The XCZU21DR-2FFVD1156E is a high-performance Xilinx FPGA from the AMD Zynq UltraScale+ RFSoC family, designed for advanced RF applications including 5G wireless infrastructure, software-defined radio (SDR), and phased array radar systems. This powerful System-on-Chip (SoC) integrates direct RF-sampling data converters with a programmable logic fabric and a multi-core ARM processing system on a single 16nm device.
XCZU21DR-2FFVD1156E Key Features Overview
The XCZU21DR-2FFVD1156E combines FPGA flexibility with integrated RF analog-to-digital and digital-to-analog converters, eliminating the need for external data converter components. This integration reduces power consumption, simplifies PCB design, and enables complete software-defined radio solutions on a single chip.
Core Architecture Highlights
- Zynq UltraScale+ RFSoC Family with direct RF-sampling technology
- 16nm FinFET+ process technology for optimal performance and power efficiency
- 930,300 logic cells for complex digital signal processing
- Integrated RF data converters with up to 5 GS/s ADC and 10 GS/s DAC sampling rates
- Quad-core ARM Cortex-A53 application processor unit (APU)
- Dual-core ARM Cortex-R5 real-time processor unit (RPU)
XCZU21DR-2FFVD1156E Technical Specifications
General Device Information
| Parameter |
Specification |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCZU21DR-2FFVD1156E |
| Product Family |
Zynq UltraScale+ RFSoC |
| Process Technology |
16nm FinFET+ |
| Logic Cells |
930,300 |
| Speed Grade |
-2 (Highest Performance) |
| Temperature Grade |
Extended Commercial (0°C to 100°C) |
| Core Voltage (VCCINT) |
0.85V |
| RoHS Status |
Lead-Free / RoHS Compliant |
Package Information
| Parameter |
Specification |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
1156 Pins |
| Package Code |
FFVD1156 |
| Package Dimensions |
35mm × 35mm |
| Ball Pitch |
1.0mm |
| Mounting Type |
Surface Mount (SMD/SMT) |
XCZU21DR-2FFVD1156E RF Data Converter Specifications
The integrated RF data converter subsystem is the defining feature of the Zynq UltraScale+ RFSoC family, enabling direct RF-sampling without external converter ICs.
RF-ADC (Analog-to-Digital Converter) Specifications
| Parameter |
Specification |
| Resolution |
14-bit |
| Maximum Sample Rate |
Up to 5 GS/s |
| Analog Bandwidth |
Up to 6 GHz |
| Number of Channels |
Multiple (configurable) |
| Configuration Options |
Real data or I/Q pairs |
| Digital Down Converters (DDC) |
Integrated with programmable decimation |
RF-DAC (Digital-to-Analog Converter) Specifications
| Parameter |
Specification |
| Resolution |
14-bit |
| Maximum Sample Rate |
Up to 10 GS/s |
| Analog Bandwidth |
Up to 6 GHz |
| Number of Channels |
Multiple (configurable) |
| Configuration Options |
Real data or I/Q pairs |
| Digital Up Converters (DUC) |
Integrated with programmable interpolation |
RF Signal Processing Features
| Feature |
Description |
| NCO (Numerically Controlled Oscillator) |
Built-in for frequency translation |
| Complex Mixer |
Integrated for I/Q signal processing |
| Dual-Band Operation |
DDC/DUC support for multi-band applications |
| Noise Spectral Density |
Excellent performance for high-fidelity RF |
XCZU21DR-2FFVD1156E Processing System Specifications
ARM Processor Configuration
| Processor Unit |
Specification |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53 (64-bit) |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5 |
| APU Clock Speed |
Up to 1.5 GHz |
| L1 Cache (APU) |
32 KB I-Cache + 32 KB D-Cache per core |
| L2 Cache (APU) |
1 MB shared |
| Memory Support |
DDR4, LPDDR4 |
Processing System Peripherals
| Interface |
Capability |
| DDR Memory Controller |
Multi-protocol dynamic memory |
| DMA Controller |
High-bandwidth data transfer |
| NAND Flash Controller |
External storage support |
| SD/eMMC Controller |
Removable/embedded storage |
| Quad SPI Controller |
Configuration and boot memory |
| MIO Pins |
Up to 78 multiplexed I/O pins |
XCZU21DR-2FFVD1156E Programmable Logic Resources
FPGA Fabric Specifications
| Resource |
Quantity/Specification |
| System Logic Cells |
930,300 |
| CLB Flip-Flops |
Available for sequential logic |
| CLB LUTs |
Available for combinational logic |
| Block RAM |
Integrated memory blocks |
| UltraRAM |
High-density on-chip memory |
| DSP Slices |
High-performance DSP48E2 blocks |
Connectivity Features
| Feature |
Specification |
| PCI Express |
Gen3 x16 compliant (PCIE4 blocks) |
| GTY Transceivers |
High-speed serial I/O |
| Maximum Transceiver Speed |
Up to 32.75 Gb/s |
| HP I/O Banks |
High-performance I/O with DCI |
XCZU21DR-2FFVD1156E Soft-Decision FEC (SD-FEC)
The XCZU21DR-2FFVD1156E includes hardened Soft-Decision Forward Error Correction blocks for reliable data transmission in wireless and cable applications.
