Cortex-A53 processor with dual-core ARM Cortex-R5F real-time processing capabilities. This makes it one of the most versatile RF-class adaptive computing platforms available for direct RF sampling applications.
Why Choose the XCZU27DR-1FFVG1517E?
Engineers and system designers select this device for several compelling reasons:
- Complete software-defined radio implementation on a single chip
- Direct RF sampling eliminates the need for external analog components
- Supports all frequency bands below 6GHz for 5G network deployment
- Reduces system power consumption by up to 50-75% compared to discrete solutions
- Significantly smaller PCB footprint than multi-chip implementations
XCZU27DR-1FFVG1517E Technical Specifications
| Parameter |
Specification |
| Part Number |
XCZU27DR-1FFVG1517E |
| Manufacturer |
AMD (formerly Xilinx) |
| Family |
Zynq UltraScale+ RFSoC Gen 1 |
| Logic Cells |
930,300 |
| CLB Flip-Flops |
425,280 |
| CLB LUTs |
53,160 |
| DSP Slices |
4,272 |
| Block RAM (Kb) |
1,080 |
| Ultra RAM (Mb) |
80 |
| Speed Grade |
-1 (Commercial) |
| Operating Voltage |
0.85V |
| Process Technology |
16nm FinFET+ |
| Package |
1517-Ball FFVG BGA |
| Temperature Range |
0°C to +100°C (Commercial) |
| RoHS Compliance |
Yes |
RF Data Converter Specifications for XCZU27DR-1FFVG1517E
The integrated RF analog-to-digital and digital-to-analog converters are key differentiators of this device.
RF-ADC Specifications
| Feature |
Value |
| Number of RF-ADCs |
8 Channels |
| Maximum Sample Rate |
4 GSPS |
| Resolution |
14-bit |
| Analog Bandwidth |
Up to 6 GHz |
| Digital Down Converters (DDC) |
Integrated |
RF-DAC Specifications
| Feature |
Value |
| Number of RF-DACs |
8 Channels |
| Maximum Sample Rate |
6.5 GSPS |
| Resolution |
14-bit |
| Analog Bandwidth |
Up to 6 GHz |
| Digital Up Converters (DUC) |
Integrated |
Processing System Architecture
The XCZU27DR-1FFVG1517E features a comprehensive dual-processor architecture designed for demanding real-time applications.
Application Processing Unit (APU)
| Component |
Specification |
| Processor |
Quad-core ARM Cortex-A53 |
| Architecture |
64-bit ARMv8 |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| L2 Cache |
1MB Shared |
| Features |
NEON SIMD, Single/Double Precision FPU, CoreSight Debug |
Real-Time Processing Unit (RPU)
| Component |
Specification |
| Processor |
Dual-core ARM Cortex-R5F |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| TCM |
256KB Tightly Coupled Memory |
| Features |
Single/Double Precision FPU, CoreSight Debug |
Memory and I/O Capabilities
On-Chip Memory Resources
| Memory Type |
Capacity |
| On-Chip Memory |
256KB with ECC |
| Block RAM |
38.0 Mb |
| Ultra RAM |
22.5 Mb |
| Distributed RAM |
Available via LUTs |
External Memory Support
The XCZU27DR-1FFVG1517E supports multiple external memory interfaces:
- DDR4 SDRAM
- DDR3 / DDR3L SDRAM
- LPDDR4
- LPDDR3
- Quad-SPI Flash
- NAND Flash
- eMMC
High-Speed Connectivity
| Interface |
Specification |
| GTY Transceivers |
16 Channels |
| Transceiver Speed |
Up to 16.3 Gbps |
| PCIe Support |
Gen3/Gen4 x16 (2 Controllers) |
| 100G Ethernet MACs |
2 |
| HP I/O Banks |
8 |
| HD I/O Banks |
6 |
| Maximum User I/O |
299 HP + 48 HD |
XCZU27DR-1FFVG1517E Applications
This RFSoC device excels in applications requiring high-performance RF signal processing combined with embedded processing capabilities.
Primary Application Areas
5G Wireless Infrastructure
The XCZU27DR-1FFVG1517E supports all sub-6GHz frequency bands essential for 5G network deployment. Its integrated RF data converters enable direct RF-to-digital conversion, eliminating external analog components and reducing system complexity.
Software-Defined Radio (SDR)
Engineers can implement complete SDR systems on a single chip, from RF sampling to baseband processing. The device supports CPRI and gigabit Ethernet-to-RF interfaces natively.
Cable Infrastructure (DOCSIS)
The soft-decision forward error correction (SD-FEC) blocks support LDPC encode/decode and Turbo decode for DOCSIS applications, enabling high-throughput cable modem termination systems.
Aerospace and Defense
Military radar systems, electronic warfare, and satellite communications benefit from the device’s high-bandwidth RF converters and flexible programmable logic.
Test and Measurement
The device’s multi-channel RF capability makes it ideal for RF test equipment, spectrum analyzers, and signal generators.
Part Number Breakdown for XCZU27DR-1FFVG1517E
Understanding the part number helps identify device specifications:
| Code |
Meaning |
| XC |
Xilinx Commercial Grade |
| ZU27 |
Zynq UltraScale+ Device Size |
| DR |
RFSoC (Data Converter) Variant |
| -1 |
Speed Grade 1 (Commercial) |
| FF |
Flip-Chip Package |
| VG |
Pb-Free Ball Grid Array |
| 1517 |
1517 Ball Count |
| E |
Extended Commercial Temperature |
Development Tools and Software Support
The XCZU27DR-1FFVG1517E is fully supported by AMD’s comprehensive development ecosystem.
Design Software
- Vivado Design Suite: Complete FPGA design environment with synthesis, implementation, and debug
- Vitis Unified Platform: Software development for embedded processors
- Vitis Model Composer: Model-based design for algorithm development
- PetaLinux Tools: Embedded Linux development
IP Cores and Reference Designs
AMD provides extensive IP support including RF Data Converter IP, DSP IP blocks, and reference designs for wireless and wired communications applications.
Package Information for XCZU27DR-1FFVG1517E
| Specification |
Value |
| Package Type |
FFVG1517 (Flip-Chip Fine-pitch BGA) |
| Ball Count |
1,517 |
| Ball Pitch |
1.0mm |
| Package Dimensions |
40mm x 40mm |
| Footprint Compatible |
Other G1517 UltraScale+ devices |
Ordering Information
When ordering the XCZU27DR-1FFVG1517E, verify the complete part number matches your application requirements for temperature range and speed grade. Contact authorized distributors for current pricing and availability.
Related Part Numbers
| Part Number |
Description |
| XCZU27DR-1FFVG1517I |
Industrial Temperature Range (-40°C to +100°C) |
| XCZU27DR-2FFVG1517E |
Speed Grade 2 (Higher Performance) |
| XCZU27DR-2FFVG1517I |
Speed Grade 2, Industrial Temperature |
| XCZU27DR-1FFVE1156E |
Smaller Package (1156-Ball) |
Conclusion
The XCZU27DR-1FFVG1517E represents a significant advancement in RF system integration. By combining 8 RF-ADC channels, 8 RF-DAC channels, 930K logic cells, and a powerful dual-processor system on a single 16nm chip, it enables engineers to design smaller, lower-power, and more cost-effective wireless and cable infrastructure solutions.
Whether developing 5G base stations, software-defined radios, or advanced test equipment, the XCZU27DR-1FFVG1517E provides the performance and integration necessary for next-generation RF systems.