SD-FEC Capabilities
| Feature |
Specification |
| LDPC Encode/Decode |
Low-Density Parity Check support |
| Turbo Decode |
For LTE and legacy wireless |
| Throughput |
Over 1 Gb/s performance |
| Standards Support |
5G NR, LTE, DOCSIS 3.1, Backhaul |
| Power Efficiency |
80% more efficient than soft implementations |
XCZU21DR-2FFVD1156E Security Features
Configuration and Encryption
| Feature |
Description |
| Secure Boot |
Via Configuration Security Unit (CSU) |
| AES Encryption |
256-bit AES-GCM |
| Authentication |
SHA-384 cryptographic hash |
| Post-Boot Encryption |
User encryption available after boot |
| BBRAM |
Battery-backed key storage |
| eFUSE |
One-time programmable security keys |
XCZU21DR-2FFVD1156E Target Applications
Primary Application Markets
| Application |
Use Case |
| 5G Wireless Infrastructure |
Massive MIMO, macro/small cells, mmWave 5G NR |
| Software-Defined Radio (SDR) |
Multi-band, multi-mode radio platforms |
| Phased Array Radar |
Aerospace and defense radar systems |
| Test & Measurement |
RF signal analysis and generation |
| Satellite Communications |
Ground station and terminal equipment |
| Cable Access (DOCSIS) |
Remote PHY nodes, DOCSIS 3.1 |
| Wireless Backhaul |
Point-to-point microwave links |
Industry Benefits
- 50% reduced power compared to discrete multi-component solutions
- Smaller footprint through monolithic integration
- Simplified BOM with fewer external components
- Faster design cycles with integrated RF signal chain
- Future-proof flexibility for evolving wireless standards
XCZU21DR-2FFVD1156E Part Number Decoder
Understanding the Xilinx part numbering convention:
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial |
| ZU21 |
ZU21 |
Zynq UltraScale+ Device Size |
| DR |
DR |
RFSoC with Data Converters |
| -2 |
-2 |
Speed Grade (Highest Performance) |
| FF |
FF |
Flip-Chip Package |
| VD |
VD |
Package Variant |
| 1156 |
1156 |
Pin Count |
| E |
E |
Extended Commercial Temperature |
Related Part Numbers
| Part Number |
Variation |
| XCZU21DR-2FFVD1156I |
Industrial Temperature Grade (-40°C to 100°C) |
| XCZU21DR-1FFVD1156E |
Speed Grade -1 (Standard Performance) |
| XCZU21DR-2FFVD1156I |
Industrial, Speed Grade -2 |
XCZU21DR-2FFVD1156E Development Tools
Recommended Software
| Tool |
Purpose |
| Vivado Design Suite |
FPGA design, synthesis, and implementation |
| Vitis Unified Software Platform |
Embedded software development |
| PetaLinux Tools |
Linux OS development for Zynq |
| RF Data Converter IP |
Configuration of ADC/DAC subsystem |
| RF Analyzer Tool |
Debug and performance evaluation |
Evaluation Platforms
- ZCU111 Evaluation Kit – Reference platform for Gen 1/2 RFSoC development
- ZCU208/ZCU216 Evaluation Boards – Advanced development platforms
XCZU21DR-2FFVD1156E Ordering Information
| Parameter |
Details |
| Full Part Number |
XCZU21DR-2FFVD1156E |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Status |
Active |
| Lead Time |
Contact distributor for availability |
| Minimum Order Quantity |
Varies by distributor |
| Packaging |
Tray |
Why Choose the XCZU21DR-2FFVD1156E?
The XCZU21DR-2FFVD1156E Zynq UltraScale+ RFSoC represents a breakthrough in RF system integration. By combining high-speed RF data converters, powerful ARM processors, and flexible FPGA fabric on a single chip, this device enables:
- Complete SDR Implementation – From antenna to digital baseband on one device
- Reduced System Complexity – Eliminates external ADCs, DACs, and JESD204B interfaces
- Lower Power Consumption – Integrated architecture consumes less power than discrete solutions
- Accelerated Time-to-Market – Unified platform simplifies hardware and software development
- Scalable Performance – 930,300 logic cells support complex signal processing algorithms
For engineers developing next-generation 5G wireless systems, radar platforms, or advanced RF applications, the XCZU21DR-2FFVD1156E delivers the integration, performance, and flexibility required to meet demanding system requirements.
